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WO2009031387A1 - ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) - Google Patents

ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) Download PDF

Info

Publication number
WO2009031387A1
WO2009031387A1 PCT/JP2008/064455 JP2008064455W WO2009031387A1 WO 2009031387 A1 WO2009031387 A1 WO 2009031387A1 JP 2008064455 W JP2008064455 W JP 2008064455W WO 2009031387 A1 WO2009031387 A1 WO 2009031387A1
Authority
WO
WIPO (PCT)
Prior art keywords
sib
free layer
tunnel junction
junction element
ferromagnetic tunnel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/064455
Other languages
English (en)
Japanese (ja)
Inventor
Takuya Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Holdings Ltd filed Critical Fuji Electric Holdings Ltd
Publication of WO2009031387A1 publication Critical patent/WO2009031387A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/3204Exchange coupling of amorphous multilayers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
PCT/JP2008/064455 2007-09-06 2008-08-12 ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) Ceased WO2009031387A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-231507 2007-09-06
JP2007231507 2007-09-06

Publications (1)

Publication Number Publication Date
WO2009031387A1 true WO2009031387A1 (fr) 2009-03-12

Family

ID=40428709

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064455 Ceased WO2009031387A1 (fr) 2007-09-06 2008-08-12 ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni)

Country Status (1)

Country Link
WO (1) WO2009031387A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013197402A (ja) * 2012-03-21 2013-09-30 Toshiba Corp 磁気メモリ及びその製造方法
US20150380639A1 (en) * 2010-12-03 2015-12-31 Iii Holdings 1, Llc Memory circuit and method of forming the same using reduced mask steps
WO2021262239A1 (fr) 2020-06-26 2021-12-30 Sandisk Technologies Llc Dispositifs de mémoire liés et leurs procédés de fabrication
US11903218B2 (en) 2020-06-26 2024-02-13 Sandisk Technologies Llc Bonded memory devices and methods of making the same
US12362301B2 (en) 2020-06-26 2025-07-15 SanDisk Technologies, Inc. Bonded memory devices and methods of making the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022599A (ja) * 2002-06-12 2004-01-22 Sony Corp 磁気抵抗効果素子及び磁気メモリ装置、磁気抵抗効果素子及び磁気メモリ装置の製造方法
JP2004179187A (ja) * 2002-11-22 2004-06-24 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
JP2005101216A (ja) * 2003-09-24 2005-04-14 Toshiba Corp スピントンネルトランジスタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022599A (ja) * 2002-06-12 2004-01-22 Sony Corp 磁気抵抗効果素子及び磁気メモリ装置、磁気抵抗効果素子及び磁気メモリ装置の製造方法
JP2004179187A (ja) * 2002-11-22 2004-06-24 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
JP2005101216A (ja) * 2003-09-24 2005-04-14 Toshiba Corp スピントンネルトランジスタ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JUN HAYAKAWA ET AL.: "Dependance of giant magnetoresistance of sputtered CoFeB/MgO/CoFeB magnetic tunnel junctions on MgO barrier thickness and annealing temperature", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 44, no. 19, 22 April 2005 (2005-04-22), pages L587 - L589 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150380639A1 (en) * 2010-12-03 2015-12-31 Iii Holdings 1, Llc Memory circuit and method of forming the same using reduced mask steps
US10043969B2 (en) * 2010-12-03 2018-08-07 Iii Holdings 1, Llc Memory circuit and method of forming the same using reduced mask steps
JP2013197402A (ja) * 2012-03-21 2013-09-30 Toshiba Corp 磁気メモリ及びその製造方法
US8841139B2 (en) 2012-03-21 2014-09-23 Kabushiki Kaisha Toshiba Magnetic memory and method of fabricating the same
WO2021262239A1 (fr) 2020-06-26 2021-12-30 Sandisk Technologies Llc Dispositifs de mémoire liés et leurs procédés de fabrication
US11903218B2 (en) 2020-06-26 2024-02-13 Sandisk Technologies Llc Bonded memory devices and methods of making the same
EP4055629A4 (fr) * 2020-06-26 2024-02-14 SanDisk Technologies LLC Dispositifs de mémoire liés et leurs procédés de fabrication
US12362301B2 (en) 2020-06-26 2025-07-15 SanDisk Technologies, Inc. Bonded memory devices and methods of making the same

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