WO2009031387A1 - ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) - Google Patents
ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) Download PDFInfo
- Publication number
- WO2009031387A1 WO2009031387A1 PCT/JP2008/064455 JP2008064455W WO2009031387A1 WO 2009031387 A1 WO2009031387 A1 WO 2009031387A1 JP 2008064455 W JP2008064455 W JP 2008064455W WO 2009031387 A1 WO2009031387 A1 WO 2009031387A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sib
- free layer
- tunnel junction
- junction element
- ferromagnetic tunnel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3254—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/3204—Exchange coupling of amorphous multilayers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-231507 | 2007-09-06 | ||
| JP2007231507 | 2007-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009031387A1 true WO2009031387A1 (fr) | 2009-03-12 |
Family
ID=40428709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/064455 Ceased WO2009031387A1 (fr) | 2007-09-06 | 2008-08-12 | ÉLÉMENT DE JONCTION TUNNEL FERROMAGNÉTIQUE AYANT UNE COUCHE LIBRE DE SiB (Fe, Co, Ni) |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2009031387A1 (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013197402A (ja) * | 2012-03-21 | 2013-09-30 | Toshiba Corp | 磁気メモリ及びその製造方法 |
| US20150380639A1 (en) * | 2010-12-03 | 2015-12-31 | Iii Holdings 1, Llc | Memory circuit and method of forming the same using reduced mask steps |
| WO2021262239A1 (fr) | 2020-06-26 | 2021-12-30 | Sandisk Technologies Llc | Dispositifs de mémoire liés et leurs procédés de fabrication |
| US11903218B2 (en) | 2020-06-26 | 2024-02-13 | Sandisk Technologies Llc | Bonded memory devices and methods of making the same |
| US12362301B2 (en) | 2020-06-26 | 2025-07-15 | SanDisk Technologies, Inc. | Bonded memory devices and methods of making the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004022599A (ja) * | 2002-06-12 | 2004-01-22 | Sony Corp | 磁気抵抗効果素子及び磁気メモリ装置、磁気抵抗効果素子及び磁気メモリ装置の製造方法 |
| JP2004179187A (ja) * | 2002-11-22 | 2004-06-24 | Toshiba Corp | 磁気抵抗効果素子および磁気メモリ |
| JP2005101216A (ja) * | 2003-09-24 | 2005-04-14 | Toshiba Corp | スピントンネルトランジスタ |
-
2008
- 2008-08-12 WO PCT/JP2008/064455 patent/WO2009031387A1/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004022599A (ja) * | 2002-06-12 | 2004-01-22 | Sony Corp | 磁気抵抗効果素子及び磁気メモリ装置、磁気抵抗効果素子及び磁気メモリ装置の製造方法 |
| JP2004179187A (ja) * | 2002-11-22 | 2004-06-24 | Toshiba Corp | 磁気抵抗効果素子および磁気メモリ |
| JP2005101216A (ja) * | 2003-09-24 | 2005-04-14 | Toshiba Corp | スピントンネルトランジスタ |
Non-Patent Citations (1)
| Title |
|---|
| JUN HAYAKAWA ET AL.: "Dependance of giant magnetoresistance of sputtered CoFeB/MgO/CoFeB magnetic tunnel junctions on MgO barrier thickness and annealing temperature", JAPANESE JOURNAL OF APPLIED PHYSICS, vol. 44, no. 19, 22 April 2005 (2005-04-22), pages L587 - L589 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150380639A1 (en) * | 2010-12-03 | 2015-12-31 | Iii Holdings 1, Llc | Memory circuit and method of forming the same using reduced mask steps |
| US10043969B2 (en) * | 2010-12-03 | 2018-08-07 | Iii Holdings 1, Llc | Memory circuit and method of forming the same using reduced mask steps |
| JP2013197402A (ja) * | 2012-03-21 | 2013-09-30 | Toshiba Corp | 磁気メモリ及びその製造方法 |
| US8841139B2 (en) | 2012-03-21 | 2014-09-23 | Kabushiki Kaisha Toshiba | Magnetic memory and method of fabricating the same |
| WO2021262239A1 (fr) | 2020-06-26 | 2021-12-30 | Sandisk Technologies Llc | Dispositifs de mémoire liés et leurs procédés de fabrication |
| US11903218B2 (en) | 2020-06-26 | 2024-02-13 | Sandisk Technologies Llc | Bonded memory devices and methods of making the same |
| EP4055629A4 (fr) * | 2020-06-26 | 2024-02-14 | SanDisk Technologies LLC | Dispositifs de mémoire liés et leurs procédés de fabrication |
| US12362301B2 (en) | 2020-06-26 | 2025-07-15 | SanDisk Technologies, Inc. | Bonded memory devices and methods of making the same |
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