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WO2009019968A1 - 多層ポリイミドフィルム、積層板および金属張積層板 - Google Patents

多層ポリイミドフィルム、積層板および金属張積層板 Download PDF

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Publication number
WO2009019968A1
WO2009019968A1 PCT/JP2008/063018 JP2008063018W WO2009019968A1 WO 2009019968 A1 WO2009019968 A1 WO 2009019968A1 JP 2008063018 W JP2008063018 W JP 2008063018W WO 2009019968 A1 WO2009019968 A1 WO 2009019968A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide film
laminate
film
polyimide
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063018
Other languages
English (en)
French (fr)
Inventor
Masayoshi Shimizu
Hisayasu Kaneshiro
Shogo Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Priority to JP2009526380A priority Critical patent/JPWO2009019968A1/ja
Priority to US12/671,719 priority patent/US8993108B2/en
Priority to CN200880025458A priority patent/CN101754856A/zh
Publication of WO2009019968A1 publication Critical patent/WO2009019968A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

　本発明は、高い柔軟性および寸法安定性を有する、フレキシブルプリント配線板等に好適なポリイミドフィルム、並びにそれを用いた積層板および金属張積層板を提供することを目的とし、コア層とフィルム両面に露出するクラッド層を含む多層構造を有するポリイミドフィルムであって、コア層は１００～２００°Cの平均線膨張係数が５～２０ｐｐｍ／°Cである非熱可塑性ポリイミドであり、クラッド層はピール強度が３Ｎ／ｃｍ以下であるポリイミドであって、フィルム全体の１００～２００°Cの平均線膨張係数が９～３０ｐｐｍ／°Cであり、前記コア層の平均弾性率（ａ）とクラッド層の平均弾性率（ｂ）に以下の関係式（１）：ａ＞ｂが成り立つことを特徴とする多層ポリイミドフィルムに関する。                                                                                     
PCT/JP2008/063018 2007-08-03 2008-07-18 多層ポリイミドフィルム、積層板および金属張積層板 Ceased WO2009019968A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009526380A JPWO2009019968A1 (ja) 2007-08-03 2008-07-18 多層ポリイミドフィルム、積層板および金属張積層板
US12/671,719 US8993108B2 (en) 2007-08-03 2008-07-18 Multilayer polyimide film, laminate, and metal-clad laminate
CN200880025458A CN101754856A (zh) 2007-08-03 2008-07-18 多层聚酰亚胺膜、层叠板以及覆金属层叠板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-203329 2007-08-03
JP2007203329 2007-08-03

Publications (1)

Publication Number Publication Date
WO2009019968A1 true WO2009019968A1 (ja) 2009-02-12

Family

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PCT/JP2008/063018 Ceased WO2009019968A1 (ja) 2007-08-03 2008-07-18 多層ポリイミドフィルム、積層板および金属張積層板

Country Status (6)

Country Link
US (1) US8993108B2 (ja)
JP (1) JPWO2009019968A1 (ja)
KR (1) KR101550005B1 (ja)
CN (2) CN103589356B (ja)
TW (1) TWI417194B (ja)
WO (1) WO2009019968A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010115797A (ja) * 2008-11-11 2010-05-27 Kaneka Corp 多層ポリイミドフィルム
WO2012081763A1 (ko) * 2010-12-16 2012-06-21 에스케이씨코오롱피아이주식회사 폴리이미드 필름
JP2012158149A (ja) * 2011-02-02 2012-08-23 Kaneka Corp ポリイミド系多層フィルムの製造方法
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
JP2015212090A (ja) * 2010-01-18 2015-11-26 株式会社カネカ 多層ポリイミドフィルム及びそれを用いたフレキシブル金属張積層板
WO2022102450A1 (ja) * 2020-11-10 2022-05-19 東洋紡株式会社 無色多層ポリイミドフィルム、積層体、フレキシブル電子デバイスの製造方法

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JP6026346B2 (ja) * 2013-03-06 2016-11-16 日東電工株式会社 位置センサ
JP2014197364A (ja) * 2013-03-07 2014-10-16 日東電工株式会社 情報表示システム
KR20140122207A (ko) * 2013-04-09 2014-10-17 주식회사 엘지화학 적층체 및 이를 이용하여 제조된 기판을 포함하는 소자
TWI503228B (zh) 2013-12-05 2015-10-11 Taimide Technology Inc 低介電常數之多層聚醯亞胺膜、其疊合體及其製備方法
KR102421570B1 (ko) * 2015-10-02 2022-07-15 에스케이이노베이션 주식회사 폴리머 필름의 제조방법
KR102541317B1 (ko) 2016-08-29 2023-06-09 삼성전자주식회사 커버레이를 포함하는 리지드-플렉스 기판
CN107216819B (zh) * 2017-06-01 2020-07-03 京东方科技集团股份有限公司 一种胶膜及其制备方法、柔性显示模组
KR101966958B1 (ko) * 2018-09-07 2019-04-09 (주)아이피아이테크 반도체 패키지용 폴리이미드 필름
KR20230019064A (ko) * 2020-05-29 2023-02-07 도요보 가부시키가이샤 폴리이미드 필름 및 그 제조 방법

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JP2005026542A (ja) * 2003-07-04 2005-01-27 Toray Ind Inc プリント回路用基板およびそれを用いたプリント回路基板
JP2006192800A (ja) * 2005-01-14 2006-07-27 Kaneka Corp 多層押出ポリイミドフィルムおよびその利用

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JP2003127275A (ja) * 2001-10-23 2003-05-08 Ube Ind Ltd 銅張積層基板
JP2005026542A (ja) * 2003-07-04 2005-01-27 Toray Ind Inc プリント回路用基板およびそれを用いたプリント回路基板
JP2006192800A (ja) * 2005-01-14 2006-07-27 Kaneka Corp 多層押出ポリイミドフィルムおよびその利用

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010115797A (ja) * 2008-11-11 2010-05-27 Kaneka Corp 多層ポリイミドフィルム
JP2015212090A (ja) * 2010-01-18 2015-11-26 株式会社カネカ 多層ポリイミドフィルム及びそれを用いたフレキシブル金属張積層板
CN105437656A (zh) * 2010-01-18 2016-03-30 株式会社钟化 多层聚酰亚胺膜及使用有该多层聚酰亚胺膜的柔性金属箔积层板
WO2012081763A1 (ko) * 2010-12-16 2012-06-21 에스케이씨코오롱피아이주식회사 폴리이미드 필름
JP2012158149A (ja) * 2011-02-02 2012-08-23 Kaneka Corp ポリイミド系多層フィルムの製造方法
JP2014058620A (ja) * 2012-09-18 2014-04-03 Du Pont-Toray Co Ltd タブレット端末向けｃｏｆ用基板
WO2022102450A1 (ja) * 2020-11-10 2022-05-19 東洋紡株式会社 無色多層ポリイミドフィルム、積層体、フレキシブル電子デバイスの製造方法

Also Published As

Publication number Publication date
KR20100041852A (ko) 2010-04-22
CN101754856A (zh) 2010-06-23
US20110033682A1 (en) 2011-02-10
JPWO2009019968A1 (ja) 2010-10-28
CN103589356A (zh) 2014-02-19
CN103589356B (zh) 2016-01-20
KR101550005B1 (ko) 2015-09-03
TWI417194B (zh) 2013-12-01
TW200916318A (en) 2009-04-16
US8993108B2 (en) 2015-03-31

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