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WO2009008471A1 - 誘電層付銅箔 - Google Patents

誘電層付銅箔 Download PDF

Info

Publication number
WO2009008471A1
WO2009008471A1 PCT/JP2008/062466 JP2008062466W WO2009008471A1 WO 2009008471 A1 WO2009008471 A1 WO 2009008471A1 JP 2008062466 W JP2008062466 W JP 2008062466W WO 2009008471 A1 WO2009008471 A1 WO 2009008471A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper foil
dielectric layer
layer
resin
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062466
Other languages
English (en)
French (fr)
Inventor
Yoshinori Kanao
Tetsuro Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2008534806A priority Critical patent/JPWO2009008471A1/ja
Publication of WO2009008471A1 publication Critical patent/WO2009008471A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　内層コア材の内層回路表面と誘電層との密着性を向上させ、低い誘電正接を備えるキャパシタ回路層を形成するための誘電層付銅箔を提供することを目的とする。この目的を達成するため、回路上面と基材表面とが略同一の平面内に位置するよう回路を基材樹脂内に埋設配置した埋設回路付プリント配線板の表面に張り合わせてキャパシタ回路層を形成するための誘電層付銅箔で上記目的を達成するため、当該誘電層付銅箔１は、銅箔２の片面に誘電体粉末３を含有する半硬化樹脂で形成した誘電層４を備えるものであり、当該誘電層は、エポキシ樹脂、活性エステル樹脂、ポリビニルアセタール樹脂、硬化促進剤を含む樹脂組成物に誘電体粉末を分散含有させ半硬化状態とした誘電体粉末含有樹脂層であることを特徴としたプリント配線板製造用の誘電層付銅箔を採用する。
PCT/JP2008/062466 2007-07-10 2008-07-10 誘電層付銅箔 Ceased WO2009008471A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008534806A JPWO2009008471A1 (ja) 2007-07-10 2008-07-10 誘電層付銅箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-180820 2007-07-10
JP2007180820 2007-07-10

Publications (1)

Publication Number Publication Date
WO2009008471A1 true WO2009008471A1 (ja) 2009-01-15

Family

ID=40228642

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062466 Ceased WO2009008471A1 (ja) 2007-07-10 2008-07-10 誘電層付銅箔

Country Status (3)

Country Link
JP (1) JPWO2009008471A1 (ja)
TW (1) TW200915932A (ja)
WO (1) WO2009008471A1 (ja)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
JP2018502438A (ja) * 2014-10-15 2018-01-25 ロジャーズ コーポレーション 磁気誘電体基材、回路材料、及びそれらを有するアセンブリ
WO2018168718A1 (ja) * 2017-03-14 2018-09-20 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
WO2019150994A1 (ja) * 2018-02-01 2019-08-08 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US11419210B2 (en) 2012-04-27 2022-08-16 Mitsui Mining & Smelting Co., Ltd. Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2023189300A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャパシタ内蔵型プリント配線板及び多層プリント配線板の製造方法
US12363826B2 (en) 2018-07-18 2025-07-15 Resonac Corporation Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI470197B (zh) 2012-12-20 2015-01-21 Ind Tech Res Inst 電容式剪力感測器及其製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940933A (ja) * 1995-07-26 1997-02-10 Toshiba Chem Corp 銅箔用接着剤
JP2004210941A (ja) * 2002-12-27 2004-07-29 Tdk Corp 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06240213A (ja) * 1993-02-19 1994-08-30 Mitsui Mining & Smelting Co Ltd 接着剤塗布銅箔及びそれを用いた銅張積層板
JP4618662B2 (ja) * 2002-03-07 2011-01-26 Ｄｉｃ株式会社 エポキシ樹脂組成物、その予備硬化物及び硬化物
WO2006016586A1 (ja) * 2004-08-10 2006-02-16 Mitsui Mining & Smelting Co., Ltd. 多層プリント配線板の製造方法及びその製造方法で得られた多層プリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940933A (ja) * 1995-07-26 1997-02-10 Toshiba Chem Corp 銅箔用接着剤
JP2004210941A (ja) * 2002-12-27 2004-07-29 Tdk Corp 樹脂組成物、樹脂硬化物、シート状樹脂硬化物及び積層体

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012214602A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 金属張積層板の製造方法
US11419210B2 (en) 2012-04-27 2022-08-16 Mitsui Mining & Smelting Co., Ltd. Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
JP2018502438A (ja) * 2014-10-15 2018-01-25 ロジャーズ コーポレーション 磁気誘電体基材、回路材料、及びそれらを有するアセンブリ
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US9839124B2 (en) 2015-02-06 2017-12-05 Jx Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
JP7013444B2 (ja) 2017-03-14 2022-01-31 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
KR20190122644A (ko) 2017-03-14 2019-10-30 미쓰이금속광업주식회사 수지 조성물, 수지를 구비한 구리박, 유전체층, 동장 적층판, 캐패시터 소자 및 캐패시터 내장 프린트 배선판
JPWO2018168718A1 (ja) * 2017-03-14 2020-01-16 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US11310910B2 (en) 2017-03-14 2022-04-19 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
WO2018168718A1 (ja) * 2017-03-14 2018-09-20 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JPWO2019150994A1 (ja) * 2018-02-01 2020-04-02 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
KR20200116450A (ko) 2018-02-01 2020-10-12 미쓰이금속광업주식회사 수지 조성물, 수지를 구비하는 구리박, 유전체층, 동장 적층판, 커패시터 소자 및 커패시터 내장 프린트 배선판
WO2019150994A1 (ja) * 2018-02-01 2019-08-08 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JP2022058356A (ja) * 2018-02-01 2022-04-12 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
JP7061632B2 (ja) 2018-02-01 2022-04-28 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US12297354B2 (en) 2018-02-01 2025-05-13 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
US12363826B2 (en) 2018-07-18 2025-07-15 Resonac Corporation Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate
WO2023189300A1 (ja) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 キャパシタ内蔵型プリント配線板及び多層プリント配線板の製造方法

Also Published As

Publication number Publication date
JPWO2009008471A1 (ja) 2010-09-09
TW200915932A (en) 2009-04-01

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