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WO2009008124A1 - ウエーハ熱処理用治具およびこれを備えた縦型熱処理用ボート - Google Patents

ウエーハ熱処理用治具およびこれを備えた縦型熱処理用ボート Download PDF

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Publication number
WO2009008124A1
WO2009008124A1 PCT/JP2008/001443 JP2008001443W WO2009008124A1 WO 2009008124 A1 WO2009008124 A1 WO 2009008124A1 JP 2008001443 W JP2008001443 W JP 2008001443W WO 2009008124 A1 WO2009008124 A1 WO 2009008124A1
Authority
WO
WIPO (PCT)
Prior art keywords
jig
heat treatment
wafer
silicon wafer
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001443
Other languages
English (en)
French (fr)
Inventor
Michihiro Mizuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of WO2009008124A1 publication Critical patent/WO2009008124A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　本発明は、熱処理するときに半導体シリコンウエーハを水平に載置して支持する板状のウエーハ熱処理用治具であって、前記ウエーハ熱処理用治具は、中央部を貫通する穴が形成されたドーナツ型であり、前記半導体シリコンウエーハを載置する面には、切れ目なくフルリング状に突出して、載置される半導体シリコンウエーハを支持するリング状突起が形成されており、該リング状突起は、同じ高さの突起が同心円状に３本以上形成されているものであることを特徴とするウエーハ熱処理用治具である。これにより、縦型熱処理炉により半導体シリコンウエーハを熱処理する際、スリップ転位が発生するのを抑制することができるウエーハ熱処理用治具、およびこれを備えた縦型熱処理用ボートが提供される。
PCT/JP2008/001443 2007-07-11 2008-06-06 ウエーハ熱処理用治具およびこれを備えた縦型熱処理用ボート Ceased WO2009008124A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-182507 2007-07-11
JP2007182507A JP5130808B2 (ja) 2007-07-11 2007-07-11 ウエーハ熱処理用治具およびこれを備えた縦型熱処理用ボート

Publications (1)

Publication Number Publication Date
WO2009008124A1 true WO2009008124A1 (ja) 2009-01-15

Family

ID=40228318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001443 Ceased WO2009008124A1 (ja) 2007-07-11 2008-06-06 ウエーハ熱処理用治具およびこれを備えた縦型熱処理用ボート

Country Status (3)

Country Link
JP (1) JP5130808B2 (ja)
TW (1) TW200919554A (ja)
WO (1) WO2009008124A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010229448A (ja) * 2009-03-26 2010-10-14 Honda Motor Co Ltd 金属リングの熱処理治具
US8420554B2 (en) 2010-05-03 2013-04-16 Memc Electronic Materials, Inc. Wafer support ring
CN114438600A (zh) * 2020-11-06 2022-05-06 长鑫存储技术有限公司 晶舟结构和具有其的晶舟组件和扩散炉
CN118610131B (zh) * 2024-08-08 2024-11-12 武汉新芯集成电路股份有限公司 半导体制程设备及半导体制程设备的保养方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102225A (ja) * 1986-10-20 1988-05-07 Deisuko Haitetsuku:Kk 縦形半導体熱処理装置のウエ−ハボ−ト
JP2000021796A (ja) * 1998-06-23 2000-01-21 Samsung Electron Co Ltd 半導体ウェ―ハボ―ト
JP2001060559A (ja) * 1999-08-20 2001-03-06 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用保持具および熱処理方法
JP2002033284A (ja) * 2000-07-14 2002-01-31 Mitsui Eng & Shipbuild Co Ltd 縦型ｃｖｄ用ウェハホルダー
JP2003037112A (ja) * 2001-07-23 2003-02-07 Sumitomo Mitsubishi Silicon Corp 半導体シリコン基板の熱処理治具
WO2006035879A1 (ja) * 2004-09-30 2006-04-06 Hitachi Kokusai Electric Inc. 熱処理装置及び基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102225A (ja) * 1986-10-20 1988-05-07 Deisuko Haitetsuku:Kk 縦形半導体熱処理装置のウエ−ハボ−ト
JP2000021796A (ja) * 1998-06-23 2000-01-21 Samsung Electron Co Ltd 半導体ウェ―ハボ―ト
JP2001060559A (ja) * 1999-08-20 2001-03-06 Toshiba Ceramics Co Ltd 半導体ウェーハ熱処理用保持具および熱処理方法
JP2002033284A (ja) * 2000-07-14 2002-01-31 Mitsui Eng & Shipbuild Co Ltd 縦型ｃｖｄ用ウェハホルダー
JP2003037112A (ja) * 2001-07-23 2003-02-07 Sumitomo Mitsubishi Silicon Corp 半導体シリコン基板の熱処理治具
WO2006035879A1 (ja) * 2004-09-30 2006-04-06 Hitachi Kokusai Electric Inc. 熱処理装置及び基板の製造方法

Also Published As

Publication number Publication date
JP5130808B2 (ja) 2013-01-30
JP2009021368A (ja) 2009-01-29
TW200919554A (en) 2009-05-01

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