[go: up one dir, main page]

WO2009008151A1 - 半導体装置及び半導体装置の特性の調整方法 - Google Patents

半導体装置及び半導体装置の特性の調整方法 Download PDF

Info

Publication number
WO2009008151A1
WO2009008151A1 PCT/JP2008/001798 JP2008001798W WO2009008151A1 WO 2009008151 A1 WO2009008151 A1 WO 2009008151A1 JP 2008001798 W JP2008001798 W JP 2008001798W WO 2009008151 A1 WO2009008151 A1 WO 2009008151A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
recording
circuit
process fluctuation
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/001798
Other languages
English (en)
French (fr)
Inventor
Masanori Ito
Hisataka Nakabayashi
Kuniyasu Asano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Publication of WO2009008151A1 publication Critical patent/WO2009008151A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37224—Inspect wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

　製造時のプロセスばらつきを示すプロセスばらつき情報を記録する第１の記録回路（110）を設ける。また、使用条件、外部環境（基板特性）のうちの少なくとも１つのばらつき特性データを記録する第２の記録回路（140）を設ける。そして、制御回路（130）によって、プロセスばらつき情報及び御情報を用いて、外部ＩＦ回路（120）の出力電流能力を制御する。
PCT/JP2008/001798 2007-07-09 2008-07-04 半導体装置及び半導体装置の特性の調整方法 Ceased WO2009008151A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179934 2007-07-09
JP2007-179934 2007-07-09

Publications (1)

Publication Number Publication Date
WO2009008151A1 true WO2009008151A1 (ja) 2009-01-15

Family

ID=40228344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001798 Ceased WO2009008151A1 (ja) 2007-07-09 2008-07-04 半導体装置及び半導体装置の特性の調整方法

Country Status (1)

Country Link
WO (1) WO2009008151A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139101A1 (ja) * 2008-05-13 2009-11-19 パナソニック株式会社 電子機器システム、および半導体集積回路のコントローラ
JP2016025157A (ja) * 2014-07-17 2016-02-08 ラピスセミコンダクタ株式会社 半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697240A (ja) * 1992-07-09 1994-04-08 Advanced Micro Devices Inc ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
JP2003517193A (ja) * 1999-11-18 2003-05-20 ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド 素子およびプロセス近傍特性解析ビヒクルを用いた製品歩留り予測のシステムおよび方法
JP2005032291A (ja) * 2003-07-07 2005-02-03 Renesas Technology Corp 半導体記憶装置
JP2007134701A (ja) * 2005-11-08 2007-05-31 Internatl Business Mach Corp <Ibm> 回路較正情報を記憶する方法および装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697240A (ja) * 1992-07-09 1994-04-08 Advanced Micro Devices Inc ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
JP2003517193A (ja) * 1999-11-18 2003-05-20 ピー・デイ・エフ ソリユーシヨンズ インコーポレイテツド 素子およびプロセス近傍特性解析ビヒクルを用いた製品歩留り予測のシステムおよび方法
JP2005032291A (ja) * 2003-07-07 2005-02-03 Renesas Technology Corp 半導体記憶装置
JP2007134701A (ja) * 2005-11-08 2007-05-31 Internatl Business Mach Corp <Ibm> 回路較正情報を記憶する方法および装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139101A1 (ja) * 2008-05-13 2009-11-19 パナソニック株式会社 電子機器システム、および半導体集積回路のコントローラ
US8072832B2 (en) 2008-05-13 2011-12-06 Panasonic Corporation Electronic equipment system and semiconductor integrated circuit controller
JP2016025157A (ja) * 2014-07-17 2016-02-08 ラピスセミコンダクタ株式会社 半導体装置

Similar Documents

Publication Publication Date Title
US9869714B2 (en) Integrated circuit test temperature control mechanism
WO2007139648A3 (en) Method for improving the precision of a temperature-sensor circuit
US20080024181A1 (en) Semiconductor integrated circuit
EP2570811A3 (en) Droplet actuator devices and methods employing magnetic beads
WO2009013009A3 (en) Self calibrating cable for a high definition digital video interface
TW200727404A (en) Integrated circuit and method for its manufacture
WO2003094582A3 (en) A system and method for manufacturing printed circuit boards employing non-uniformly modified images
WO2007120891A3 (en) Method for forming bit line contacts and bit lines during the formation of a flash memory device, and devices including the bit lines awd bit line contacts
WO2007119200A3 (en) An electro-optic device and a method for producing the same
TW200733309A (en) Semiconductor device having electrode and manufacturing method thereof
WO2004023571A3 (en) Interface electronics for piezoelectric devices
WO2006094241A3 (en) Thin-film device comprising an oxide semiconductor and method of selective annealing a blanket coated oxide semiconductor layer
WO2009008151A1 (ja) 半導体装置及び半導体装置の特性の調整方法
KR101138706B1 (ko) 반도체 회로
EP1422721A3 (en) Magnetic memory device, write current drive circuit, and write current drive method
AU2003259510A1 (en) Method of manufacturing an electronic device comprising a thin film transistor
US20110032036A1 (en) Performance tuning using encoded performance parameter information
JP5101842B2 (ja) 低電圧差動信号受信器及びそれの終端抵抗値の設定方法
WO2007130834A3 (en) Performance testing of disk drives in consumer electronics devices
US8077420B2 (en) Method and apparatus for adaptive control and/or use of a vibration sensor in a hard disk drive
WO2006068730A3 (en) Method and apparatus to manage power consumption of a semiconductor device
US7852098B2 (en) On-die heating circuit and control loop for rapid heating of the die
WO2008087756A1 (ja) 集積回路装置、集積回路装置の動作制御方法、及び集積回路装置の製造方法
EP1630248A4 (en) METHOD AND DEVICE FOR MANUFACTURING THIN FILM
ATE389930T1 (de) Video-daten-signalkorrektur

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08776807

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08776807

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP