[go: up one dir, main page]

WO2009005130A1 - 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法 - Google Patents

接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法 Download PDF

Info

Publication number
WO2009005130A1
WO2009005130A1 PCT/JP2008/062088 JP2008062088W WO2009005130A1 WO 2009005130 A1 WO2009005130 A1 WO 2009005130A1 JP 2008062088 W JP2008062088 W JP 2008062088W WO 2009005130 A1 WO2009005130 A1 WO 2009005130A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
ingredient
thermosetting resin
processes
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062088
Other languages
English (en)
French (fr)
Inventor
Yutaka Gou
Kazuhiro Miyauchi
Takashi Inoue
Atsushi Takahara
Hiroshi Jinnai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009521670A priority Critical patent/JPWO2009005130A1/ja
Priority to CN200880022607A priority patent/CN101688104A/zh
Priority to US12/667,398 priority patent/US20110001251A1/en
Publication of WO2009005130A1 publication Critical patent/WO2009005130A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3209—Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)

Abstract

　５～４０°Cの温度では分離せず均一に相溶混合される熱硬化性樹脂成分Ａと、高分子量成分Ｂと、硬化剤成分Ｃと、を必須成分とした接着剤組成物において、該接着剤組成物が被着体と接触後及び前記熱硬化性樹脂成分Ａが硬化した後に、前記接着剤組成物中で、前記熱硬化性樹脂成分Ａが周囲より濃度の濃い粒子状構造に分離し、且つ前記粒子状構造が、前記接着剤組成物の内部に比べ前記被着体と接する組成物表面近傍に多く形成されるようにして、薄膜接着にも使用でき、耐熱性、耐クラック性、接着性、滲み出しの少ない耐滲出し性に優れた接着剤組成物を提供する。
PCT/JP2008/062088 2007-07-03 2008-07-03 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法 Ceased WO2009005130A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009521670A JPWO2009005130A1 (ja) 2007-07-03 2008-07-03 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法
CN200880022607A CN101688104A (zh) 2007-07-03 2008-07-03 粘接剂组合物、使用了粘接剂组合物的粘接构件、半导体搭载用支承构件、半导体装置以及、其制造方法
US12/667,398 US20110001251A1 (en) 2007-07-03 2008-07-03 Adhesive composition, bonding member using the adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007175087 2007-07-03
JP2007-175087 2007-07-03
JP2007-194498 2007-07-26
JP2007194498 2007-07-26
JP2007-198920 2007-07-31
JP2007198920 2007-07-31
JP2007200686 2007-08-01
JP2007-200686 2007-08-01

Publications (1)

Publication Number Publication Date
WO2009005130A1 true WO2009005130A1 (ja) 2009-01-08

Family

ID=40226171

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062088 Ceased WO2009005130A1 (ja) 2007-07-03 2008-07-03 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法

Country Status (6)

Country Link
US (1) US20110001251A1 (ja)
JP (2) JPWO2009005130A1 (ja)
KR (1) KR20100037045A (ja)
CN (1) CN101688104A (ja)
TW (1) TW200907003A (ja)
WO (1) WO2009005130A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012201846A (ja) * 2011-03-28 2012-10-22 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着テープ
JP2013135204A (ja) * 2011-12-27 2013-07-08 Sumitomo Bakelite Co Ltd 半導体装置
WO2013129078A1 (ja) * 2012-02-28 2013-09-06 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP2016048804A (ja) * 2015-12-04 2016-04-07 住友ベークライト株式会社 半導体装置
WO2024252950A1 (ja) * 2023-06-09 2024-12-12 デクセリアルズ株式会社 接着フィルムの製造方法及び接着フィルム、並びに、構造体の製造方法及び構造体

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
KR102046534B1 (ko) * 2013-01-25 2019-11-19 삼성전자주식회사 기판 가공 방법
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
JP6770432B2 (ja) 2014-01-27 2020-10-14 コーニング インコーポレイテッド 薄いシートの担体との制御された結合のための物品および方法
KR20160145062A (ko) 2014-04-09 2016-12-19 코닝 인코포레이티드 디바이스 변경된 기판 물품 및 제조 방법
EP3159366B1 (en) 2014-06-20 2020-04-08 Mitsubishi Chemical Corporation Polycarbonatediol, method for producing same, and polyurethane produced using same
KR101787205B1 (ko) * 2014-12-05 2017-10-18 주식회사 엘지화학 내열 수지 및 이의 제조방법
KR102573207B1 (ko) 2015-05-19 2023-08-31 코닝 인코포레이티드 시트와 캐리어의 결합을 위한 물품 및 방법
EP3313799B1 (en) 2015-06-26 2022-09-07 Corning Incorporated Methods and articles including a sheet and a carrier
JP6796253B2 (ja) * 2016-04-04 2020-12-09 日立金属株式会社 接着フィルム及びフラット配線材
TWI892429B (zh) 2016-08-30 2025-08-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI821867B (zh) 2016-08-31 2023-11-11 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
CN109299488B (zh) * 2017-07-25 2021-11-02 中国石油天然气股份有限公司 判断环氧套筒修复管道中环氧树脂层粘结情况的方法
CN111372772A (zh) 2017-08-18 2020-07-03 康宁股份有限公司 使用聚阳离子聚合物的临时结合
CN111615567B (zh) 2017-12-15 2023-04-14 康宁股份有限公司 用于处理基板的方法和用于制备包括粘合片材的制品的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220565A (ja) * 1999-06-18 2001-08-14 Hitachi Chem Co Ltd 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2005154687A (ja) * 2003-11-28 2005-06-16 Hitachi Chem Co Ltd 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
EP1586615B1 (en) * 1999-06-18 2007-08-15 Hitachi Chemical Company, Ltd. Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
JP3851767B2 (ja) * 2000-10-16 2006-11-29 ソニーケミカル＆インフォメーションデバイス株式会社 接着フィルム、及び接着フィルムの製造方法
JP2002256235A (ja) * 2001-03-01 2002-09-11 Hitachi Chem Co Ltd 接着シート、半導体装置の製造方法および半導体装置
JP2003147323A (ja) * 2001-11-08 2003-05-21 Hitachi Chem Co Ltd 接着剤組成物、接着フィルム、半導体支持部材、半導体装置およびその製造方法
JP3889700B2 (ja) * 2002-03-13 2007-03-07 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001220565A (ja) * 1999-06-18 2001-08-14 Hitachi Chem Co Ltd 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2005154687A (ja) * 2003-11-28 2005-06-16 Hitachi Chem Co Ltd 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012201846A (ja) * 2011-03-28 2012-10-22 Furukawa Electric Co Ltd:The 半導体ウエハ加工用粘着テープ
JP2013135204A (ja) * 2011-12-27 2013-07-08 Sumitomo Bakelite Co Ltd 半導体装置
WO2013129078A1 (ja) * 2012-02-28 2013-09-06 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP2016048804A (ja) * 2015-12-04 2016-04-07 住友ベークライト株式会社 半導体装置
WO2024252950A1 (ja) * 2023-06-09 2024-12-12 デクセリアルズ株式会社 接着フィルムの製造方法及び接着フィルム、並びに、構造体の製造方法及び構造体

Also Published As

Publication number Publication date
JP2014129544A (ja) 2014-07-10
CN101688104A (zh) 2010-03-31
KR20100037045A (ko) 2010-04-08
TW200907003A (en) 2009-02-16
JPWO2009005130A1 (ja) 2010-08-26
US20110001251A1 (en) 2011-01-06

Similar Documents

Publication Publication Date Title
WO2009005130A1 (ja) 接着剤組成物、接着剤組成物を用いた接着部材、半導体搭載用支持部材、半導体装置とそれらの製造方法
WO2008129590A1 (ja) 半導体用接着フィルム及びこれを用いた半導体装置
TW200738841A (en) Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device using the same
WO2013013986A3 (de) Temporäre verklebung von chemisch ähnlichen substraten
WO2009038020A1 (ja) 電子部品用接着剤組成物およびそれを用いた電子部品用接着剤シート
WO2009117345A3 (en) Adhesive compositions for use in die attach applications
WO2013135378A3 (de) Lamellenpaket und verfahren zu seiner herstellung
WO2009058295A3 (en) Epoxy paste adhesives resistant to wash-off
TW201613760A (en) Composite sheet for resin film formation
TW200940672A (en) Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
WO2009044801A1 (ja) 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置
WO2014145482A3 (en) Bonding adhesive and adhered roofing systems prepared using the same
MY181765A (en) Heat-resistant adhesive sheet for semiconductor testing
WO2007130643A3 (en) Die-on-leadframe (dol) with high voltage isolation
WO2014081652A3 (en) Bonding of composite materials
WO2011090361A3 (ko) 경화성 조성물
WO2017137796A8 (ja) 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム
WO2010099350A3 (en) Low cost bonding technique for integrated circuit chips and pdms structures
EP2154710A3 (en) Substrate joining method and 3-D semiconductor device
PH12014502606A1 (en) Dicing sheet
WO2008146849A1 (ja) 熱剥離型粘着シート
WO2017034645A3 (en) Method of providing an electronic device and electronic device thereof
WO2012173460A3 (ko) 경화성 조성물
WO2009014115A1 (ja) 電子部品用接着剤、半導体チップの積層方法及び半導体装置
JP2010028087A5 (ja)

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880022607.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08777840

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097026981

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2009521670

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 12667398

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08777840

Country of ref document: EP

Kind code of ref document: A1