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WO2009044801A1 - 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置 - Google Patents

接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置 Download PDF

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Publication number
WO2009044801A1
WO2009044801A1 PCT/JP2008/067911 JP2008067911W WO2009044801A1 WO 2009044801 A1 WO2009044801 A1 WO 2009044801A1 JP 2008067911 W JP2008067911 W JP 2008067911W WO 2009044801 A1 WO2009044801 A1 WO 2009044801A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
semiconductor device
electronic component
mounted substrate
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/067911
Other languages
English (en)
French (fr)
Inventor
Kaoru Konno
Hiroki Hayashi
Takashi Kawamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to EP08835881A priority Critical patent/EP2196514B1/en
Priority to US12/680,923 priority patent/US9247652B2/en
Priority to JP2009536080A priority patent/JP5195760B2/ja
Priority to CN2008801097469A priority patent/CN101809107B/zh
Priority to KR1020107006925A priority patent/KR101334429B1/ko
Priority to KR1020127024494A priority patent/KR101397891B1/ko
Publication of WO2009044801A1 publication Critical patent/WO2009044801A1/ja
Anticipated expiration legal-status Critical
Priority to US14/963,292 priority patent/US10504864B2/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/3618—Carboxylic acids or salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J201/00—Adhesives based on unspecified macromolecular compounds
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
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Abstract

　保存安定性を維持しつつ、硬化物が当該部品同士に良好に濡れ広がった状態で金属結合を形成し、接着性、導電性およびを耐ＴＣＴ性あるいは耐高温放置性などの実装信頼性に優れた接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置である。導電粒子（Ａ）及びバインダ成分（Ｂ）を含有する接着剤組成物であって、前記導電粒子（Ａ）が、リフロー温度以上の融点を有し鉛を含有しない金属（ａ１）及びリフロー温度未満の融点を有し鉛を含有しない金属（ａ２）を含み、前記バインダ成分（Ｂ）が、熱硬化性樹脂組成物（ｂ１）及び脂肪族ジヒドロキシカルボン酸（ｂ２）を含むことを特徴とする接着剤組成物。
PCT/JP2008/067911 2007-10-03 2008-10-02 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置 Ceased WO2009044801A1 (ja)

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EP08835881A EP2196514B1 (en) 2007-10-03 2008-10-02 Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
US12/680,923 US9247652B2 (en) 2007-10-03 2008-10-02 Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
JP2009536080A JP5195760B2 (ja) 2007-10-03 2008-10-02 接着剤組成物及びそれを用いた電子部品搭載基板並びに半導体装置
CN2008801097469A CN101809107B (zh) 2007-10-03 2008-10-02 粘接剂组合物、使用其的搭载有电子部件的基板和半导体装置
KR1020107006925A KR101334429B1 (ko) 2007-10-03 2008-10-02 접착제 조성물 및 그것을 이용한 전자부품 탑재 기판 및 반도체장치
KR1020127024494A KR101397891B1 (ko) 2007-10-03 2008-10-02 접착제 조성물 및 그것을 이용한 전자부품 탑재 기판 및 반도체장치
US14/963,292 US10504864B2 (en) 2007-10-03 2015-12-09 Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

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JP2007259739 2007-10-03
JP2007-259739 2007-10-03

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US14/963,292 Division US10504864B2 (en) 2007-10-03 2015-12-09 Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

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JP2014124649A (ja) * 2012-12-25 2014-07-07 Tamura Seisakusho Co Ltd レーザーはんだ付け用はんだ組成物およびそれを用いたプリント配線基板
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JP5912741B2 (ja) * 2012-03-27 2016-04-27 日東電工株式会社 接合シート、電子部品およびその製造方法
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EP2196514A1 (en) 2010-06-16
JPWO2009044801A1 (ja) 2011-02-10
US20100221559A1 (en) 2010-09-02
KR20100050561A (ko) 2010-05-13
US9247652B2 (en) 2016-01-26
CN101809107A (zh) 2010-08-18
EP2196514A4 (en) 2011-11-16
US10504864B2 (en) 2019-12-10
JP5195760B2 (ja) 2013-05-15
TW200927870A (en) 2009-07-01
KR101334429B1 (ko) 2013-11-29
EP2196514B1 (en) 2013-01-23
CN101809107B (zh) 2013-02-06
TWI439524B (zh) 2014-06-01
KR20120113809A (ko) 2012-10-15
KR101397891B1 (ko) 2014-05-20
US20160093584A1 (en) 2016-03-31

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