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WO2009004929A1 - 撮像装置の製造方法、撮像装置及び光学素子 - Google Patents

撮像装置の製造方法、撮像装置及び光学素子 Download PDF

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Publication number
WO2009004929A1
WO2009004929A1 PCT/JP2008/061224 JP2008061224W WO2009004929A1 WO 2009004929 A1 WO2009004929 A1 WO 2009004929A1 JP 2008061224 W JP2008061224 W JP 2008061224W WO 2009004929 A1 WO2009004929 A1 WO 2009004929A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical element
imaging device
substrate
electronic component
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061224
Other languages
English (en)
French (fr)
Inventor
Daisuke Watanabe
Takeshi Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Priority to US12/664,774 priority Critical patent/US20100199491A1/en
Priority to JP2009521576A priority patent/JP5187306B2/ja
Priority to EP08777385A priority patent/EP2166395A1/en
Priority to CN200880020422A priority patent/CN101681010A/zh
Publication of WO2009004929A1 publication Critical patent/WO2009004929A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00807—Producing lenses combined with electronics, e.g. chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

　リフロー処理による光学素子の変形を防止した撮像装置の製造方法は、２３°C、５００Ｈｚの測定条件下で５０～５００００ｍＰａｓの粘度を有する熱硬化性樹脂材料を硬化して光学素子を成形する工程、前記光学素子を電子部品とともに基板上に載置する工程、及び、前記光学素子と、前記電子部品と、前記基板とをリフロー処理に供し、前記光学素子と前記電子部品とを前記基板に実装する工程を有するものである。
PCT/JP2008/061224 2007-07-03 2008-06-19 撮像装置の製造方法、撮像装置及び光学素子 Ceased WO2009004929A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/664,774 US20100199491A1 (en) 2007-07-03 2008-06-19 Manufacturing method of image pick-up device, image pick-up device and optical element
JP2009521576A JP5187306B2 (ja) 2007-07-03 2008-06-19 撮像装置の製造方法、撮像装置及び光学素子
EP08777385A EP2166395A1 (en) 2007-07-03 2008-06-19 Imaging device manufacturing method, imaging device and optical element
CN200880020422A CN101681010A (zh) 2007-07-03 2008-06-19 摄影装置的制造方法、摄影装置以及光学元件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007175152 2007-07-03
JP2007-175152 2007-07-03

Publications (1)

Publication Number Publication Date
WO2009004929A1 true WO2009004929A1 (ja) 2009-01-08

Family

ID=40225980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061224 Ceased WO2009004929A1 (ja) 2007-07-03 2008-06-19 撮像装置の製造方法、撮像装置及び光学素子

Country Status (6)

Country Link
US (1) US20100199491A1 (ja)
EP (1) EP2166395A1 (ja)
JP (1) JP5187306B2 (ja)
KR (1) KR20100028555A (ja)
CN (1) CN101681010A (ja)
WO (1) WO2009004929A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968563A (zh) * 2009-07-27 2011-02-09 昆山钜亮光电科技有限公司 回流焊级堆叠镜头组件
JP2012133237A (ja) * 2010-12-22 2012-07-12 Hitachi Chem Co Ltd 光導波路形成用樹脂組成物及びこれを用いた光導波路形成用樹脂フィルム、並びにこれらを用いた光導波路
JP2013524702A (ja) * 2010-04-01 2013-06-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学モジュール及び支持板を持つ装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5998962B2 (ja) * 2013-01-31 2016-09-28 三菱電機株式会社 半導体光装置
KR20150107991A (ko) * 2014-03-14 2015-09-24 삼성전자주식회사 광학계 고정유닛 및 이를 구비하는 광학 설비
DE202016106444U1 (de) 2016-11-17 2018-02-21 Sick Ag Beleuchtungsvorrichtung zum Erzeugen eines Beleuchtungsmusters in einem Erfassungsbereich
EP3570103B1 (en) * 2018-05-17 2020-07-01 Axis AB Camera arrangement and method for aligning a sensor board and an optics unit
JP2021033170A (ja) * 2019-08-28 2021-03-01 セイコーエプソン株式会社 光学素子、光学素子の製造方法及び表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11160503A (ja) * 1997-11-28 1999-06-18 Shin Etsu Polymer Co Ltd 光学用レンズの製造方法
JP2004004632A (ja) * 2002-03-28 2004-01-08 Teijin Chem Ltd 耐熱光学部品
JP2004117955A (ja) * 2002-09-27 2004-04-15 Nippon Telegr & Teleph Corp <Ntt> マイクロ樹脂レンズの製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY131962A (en) * 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
US7018674B2 (en) * 2001-03-02 2006-03-28 Omron, Corporation Manufacturing methods and apparatuses of an optical device and a reflection plate provided with a resin thin film having a micro-asperity pattern
JP3656640B2 (ja) * 2002-08-28 2005-06-08 セイコーエプソン株式会社 樹脂絶縁層の製造方法、電気光学装置用基板、電気光学装置の製造方法、及び電気光学装置
JP2004144987A (ja) * 2002-10-24 2004-05-20 Fuji Xerox Co Ltd 高分子光導波路の製造方法
WO2004066398A1 (ja) * 2003-01-20 2004-08-05 Sharp Kabushiki Kaisha 光センサフィルタ用の透明樹脂組成物、光センサおよびその製造方法
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
JP2004361692A (ja) * 2003-04-07 2004-12-24 Dow Corning Asia Ltd 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
JP4438355B2 (ja) * 2003-09-01 2010-03-24 オムロン株式会社 マイクロ凹凸パターンを有する樹脂薄膜を備えた光学素子の製造方法
TW200517437A (en) * 2003-10-16 2005-06-01 Nitto Denko Corp Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
JP2005274664A (ja) * 2004-03-23 2005-10-06 Jsr Corp 光導波路形成用感光性樹脂組成物および光導波路
KR20070010126A (ko) * 2004-04-08 2007-01-22 후지필름 홀딩스 가부시끼가이샤 수지로 플라스틱 광섬유를 코팅하기 위한 장치 및 방법
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP4894995B2 (ja) * 2004-10-21 2012-03-14 Ｊｓｒ株式会社 光導波路用感光性樹脂組成物、光導波路及びその製造方法
US20070265381A1 (en) * 2004-11-02 2007-11-15 Masako Kikuchi Thermoplastic Resin Composition and Optical Element Utilizing the Same
KR100835579B1 (ko) * 2005-03-03 2008-06-09 스미도모쥬기가이고교 가부시키가이샤 광학부품의 수지성형방법, 금형장치, 및 게이트 부시
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
TW200728330A (en) * 2005-09-29 2007-08-01 Jsr Corp Radiation sensitive resin composition for optical waveguides, optical waveguide and method for manufacturing optical waveguide
JP4890872B2 (ja) * 2006-01-30 2012-03-07 ルネサスエレクトロニクス株式会社 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
CN101356452B (zh) * 2006-07-25 2011-09-21 日立化成工业株式会社 光学材料用树脂组合物、光学材料用树脂薄膜及光波导
US8287782B2 (en) * 2006-08-08 2012-10-16 Coopervision International Holding Company, Lp Interference fitting polar resin ophthalmic lens molding devices and related methods
EP2067824A1 (en) * 2006-09-29 2009-06-10 Nippon Shokubai Co., Ltd. Curable resin composition, optical material, and method of regulating optical material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11160503A (ja) * 1997-11-28 1999-06-18 Shin Etsu Polymer Co Ltd 光学用レンズの製造方法
JP2004004632A (ja) * 2002-03-28 2004-01-08 Teijin Chem Ltd 耐熱光学部品
JP2004117955A (ja) * 2002-09-27 2004-04-15 Nippon Telegr & Teleph Corp <Ntt> マイクロ樹脂レンズの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968563A (zh) * 2009-07-27 2011-02-09 昆山钜亮光电科技有限公司 回流焊级堆叠镜头组件
JP2013524702A (ja) * 2010-04-01 2013-06-17 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング 光学モジュール及び支持板を持つ装置
US9025061B2 (en) 2010-04-01 2015-05-05 Conti Temic Microelectronic Gmbh Device having an optical module and a supporting plate
JP2012133237A (ja) * 2010-12-22 2012-07-12 Hitachi Chem Co Ltd 光導波路形成用樹脂組成物及びこれを用いた光導波路形成用樹脂フィルム、並びにこれらを用いた光導波路

Also Published As

Publication number Publication date
KR20100028555A (ko) 2010-03-12
US20100199491A1 (en) 2010-08-12
JP5187306B2 (ja) 2013-04-24
JPWO2009004929A1 (ja) 2010-08-26
EP2166395A1 (en) 2010-03-24
CN101681010A (zh) 2010-03-24

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