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WO2009004964A1 - 超音波洗浄装置及び超音波洗浄方法 - Google Patents

超音波洗浄装置及び超音波洗浄方法 Download PDF

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Publication number
WO2009004964A1
WO2009004964A1 PCT/JP2008/061553 JP2008061553W WO2009004964A1 WO 2009004964 A1 WO2009004964 A1 WO 2009004964A1 JP 2008061553 W JP2008061553 W JP 2008061553W WO 2009004964 A1 WO2009004964 A1 WO 2009004964A1
Authority
WO
WIPO (PCT)
Prior art keywords
bath
rinsing
ultrasonic
bottom plate
ultrasonic rinsing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/061553
Other languages
English (en)
French (fr)
Inventor
Susumu Sugiyama
Hiroshi Hasegawa
Yasuhiro Imazeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Publication of WO2009004964A1 publication Critical patent/WO2009004964A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

超音波の高周波化に伴う内槽の板厚を従来のように薄くすることなく、洗浄槽の内槽内における音圧を確保しつつ、超音波の高周波化に対応した超音波洗浄装置及び超音波洗浄方法を提供することすること。 超音波振動を伝達する伝達媒体を貯留するための外槽(5)と、前記外槽(5)の内部に配置され、内部に貯留される洗浄液内に浸漬される前記被洗浄物を、前記伝達媒体を介して伝達される超音波振動により洗浄するための内槽(3)からなると洗浄槽とを備え、前記内槽の底板(3a)は、超音波振動数の2分の1波長(半波長)の整数倍の板厚を有し、前記内槽の底板(3a)と前記外槽の底板(5a)とが平行とならないように前記内槽の底板(3a)を傾斜するように配置する。
PCT/JP2008/061553 2007-06-29 2008-06-25 超音波洗浄装置及び超音波洗浄方法 Ceased WO2009004964A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007173030A JP4533406B2 (ja) 2007-06-29 2007-06-29 超音波洗浄装置及び超音波洗浄方法
JP2007-173030 2007-06-29

Publications (1)

Publication Number Publication Date
WO2009004964A1 true WO2009004964A1 (ja) 2009-01-08

Family

ID=40226011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061553 Ceased WO2009004964A1 (ja) 2007-06-29 2008-06-25 超音波洗浄装置及び超音波洗浄方法

Country Status (3)

Country Link
JP (1) JP4533406B2 (ja)
TW (1) TW200900167A (ja)
WO (1) WO2009004964A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110088631A (zh) * 2016-12-20 2019-08-02 株式会社日立高新技术 超声波清洗器以及使用超声波清洗器的自动分析装置
CN110860521A (zh) * 2019-11-18 2020-03-06 苏州圣典企业管理咨询有限公司 一种封闭式降噪超声波清洗机
CN121017169A (zh) * 2025-10-28 2025-11-28 航菱微(泰州)科技有限公司 一种基于超声波清洗的晶圆清洗装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2315235B1 (en) * 2009-10-21 2019-04-24 IMEC vzw Method and apparatus for cleaning a semiconductor substrate
KR102162067B1 (ko) * 2019-01-04 2020-10-06 에스케이실트론 주식회사 웨이퍼 세정장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03222419A (ja) * 1990-01-29 1991-10-01 Kokusai Denki Erutetsuku:Kk 超音波洗浄装置
JP2004022578A (ja) * 2002-06-12 2004-01-22 Dainippon Screen Mfg Co Ltd 基板処理ユニット検査装置および検査方法
JP2007044662A (ja) * 2005-08-12 2007-02-22 Kaijo Corp 超音波洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03222419A (ja) * 1990-01-29 1991-10-01 Kokusai Denki Erutetsuku:Kk 超音波洗浄装置
JP2004022578A (ja) * 2002-06-12 2004-01-22 Dainippon Screen Mfg Co Ltd 基板処理ユニット検査装置および検査方法
JP2007044662A (ja) * 2005-08-12 2007-02-22 Kaijo Corp 超音波洗浄装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110088631A (zh) * 2016-12-20 2019-08-02 株式会社日立高新技术 超声波清洗器以及使用超声波清洗器的自动分析装置
CN110088631B (zh) * 2016-12-20 2023-02-03 株式会社日立高新技术 超声波清洗器以及使用超声波清洗器的自动分析装置
CN110860521A (zh) * 2019-11-18 2020-03-06 苏州圣典企业管理咨询有限公司 一种封闭式降噪超声波清洗机
CN121017169A (zh) * 2025-10-28 2025-11-28 航菱微(泰州)科技有限公司 一种基于超声波清洗的晶圆清洗装置

Also Published As

Publication number Publication date
JP4533406B2 (ja) 2010-09-01
TW200900167A (en) 2009-01-01
JP2009011879A (ja) 2009-01-22

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