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WO2009083367A1 - Élément de sécurité avec ensemble stratifié - Google Patents

Élément de sécurité avec ensemble stratifié Download PDF

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Publication number
WO2009083367A1
WO2009083367A1 PCT/EP2008/066431 EP2008066431W WO2009083367A1 WO 2009083367 A1 WO2009083367 A1 WO 2009083367A1 EP 2008066431 W EP2008066431 W EP 2008066431W WO 2009083367 A1 WO2009083367 A1 WO 2009083367A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
electrically conductive
conductive structures
component
region
Prior art date
Application number
PCT/EP2008/066431
Other languages
German (de)
English (en)
Inventor
Ottmar MÖLLER
Michael Ostermöller
Jürgen Tann
Thomas Wahl
Original Assignee
Hypercom Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hypercom Gmbh filed Critical Hypercom Gmbh
Publication of WO2009083367A1 publication Critical patent/WO2009083367A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the present invention relates to a security component, which is protected, for example, against manipulation and a keyboard with a component according to the invention.
  • a possible manipulation consists in conventional components in drilling through the housing wall and other structures, the direct contacting of the data-carrying electronics inside the device and the subsequent recording of the data with a transmitter or the reading of the key.
  • a previous possible starting point for preventing manipulations is, for example, the installation of plastic caps with a conductor structure around the component to be protected.
  • the component may be surrounded by a plastic cap, wherein in the plastic cap a conductor pattern is introduced.
  • Another previous approach to preventing tampering is wrapping the component in a foil having a conductor pattern and then casting. After wrapping the component in the film on which a conductive paste is printed, the entire module is filled with a potting compound to prevent unfolding of the film by an attacker.
  • a security component which has a component to be protected against manipulation and a foil with a first region and a second region.
  • the film has a carrier material and, on a surface of the carrier material, electrically conductive structures which extend over both the first region and the second region. Adhesion between the electrically conductive structures and the carrier material is more pronounced in the first region of the film than in the second region of the film.
  • the film covers at least a partial region of the component and is glued in the second region in such a way that adhesive adhesion is stronger than the adhesion between the electrically conductive structures and the carrier material in the second region.
  • the idea of the present invention according to the first aspect is based on a skillful design and attachment of the film to the device such that in an attempt to remove the film, the conductive structures at predetermined predetermined breaking points are irretrievably separated or damaged.
  • the component can be protected against manipulation by triggering or causing an alarm or suitable security measures, such as the deletion of the data, in the event of an interruption of the conductive structures.
  • the film is configured from a carrier material with electrically conductive structures on the surface of the carrier material. At certain points of the film, the adhesion between the carrier material and the electrically conductive structures is weaker than at other locations. That The electrically conductive structures are easier to solve in the areas with less adhesion of the substrate. Now, if the film is glued in these areas with less adhesion, the adhesion between the electrically conductive structures and the splice is higher than the adhesion between the substrate and the electrically conductive structures. Once the film has been brought into position on the component and adhesively bonded, it can no longer be released without the electrically conductive structures being severed or damaged in a predefined region of the film, and this can be detected by an evaluation circuit.
  • the security component may be a security module or secured area of a device, such as a keyboard or a chip card reading unit, and may contain both the component to be protected and the protective device in the form of a foil.
  • the device to be protected may be an electronic element unit for processing, forwarding or storing data to be protected. It may, for example, be configured as a security module, also known as HSM (hardware security module), a keyboard in which input data, such as PINs (Personal Identification Number), further processed, encrypted and / or forwarded.
  • the device may be a chip contacting unit in a smart card reader, which may be used, for example, for chip-based payment methods.
  • the housing of such a device and thus of course the device itself can be protected.
  • the film can partially cover the component or completely, possibly even several times wrap.
  • the film may consist of a carrier material and electrically conductive structures.
  • the carrier material can be, for example, of plastic such as polyester, polyethermide or polyimide or a combination thereof, and the film thickness can be at least 50 ⁇ m.
  • the carrier material may be transparent or preferably opaque.
  • the electrically conductive structures may be electrically conductive elements deposited on the foil, such as metals. The metals can be deposited during production, for example, locally or partially.
  • the carrier material Before the electrically conductive structures are vapor-deposited, the carrier material can be deliberately soiled at certain predefined locations, for example pretreated with a fatty substance or a lacquer, so that in these pretreated areas the adhesion of the subsequently applied conductive structures in comparison to non-pretreated regions of the film is reduced.
  • subregions of the carrier material can be pretreated with adhesion-promoting substances, for example by plasma pretreatment, also called corona processes, whereas other subregions remain untreated, so that adhesion between carrier material and subsequently applied conductive structures is higher in the pretreated regions than in the untreated ones. This can be inserted at exactly predefined locations of the film breaking points.
  • Protective lacquer and / or adhesive can be applied to the electrically conductive structures in a further working step.
  • a protective varnish it is possible to use the electric to hide conductive structures in such a way that they can no longer be recognized by a potential attacker. This can reduce the risk that the attacker can drill through between the electrically conductive structures.
  • An adhesive that can be applied to the electrically conductive structures may be selected so that the predetermined breaking points are torn off when the film is peeled off and the conductive connection on the film is interrupted.
  • a treatment of the film with special paints can enable a weldability of several film layers.
  • the protective lacquer can serve for the insulation between the different foil layers with the electrically conductive structures.
  • the electrically conductive structures adhere more to the object at the location of the predefined predetermined breaking points than to the carrier material.
  • the article may be, for example, the component, the structure surrounding the component or a further region of the film used (hereinafter also referred to as partial region of the film).
  • the film may be self-adhesive in certain areas or over the entire surface.
  • an adhesive such as epoxy adhesive can be used for bonding. If the film is removed again after bonding from the splice, the electrically conductive structures are cut or destroyed as possible at the predetermined breaking points, so that no more current can flow through them. In this way, a manipulation can be detected by a connected evaluation circuit, which may possibly also be arranged inside the component, and appropriate measures, such as the triggering of an alarm or the deletion of all data can be initiated.
  • the area of the film in which the adhesion between the carrier material and the electrically conductive structures is lower, ie in which the predetermined breaking points are located, is in the Also referred to as the second area below. Accordingly, the higher adhesion region is also referred to as the first region of the film.
  • An area can have a coherent area or several subareas. The subregions of an area can be connected or even spatially separated.
  • the electrically conductive structures may include metals such as copper, aluminum, silver or gold.
  • the electrically conductive structures may further be configured as conductor tracks and arranged in a meandering pattern, i. the electrically conductive structures can be designed as closely adjacent, possibly multi-angled conductor tracks. They may cover sections or, preferably, the entire surface of the film and be designed as a continuous, uninterrupted Porterzug. To further increase safety, a plurality of mutually electrically insulated conductor tracks can be applied to the foil surface. As a result, electrical bridging by an attacker is made considerably more difficult. An additional contribution to safety can be made by treating the electrically conductive structures on the surface of the film with paints. The lacquers can ensure that the electrically conductive structures on the surface facing away from the carrier material are not conductive and thus can not be bridged.
  • the safety component has electronics.
  • the electronics are configured and connected to the electrically conductive structures in such a way that the electronics can detect a break in a connection between parts of the electrically conductive structures arranged in the first region of the film and parts of the electrically conductive structures arranged in the second region of the film.
  • the electronics can supply the electric current for the electrically conductive structures in the film and, on the other hand, the integrity of the electrically conductive structures can be achieved, for example by tapping a voltage at two spatially separated locations check electrically conductive structures.
  • the points at which the voltage is tapped can lie in the first and second regions of the film.
  • a first point in the first region may lie before a predetermined breaking point and a second point in another partial region of the first region after the predetermined breaking point.
  • the electrically conductive structures are formed as an RFID tag.
  • the security component has a reading device.
  • the reading device is arranged on the component to be protected.
  • the RFID tag can be used for non-contact transmission of information or identification and localization by means of high-frequency electromagnetic waves.
  • the RFID tag can be configured as an active or passive transponder, which receives incoming signals and automatically answers.
  • the RFID tag has a connected energy source, such as a battery, which provides it with energy and enables the emission of signals.
  • the RFID tag obtains the required energy from received radio waves.
  • the radio waves can be transmitted by a reading device, which can also detect the signals generated by the RFID tag.
  • the RFID tag and the reader may include an antenna for transmitting and receiving signals.
  • the RFID tag can change the electromagnetic field sent by a reading device and / or completely or partially reflect or absorb it.
  • the reading device can be configured as part of the component to be protected or attached from outside to the component to be protected.
  • the reading device may be connected to a power supply or be powered by batteries with energy.
  • the reading device can emit and receive signals, for example in the radio-wave range, preferably in the kilo-to-gigahertz range.
  • the reading device may comprise a chip with software that controls the process of sending and receiving signals.
  • the reading device may have interfaces to other computer systems and databases which are responsible for the evaluation of the received signals. Alternatively, the evaluation or the verification of the identification of the RFID tag can be carried out directly in the reading device.
  • the use of the conductive structures as an RFID tag results in improvements in the safety of safety components:
  • the procurement of replacement housings is rated, for example, in the current safety requirements with little effort.
  • a potential attacker could completely destroy a housing of, for example, a security module at an ATM, manipulate and re-install the electronics into another housing.
  • the film provided according to the invention on the housing the housing can be personalized and clearly assigned to the electronics of the component located in the interior.
  • the film can be arranged as an RFID tag on the housing such that it acts like a seal at the point where the housing comes into contact with the component.
  • the conductive structures on the foil can be destroyed and an alarm triggered.
  • the RFID tag may have a unique number or a unique identification signal.
  • the structure of the electrically conductive structures and thus the number or the signal is damaged or destroyed.
  • the film is self-adhesive.
  • the film can be self-adhesive on both sides or on one side.
  • the film may be self-adhesive on the side on which the electrically conductive structures are arranged. In this way, manufacturing costs and labor costs can be reduced because the operation of applying an adhesive or casting the film is eliminated.
  • the film is adhesively bonded in its second region to the component to be protected.
  • the film has a lower adhesion between film and the electrically conductive structures than in the first region.
  • the film can thus be glued to the component at the location of the predetermined breaking points.
  • the adhesion between the electrically conductive structures and the component is greater at the predetermined breaking points than the adhesion between the foil and the electrically conductive structures.
  • a first subregion of the second region of the film is adhesively bonded to a second subregion of the second region of the film.
  • the second area ie the area in which the predetermined breaking points are located, can be subdivided into a plurality of partial areas. These subareas may be interrelated or spatially separated. If, for example, the entire component is to be enveloped by the film, then it may be useful to bond the film to itself. This can by adhering the film to itself in the areas where the predetermined breaking points are located. This results in the advantage that, on the one hand, the component does not come into contact with adhesive substances which could possibly damage fragile structures. On the other hand, the security is additionally increased because, in the case of removal of the film, the electrically conductive structures are damaged at several points, that is to say in several subregions of the second area.
  • the electrically conductive structures are formed as elongate conductor tracks.
  • the elongate conductor tracks are arranged meander-shaped and cover at least the first area of the film substantially completely.
  • the electrically conductive structures may be formed as elongated, possibly several times angled and as closely as possible lying interconnects. By this meandering arrangement of the electrically conductive structures a higher security is ensured. In an attempt to contact the device electrically, for example, by drilling through the film, the conductor tracks are separated with high probability, since an attacker has a very small chance to drill through between the interconnects due to the small distances between the structures and angled arrangement of the interconnects.
  • the electrically conductive structures are vapor-deposited metals.
  • feature widths of the electrically conductive structures are smaller than 500 ⁇ m, preferably smaller than 300 ⁇ m, and more preferably smaller than 200 ⁇ m.
  • the electrically conductive structures may include metals such as aluminum, copper, silver or gold. These metals can allow very small feature widths of, for example, 200 .mu.m and also very small distances between the structures of, for example, 200 .mu.m during manufacture. This contributes to the safety of the safety component, because the smaller the distance between the electrically conductive elements can be realized, the lower the likelihood that an attacker can pierce the film without damaging the electrically conductive structures.
  • Fig. 1 shows a side view of a film of a security component according to the invention.
  • FIG. 2 shows a plan view of a detail of a film of a safety component according to the invention.
  • 3 shows a top view of a further exemplary embodiment of a film of a security component according to the invention.
  • FIG. 4 shows a side view of a security component according to the invention.
  • FIG. 5 shows a side view of a further exemplary embodiment of a safety component according to the invention.
  • FIG. 6 shows a detailed side view of a further exemplary embodiment of a safety component according to the invention.
  • FIG. 7 shows a further detailed side view of a further exemplary embodiment of a safety component according to the invention.
  • the film 3 has a carrier material 11, which may be electrically insulating, and electrically conductive structures 7, such as metals, such as aluminum or copper.
  • the film 3 is subdivided into at least two regions: in a first region 23, the electrically conductive structures 7 are applied directly to the film surface; in a second region 9, the carrier material is pretreated with a surface coating 10, such as a lacquer or a fatty substance, so that the adhesion between the carrier material 11 and the electrically conductive structures 7 is reduced during vapor deposition of the electrically conductive structures 7.
  • the regions with lower adhesion between the electrically conductive structures 7 and the carrier material 11 are also referred to below as predetermined breaking points.
  • Possible dimensions of the film structure which are preferred for certain applications are: a minimum film thickness a of 50 ⁇ m; a maximum thickness b of the electrically conductive structures 7 of 0.8 ⁇ m when using copper and 0.25 ⁇ m when using aluminum as the electrically conductive structure 7; a minimum width c of the electrically conductive structures 7 of 150 ⁇ m; a minimum distance d between the electrically conductive structures 7 of 150 ⁇ m; and a minimum pitch e of the electrically conductive structures 7 of 300 ⁇ m. All values given are approximate values and merely indicate a preferred order of magnitude.
  • FIG. 2 shows a schematic plan view of a detail of a film 3 of a security component 1 according to the invention.
  • the regions 9, 23 may be contiguous regions or spatially separated subregions 9a, 9b.
  • the electrically conductive structures 7 are designed as elongated, closely adjacent conductor tracks.
  • the predetermined breaking points are arranged in an electrically insulated manner on parallel conductor tracks in different partial areas 9a, 9b of the second area 9 of the foil 3.
  • Fig. 3 is a plan view of another Ausftihrungsbeispiels a film 3 of a security component according to the invention 1 described.
  • the first region 23 and the second region 9 are arranged such that the predetermined breaking points of the second region 9 are at the edge of the foil 3 and the first region 23 with the higher adhesion between the electrically conductive structures 7 and the carrier material 11 is surrounded by the second region 9.
  • the film 3 can be glued securely to the edge with itself or a component 5.
  • the electrically conductive structures 7 have flat contact points to a To provide connecting element 21 for connecting a power supply or electronics 25.
  • FIG. 4 shows a schematic side view of a safety component 1 according to the invention.
  • the component 5 is completely surrounded by the film 3 in this embodiment.
  • the film 3 is glued to one or more splices 19, for example along a line with itself.
  • At the splice 19 is in each case the second region 9 with the predetermined breaking points.
  • the component 5 is largely enveloped by the first region 23 of the film 3.
  • FIG. 5 shows a side view of a further exemplary embodiment of a safety component 1 according to the invention.
  • Several components 5 are arranged on a printed circuit board 13.
  • the film 3 does not enclose the entire module here, but protects only part of the printed circuit board 13 and the components 5 arranged thereon. Regions of the printed circuit board 13 remain accessible.
  • the film 3 is glued to one side of the circuit board 13 to the splices 19.
  • the second region 9 is in each case with the predetermined breaking points at the splices 19.
  • the first region 23 covers the components to be protected 5 and a part of the circuit board thirteenth
  • FIG. 6 shows a schematic detailed side view of a further exemplary embodiment of a safety component 1 according to the invention.
  • the safety component 1 has a component 5 and the film 3.
  • the component has several components: a security area 17, also called HSM (hardware security module), and a printed circuit board 13.
  • the security area 17 is used inter alia in security keyboards for secure data entry, encryption and transmission.
  • the circuit board 13 may be, for example, a circuit board that can be used for keyboards.
  • the film 3 encloses the security area 17 and partly the printed circuit board 13 arranged on the security area 17.
  • the film 3 is glued at several points: on the one hand in an upper region of the printed circuit board 13; On the other hand, the film 3 is glued to overlap itself with the splices 19 with itself.
  • the splices 19 and the predetermined breaking points of the film 3 may preferably coincide. If the predetermined breaking points are at the location of the splices 19, when the film 3 is removed, the electrically conductive structures 7 at the predetermined breaking points are interrupted and any possible manipulation can be detected.
  • sensors 15 which can register data transmitted from the outside and transmit it to the printed circuit board 13 and the safety area 17.
  • these sensors 15 may be configured as contacts to be closed by actuated keys or electromagnetically sensitive elements.
  • FIG. 7 shows a further detailed schematic side view of a further exemplary embodiment of a safety component 1 according to the invention.
  • the safety component 1 in FIG. 7 is designed in analogy to the exemplary embodiment of the safety component in FIG. 6. It also has a component 5 having several parts.
  • the component 5 has a printed circuit board 13 and a safety area 17.
  • the security area 17 is surrounded in FIG. 6 by three sides by a housing 27.
  • the housing 27 offers additional protection against attacks and is enveloped by the film 3. Further protection of the security component 1 results from the wrapping of the entire component 5 with the film 3. In the exemplary embodiment in FIG. 7, no regions of the printed circuit board 13 are left exposed, so that the component is completely enveloped.
  • recesses 31 may be left for the printed circuit board 13 in the enclosure, for example, if the dimensions of the circuit board 13 exceed the dimensions of the security area 17.
  • the film 3, which is glued to the housing 27, may be the same film that covers the component 5.
  • several separate foils 3 can be used.
  • a plurality of films 3 can be joined by means of printing with paint and subsequent thermal welding and as multi-layer film 3 with increased security level for covering the device 5 are used.
  • the film 3 is bonded to the component 5 at a plurality of splices 19. Some splices 19 are located on the surface of the circuit board 13 and further splices 19 are disposed on the housing 27. The splices 19 may extend into the interior of the housing 27. Also in the embodiment in Fig. 7, the predetermined breaking points preferably coincide with the splices 19.
  • the electrically conductive elements 7 on the film 3 are connected via a connecting element 21, which may be configured for example as a connector, with an electronics 25.
  • the electronics 25 may be arranged on the component 5 and preferably in the interior of the security area 17. The arrangement in the interior of the security area 17, the electronics 25 may be protected from possible attacks.
  • the electrically conductive elements 7 may be connected to a voltage source, for example, so that current can flow through them. If the structure of the electrically conductive elements 7 interrupted or destroyed, for example, by peeling off the film 3, so can also be detected by the electronics 25, possibly by tapping the voltage at different points of the film 3, a manipulation.
  • the electronics 25 can also be designed to trigger an alarm or to cause the deletion of data in the event of a manipulation.
  • HSM security area

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Storage Device Security (AREA)
  • Burglar Alarm Systems (AREA)

Abstract

L'invention concerne un élément de sécurité 1, et un clavier pourvu d'un élément de sécurité 1 selon l'invention. L'élément de sécurité 1 présente un composant 5 à protéger des manipulations, et un film 3 ayant une première zone 23 et une deuxième zone 9. Le film 3 présente des structures électriquement conductrices 7 sur un matériau support 11. Le film 3 est ici configuré et disposé sur le composant 5 de telle sorte qu'en cas de tentative de retirer le film 3, les structures conductrices 7 sont séparées de manière irrécupérable en des points prédéfinis de rupture théorique dans la deuxième zone 9 du film 3.
PCT/EP2008/066431 2007-12-27 2008-11-28 Élément de sécurité avec ensemble stratifié WO2009083367A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007062751.5 2007-12-27
DE200710062751 DE102007062751A1 (de) 2007-12-27 2007-12-27 Sicherheitsbauteil mit Folienanordnung

Publications (1)

Publication Number Publication Date
WO2009083367A1 true WO2009083367A1 (fr) 2009-07-09

Family

ID=40473719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/066431 WO2009083367A1 (fr) 2007-12-27 2008-11-28 Élément de sécurité avec ensemble stratifié

Country Status (2)

Country Link
DE (1) DE102007062751A1 (fr)
WO (1) WO2009083367A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002077939A1 (fr) * 2000-11-16 2002-10-03 Mikoh Corporation Etiquette de securite d'identification par radiofrequence a capacite de depistage

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911911B2 (en) * 2002-08-22 2005-06-28 Schreiner Gmbh & Co., Kg Label having an electronic circuit
KR100751983B1 (ko) * 2003-05-26 2007-08-28 오므론 가부시키가이샤 정보 캐리어, 정보 기록 매체, 센서, 물품 관리 방법
DE102005062799A1 (de) * 2005-12-28 2007-07-12 El-Me Ag Elektronik-Sicherheits-Modul

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002077939A1 (fr) * 2000-11-16 2002-10-03 Mikoh Corporation Etiquette de securite d'identification par radiofrequence a capacite de depistage

Also Published As

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