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WO2009082864A1 - Source lumineuse à led sous forme de barre - Google Patents

Source lumineuse à led sous forme de barre Download PDF

Info

Publication number
WO2009082864A1
WO2009082864A1 PCT/CN2008/000381 CN2008000381W WO2009082864A1 WO 2009082864 A1 WO2009082864 A1 WO 2009082864A1 CN 2008000381 W CN2008000381 W CN 2008000381W WO 2009082864 A1 WO2009082864 A1 WO 2009082864A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
strip
substrate
heat sink
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2008/000381
Other languages
English (en)
Chinese (zh)
Inventor
Binhai Yu
Junzheng Li
Yaohao Wang
Xufeng Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan NationStar Optoelectronics Co Ltd
Original Assignee
Foshan NationStar Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan NationStar Optoelectronics Co Ltd filed Critical Foshan NationStar Optoelectronics Co Ltd
Publication of WO2009082864A1 publication Critical patent/WO2009082864A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape

Definitions

  • the invention relates to a semiconductor light source structure, in particular to a strip LED light source with good heat dissipation effect, low cost and uniform spatial light intensity distribution, and can be widely applied to various semiconductor lighting products.
  • strip light sources are increasingly used in various fields. There are three main types of well-known strip light sources:
  • the first type is a light source for directly soldering LED components to a strip substrate. As shown in Fig. 1, the LED elements 101 are directly soldered to the substrate 102, and the respective elements are connected by wires on the substrate to form a strip light source.
  • the second method is COB (Chip on board), as shown in FIG. 2, the LED chip 201 is directly bonded to the substrate 202, and then the chip 201 is packaged by the encapsulant 203. Thereby forming a strip light source.
  • COB Chip on board
  • the third type is to directly mount the LED chip 303 on the bracket 302 having the strip-shaped reflecting cavity 301, as shown in FIG. 3-1, and then seal the entire reflective cavity 301 and the chip 303 in the reflective cavity by using the encapsulant 304. As shown in Figure 3-2.
  • the above-mentioned known strip LED light source has poor heat dissipation effect, and the spatial light intensity distribution of the product is not uniform.
  • the invention patent provides a strip LED light source with good heat dissipation effect, low cost and uniform spatial light intensity distribution.
  • a strip-shaped LED light source comprising a heat sink, a substrate, a chip, an inner lead, an encapsulant, a heat sink disposed on the substrate, the chip being placed on the heat sink, the substrate being provided with an electrode for connecting the chip and being held a circuit in which the chips are connected to each other; wherein the substrate has a strip shape, the substrate is provided with a counterbore, and the heat sink is embedded in the counterbore, and the counterbore is corresponding to a single strip structure or a plurality of counterbore structures.
  • the plurality of chips are placed on the heat sink and arranged in a desired shape as needed, and the package colloid is integrally molded to integrally pack the plurality of chips and the inner leads, and the surface of the encapsulant is set to be corresponding.
  • Optical lens structure In the strip structure, the plurality of chips are placed on the heat sink and arranged in a desired shape as needed, and the package colloid is integrally molded to integrally pack the plurality of chips and the inner leads, and the surface of the encapsulant is set to be corresponding.
  • the area of the lower hole opening in the counterbore structure is larger than that of the upper hole, and both holes are vertical perforated structures, and a stepped surface transition is adopted.
  • the shape of the heat sink corresponds to the structure of the counterbore.
  • the chips are connected in parallel or in series, and are arranged in a single line or rows in a "one" shape.
  • the upper surface encapsulant of the encapsulant is a single strip optical lens structure or a plurality of optical lens combinations; such as a concave lens structure or the like.
  • the number of chips is N, where N 2 .
  • the substrate is also provided with electronic components such as a resistor, a capacitor, and a driving IC that constitute a light source module, and is connected with a circuit on the substrate to form a light source module that can be directly used.
  • electronic components such as a resistor, a capacitor, and a driving IC that constitute a light source module, and is connected with a circuit on the substrate to form a light source module that can be directly used.
  • the heat dissipation effect is good, the bottom of the heat sink is in direct contact with the outside, and the semi-encapsulated structure is beneficial to mention High heat dissipation effect;
  • the cost is low, the invention prints the metal electrode on the substrate, the structure is simple, and the cost of the accessory is low;
  • the invention adopts a light-emitting structure of a strip-shaped optical lens or a plurality of optical lenses, effectively dispersing the central brightness of the strip-shaped light source, and providing a strip-shaped light source with uniform spatial light intensity distribution;
  • the application is convenient, the product of the invention can be directly assembled in the lamp or other application products, and the compatibility is good.
  • Figure 1 is a strip light source composed of LED elements soldered on a substrate
  • Figure 2 shows a strip light source made by COB
  • Figure 3 Strip light source with reflective cavity (unpackaged or packaged);
  • Figure 5 is a schematic view of the substrate structure
  • Figure 6 is a schematic cross-sectional view of the substrate
  • Figure 7 is a schematic diagram of the arrangement of the substrate lines
  • Figure 8 is a schematic diagram of a strip shape heat sink
  • FIG. 9 shows the completion of chip binding
  • Figure 10 is a schematic diagram of the chip binding completion plane
  • FIG. 11 Schematic diagram of the product structure completed by the package
  • Figure 12 is a schematic diagram of the line connection of the strip light source module
  • FIG. 13 Schematic diagram of the circuit principle of the strip light source module.
  • a strip LED light source of the present invention comprises a heat sink 406, a substrate 401, a chip 409, an inner lead 410, and an encapsulant 411.
  • the heat sink 406 is disposed on the substrate 401.
  • the chip 409 is placed on the heat sink 406.
  • the substrate is provided with an electrode connecting the chip 409 and a line 405 connecting the chips 409.
  • the substrate is strip-shaped and provided with a counterbore, and the counterbore is a single strip structure.
  • the shape of the heat sink 406 corresponds to the structure of the counterbore, so that the heat sink 406 is embedded in the counterbore, and the chip is placed on the heat sink 406 and arranged in a "word" shape, and the chips 409 are connected in parallel or Connected in series, the lines 405 are arranged in a single line of "one" shape, or may be arranged in a plurality of rows.
  • the encapsulant 411 is integrally molded to integrally form a plurality of chips 409 and inner leads 410, and the surface of the encapsulant 411 is provided as a single strip concave lens structure.
  • the counterbore may also be arranged in a strip shape for a plurality of circular counterbore structures.
  • the upper surface concave lens of the encapsulant 411 may also be a plurality of concave lens combinations, and the lines may also be arranged in a cross arrangement.
  • the package structure of the present invention can also directly constitute a light source module: an electronic component such as a resistor, a capacitor, a driver IC, etc. constituting the light source module is placed on the substrate, as shown in FIG. 12, a strip directly assembled on a 24V power supply.
  • the light source and the LED chip are connected to each other in series by a circuit on the substrate, and a resistor 413 is connected to form a light source module which can be directly used.
  • the circuit schematic is shown in FIG.
  • the preparation process of the invention is as follows -
  • Fig. 6 is a schematic cross-sectional view of Fig. 5.
  • a substrate 401 having a counterbore structure is prepared.
  • the bottom hole 402 of the counterbore structure has a pupil area larger than the upper hole 403, and both holes are vertical strip structures, and the step surface 404 is used for transition.
  • the surface of the substrate 401 is printed with electrodes connected to the chip and a line 405 that maintains the interconnection between the chips;
  • the forming of the heat sink using the forging process, produces the heat sink 406 as shown in Fig. 7, which is in the form of a strip, which is divided into two upper and lower mesas 407 and 408, and the step structure composed of 407 and 408 is exactly the same as the 402 on the substrate.
  • the structure of the counterbore consisting of 403 is matched;
  • chip binding complete the placement of the chip 409, and complete the binding of the lead 410, complete the electrical connection between the chip 409 and the line 405 on the substrate 401, the schematic diagram is shown in Figure 9 and Figure 8, the line connection is shown in Figure 10. Shown
  • the package 401 is packaged by a plastic encapsulation process. As shown in FIG. 11, the encapsulant 411 is injection molded once, and the upper surface 412 is formed into a strip-shaped concave lens structure.

Landscapes

  • Led Device Packages (AREA)

Abstract

L'invention concerne une source lumineuse à LED sous forme de barre, comprenant un dissipateur thermique (406), un substrat (401), une pluralité de puces (409), une pluralité de fils électriques intérieurs (410) et un colloïde (411) destiné à l'encapsulation. Le dissipateur thermique (406) est disposé sur le substrat (401). Les puces (409) sont agencées sur le dissipateur thermique (406). Les fils électriques du circuit (405) destinés à être connectés aux électrodes des puces (409) et à coupler les puces (409) les unes aux autres sont disposés sur le substrat (401). Le substrat (401) se présentant sous la forme d'une barre est équipé d'un trou fraisé, dans lequel le dissipateur thermique (406) est incrusté. Le trou fraisé se présentant sous la forme d'une barre est constitué d'une structure unidirectionnelle ou combinée. Le colloïde (411) destiné à l'encapsulation, formé au moyen d'un processus de moulage unique, permet d'encapsuler les puces (409) et les fils électriques intérieurs (410). La surface du colloïde (411) destiné à l'encapsulation est dotée d'une structure de lentille.
PCT/CN2008/000381 2007-12-27 2008-02-22 Source lumineuse à led sous forme de barre Ceased WO2009082864A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2007100329038A CN100508188C (zh) 2007-12-27 2007-12-27 一种条形led光源
CN200710032903.8 2007-12-27

Publications (1)

Publication Number Publication Date
WO2009082864A1 true WO2009082864A1 (fr) 2009-07-09

Family

ID=39623534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2008/000381 Ceased WO2009082864A1 (fr) 2007-12-27 2008-02-22 Source lumineuse à led sous forme de barre

Country Status (2)

Country Link
CN (1) CN100508188C (fr)
WO (1) WO2009082864A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120061716A1 (en) * 2009-04-10 2012-03-15 Nationstar Optoelectronics Co., Ltd. Manufacturing method for power led head-dissipating substrate and power led product and the products thereof
CN102032485B (zh) * 2009-09-29 2013-10-30 丰田合成株式会社 照明装置
CN101997269B (zh) * 2010-09-15 2012-02-08 山东华光光电子有限公司 一种半导体激光器巴条制作方法
CN106097907A (zh) * 2016-07-30 2016-11-09 深圳浩翔光电技术有限公司 一种用于led显示屏的防水、防尘cob灯条屏

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2812306Y (zh) * 2005-08-02 2006-08-30 徐泓 大功率led封装结构
CN2845171Y (zh) * 2005-08-10 2006-12-06 凯鼎科技股份有限公司 发光二极体的封装结构
CN1298059C (zh) * 2004-11-29 2007-01-31 深圳市淼浩高新科技开发有限公司 一种镶嵌式功率型led光源的封装结构
US20070063213A1 (en) * 2005-09-21 2007-03-22 Lighthouse Technology Co., Ltd. LED package
CN1983593A (zh) * 2005-12-15 2007-06-20 傅立铭 主动式薄片高功率发光二极管

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1298059C (zh) * 2004-11-29 2007-01-31 深圳市淼浩高新科技开发有限公司 一种镶嵌式功率型led光源的封装结构
CN2812306Y (zh) * 2005-08-02 2006-08-30 徐泓 大功率led封装结构
CN2845171Y (zh) * 2005-08-10 2006-12-06 凯鼎科技股份有限公司 发光二极体的封装结构
US20070063213A1 (en) * 2005-09-21 2007-03-22 Lighthouse Technology Co., Ltd. LED package
CN1983593A (zh) * 2005-12-15 2007-06-20 傅立铭 主动式薄片高功率发光二极管

Also Published As

Publication number Publication date
CN101217142A (zh) 2008-07-09
CN100508188C (zh) 2009-07-01

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