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WO2009075163A1 - 成膜用マスク及びマスク密着方法 - Google Patents

成膜用マスク及びマスク密着方法 Download PDF

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Publication number
WO2009075163A1
WO2009075163A1 PCT/JP2008/070815 JP2008070815W WO2009075163A1 WO 2009075163 A1 WO2009075163 A1 WO 2009075163A1 JP 2008070815 W JP2008070815 W JP 2008070815W WO 2009075163 A1 WO2009075163 A1 WO 2009075163A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
pair
film forming
sides
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/070815
Other languages
English (en)
French (fr)
Inventor
Yoshinari Kondo
Kentaro Suzuki
Eichi Matsumoto
Yoshihiro Kobayashi
Kiichiro Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
Maxell Ltd
Original Assignee
Kyushu Hitachi Maxell Ltd
Tokki Corp
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Hitachi Maxell Ltd, Tokki Corp, Hitachi Maxell Ltd filed Critical Kyushu Hitachi Maxell Ltd
Priority to KR1020107015382A priority Critical patent/KR101493119B1/ko
Priority to CN2008801205571A priority patent/CN101896635B/zh
Priority to US12/808,026 priority patent/US20100260938A1/en
Publication of WO2009075163A1 publication Critical patent/WO2009075163A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photovoltaic Devices (AREA)

Abstract

　基板と良好に密着して成膜パターン精度の良い成膜を可能とした極めて実用性に秀れた成膜用マスク及びマスク密着方法の提供。成膜材料の通過を許容する開口パターンを有するマスク本体１と、このマスク本体１を保持する保持フレーム２とから成り、前記開口パターンを介して前記成膜材料が付着せしめられる基板６が積層される成膜用マスクであって、前記保持フレーム２は、前記マスク本体１の４辺のうち対向する一対の辺部３に沿って夫々配設されこの一対の辺部３を夫々保持する一対の保持部４を備え、この一対の保持部４によってのみ前記マスク本体１を保持するように構成し、前記一対の保持部４によって保持される前記一対の辺部３間で前記マスク本体１が自重によって撓み且つこの一対の辺部３の対向方向で前記撓み量が変化するようにこの一対の辺部３を前記一対の保持部４に固定する。
PCT/JP2008/070815 2007-12-13 2008-11-14 成膜用マスク及びマスク密着方法 Ceased WO2009075163A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107015382A KR101493119B1 (ko) 2007-12-13 2008-11-14 성막용 마스크 및 마스크 밀착방법
CN2008801205571A CN101896635B (zh) 2007-12-13 2008-11-14 成膜用掩模和掩模密合方法
US12/808,026 US20100260938A1 (en) 2007-12-13 2008-11-14 Mask for film formation and mask-affixing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-322422 2007-12-13
JP2007322422A JP5258278B2 (ja) 2007-12-13 2007-12-13 成膜用マスク及びマスク密着方法

Publications (1)

Publication Number Publication Date
WO2009075163A1 true WO2009075163A1 (ja) 2009-06-18

Family

ID=40755406

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070815 Ceased WO2009075163A1 (ja) 2007-12-13 2008-11-14 成膜用マスク及びマスク密着方法

Country Status (6)

Country Link
US (1) US20100260938A1 (ja)
JP (1) JP5258278B2 (ja)
KR (1) KR101493119B1 (ja)
CN (1) CN101896635B (ja)
TW (1) TW200938642A (ja)
WO (1) WO2009075163A1 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101117645B1 (ko) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 마스크 조립체 및 이를 이용한 평판표시장치용 증착 장치
CN102268636A (zh) * 2010-06-01 2011-12-07 勤友企业股份有限公司 镀膜工艺中的图案形成方法及应用此方法的基板承载设备
KR20150125935A (ko) * 2013-02-26 2015-11-10 토레이 엔지니어링 컴퍼니, 리미티드 기판 처리 장치, 마스크의 세트 방법, 막 형성 장치 및 막 형성 방법
US9656290B1 (en) * 2013-07-05 2017-05-23 Massachusetts Institute Of Technology Stencil masks for making conformable electromagnetic device structures
TWI480399B (zh) * 2013-07-09 2015-04-11 金屬遮罩
CN104749902B (zh) * 2013-12-31 2017-02-15 上海微电子装备有限公司 掩模板面型整形装置
CN103834921B (zh) * 2014-02-28 2016-05-18 上海和辉光电有限公司 一种蒸发源挡板结构
CN104561895B (zh) * 2014-12-25 2017-03-22 昆山国显光电有限公司 一种复合掩膜板及其制作方法
TWI579640B (zh) * 2015-10-15 2017-04-21 許銘案 薄膜光罩、貼合輔具、貼合與曝光輔助裝置及將一薄膜光罩貼合於一曲面基板的方法
US10934614B2 (en) * 2016-03-23 2021-03-02 Hon Hai Precision Industry Co., Ltd. Vapor deposition mask, vapor deposition mask production method, and organic semiconductor element production method
CN109219897A (zh) * 2016-05-24 2019-01-15 应用材料公司 具有抗等离子体涂层的阴影掩模
WO2018092531A1 (ja) 2016-11-18 2018-05-24 大日本印刷株式会社 蒸着マスク
KR101963982B1 (ko) * 2017-12-27 2019-03-29 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
JP6852018B2 (ja) * 2018-05-31 2021-03-31 キヤノントッキ株式会社 蒸着方法，電子デバイスの製造方法及び蒸着装置
JP7487481B2 (ja) * 2019-02-06 2024-05-21 大日本印刷株式会社 蒸着マスク装置、マスク支持機構及び蒸着マスク装置の製造方法
US11326246B2 (en) 2020-07-27 2022-05-10 Rockwell Collins, Inc. Controlled warping of shadow mask tooling for improved reliability and miniturization via thin film deposition
JP2021080567A (ja) * 2021-01-28 2021-05-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 耐プラズマコーティングを有するシャドウマスク

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665980A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Vacuum deposition device
JP2000129419A (ja) * 1998-10-22 2000-05-09 Hokuriku Electric Ind Co Ltd 蒸着マスク
JP2003129218A (ja) * 2001-10-22 2003-05-08 Toyota Motor Corp 成膜用マスクおよびそれを用いた薄膜の成膜方法
JP2005256101A (ja) * 2004-03-12 2005-09-22 Mitsui Eng & Shipbuild Co Ltd 基板・マスク固定装置
JP2007035440A (ja) * 2005-07-27 2007-02-08 Seiko Epson Corp マスク製造方法、マスク、成膜方法、電気光学装置の製造方法、及び電子機器
JP2007207632A (ja) * 2006-02-03 2007-08-16 Canon Inc マスク成膜方法およびマスク成膜装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511599A (en) * 1983-03-01 1985-04-16 Sigmatron Associates Mask for vacuum depositing back metal electrodes on EL panel
WO2003019988A1 (en) * 2001-08-24 2003-03-06 Dai Nippon Printing Co., Ltd. Multi-face forming mask device for vacuum deposition
KR100490534B1 (ko) * 2001-12-05 2005-05-17 삼성에스디아이 주식회사 유기 전자 발광 소자의 박막 증착용 마스크 프레임 조립체
JP3794407B2 (ja) * 2003-11-17 2006-07-05 セイコーエプソン株式会社 マスク及びマスクの製造方法、表示装置の製造方法、有機ｅｌ表示装置の製造方法、有機ｅｌ装置、及び電子機器
JP4491382B2 (ja) * 2004-06-17 2010-06-30 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、デバイス製造方法およびペリクルを有するマスク
JP2006077276A (ja) * 2004-09-08 2006-03-23 Seiko Epson Corp マスク、マスクの製造方法、薄膜パターンの形成方法、電気光学装置の製造方法
US7239376B2 (en) * 2005-07-27 2007-07-03 International Business Machines Corporation Method and apparatus for correcting gravitational sag in photomasks used in the production of electronic devices
JP4782548B2 (ja) * 2005-11-18 2011-09-28 九州日立マクセル株式会社 蒸着方法
JP2007224396A (ja) * 2006-02-27 2007-09-06 Canon Inc 成膜方法および成膜用マスク
JP2008036986A (ja) * 2006-08-08 2008-02-21 Fujitsu Hitachi Plasma Display Ltd スクリーンマスク、印刷装置、印刷方法並びにフラットディスプレイパネルの製造方法
KR100739309B1 (ko) * 2006-10-13 2007-07-12 삼성에스디아이 주식회사 박막 증착용 마스크 및 이를 이용한 유기 전계발광표시장치
JP5297046B2 (ja) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 成膜装置
KR101450728B1 (ko) * 2008-05-28 2014-10-14 삼성디스플레이 주식회사 마스크 조립체 및 그의 제조 방법
JP2010080086A (ja) * 2008-09-24 2010-04-08 Sumitomo Chemical Co Ltd パターン塗布用基板および有機ｅｌ素子
KR101117645B1 (ko) * 2009-02-05 2012-03-05 삼성모바일디스플레이주식회사 마스크 조립체 및 이를 이용한 평판표시장치용 증착 장치
KR101041138B1 (ko) * 2009-03-03 2011-06-13 삼성모바일디스플레이주식회사 증착용 마스크
US8882920B2 (en) * 2009-06-05 2014-11-11 Samsung Display Co., Ltd. Thin film deposition apparatus
KR101030030B1 (ko) * 2009-12-11 2011-04-20 삼성모바일디스플레이주식회사 마스크 조립체
KR101107159B1 (ko) * 2009-12-17 2012-01-25 삼성모바일디스플레이주식회사 평판 표시장치의 박막 증착용 마스크 조립체
KR101182440B1 (ko) * 2010-01-11 2012-09-12 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 조립체
CN103282540B (zh) * 2011-01-07 2015-02-25 夏普株式会社 蒸镀装置和蒸镀方法
KR20120081512A (ko) * 2011-01-11 2012-07-19 삼성모바일디스플레이주식회사 박막 증착용 마스크 프레임 조립체
KR101833234B1 (ko) * 2011-06-21 2018-03-02 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 어셈블리
KR101897209B1 (ko) * 2012-08-03 2018-09-11 삼성디스플레이 주식회사 프레임 및 이를 포함하는 마스크 조립체
KR101969955B1 (ko) * 2012-10-25 2019-04-18 삼성디스플레이 주식회사 평판표시장치용 증착 마스크 조립체 제조장치
KR102000718B1 (ko) * 2012-11-15 2019-07-19 삼성디스플레이 주식회사 박막 증착용 마스크 조립체 및 이의 제조 방법
KR102002494B1 (ko) * 2012-11-30 2019-07-23 삼성디스플레이 주식회사 박막 증착용 마스크 프레임 어셈블리
KR20140117206A (ko) * 2013-03-26 2014-10-07 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
KR102086553B1 (ko) * 2013-05-31 2020-03-10 삼성디스플레이 주식회사 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR102130546B1 (ko) * 2013-10-11 2020-07-07 삼성디스플레이 주식회사 마스크 조립체 및 이를 이용한 평판표시장치용 증착 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5665980A (en) * 1979-11-05 1981-06-04 Hitachi Ltd Vacuum deposition device
JP2000129419A (ja) * 1998-10-22 2000-05-09 Hokuriku Electric Ind Co Ltd 蒸着マスク
JP2003129218A (ja) * 2001-10-22 2003-05-08 Toyota Motor Corp 成膜用マスクおよびそれを用いた薄膜の成膜方法
JP2005256101A (ja) * 2004-03-12 2005-09-22 Mitsui Eng & Shipbuild Co Ltd 基板・マスク固定装置
JP2007035440A (ja) * 2005-07-27 2007-02-08 Seiko Epson Corp マスク製造方法、マスク、成膜方法、電気光学装置の製造方法、及び電子機器
JP2007207632A (ja) * 2006-02-03 2007-08-16 Canon Inc マスク成膜方法およびマスク成膜装置

Also Published As

Publication number Publication date
JP5258278B2 (ja) 2013-08-07
US20100260938A1 (en) 2010-10-14
CN101896635B (zh) 2013-07-31
KR20100114883A (ko) 2010-10-26
JP2009144195A (ja) 2009-07-02
TW200938642A (en) 2009-09-16
CN101896635A (zh) 2010-11-24
KR101493119B1 (ko) 2015-02-12

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