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WO2009074368A3 - Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement - Google Patents

Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement Download PDF

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Publication number
WO2009074368A3
WO2009074368A3 PCT/EP2008/063670 EP2008063670W WO2009074368A3 WO 2009074368 A3 WO2009074368 A3 WO 2009074368A3 EP 2008063670 W EP2008063670 W EP 2008063670W WO 2009074368 A3 WO2009074368 A3 WO 2009074368A3
Authority
WO
WIPO (PCT)
Prior art keywords
micromechanical component
production method
semiconductor substrate
relates
central part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2008/063670
Other languages
English (en)
French (fr)
Other versions
WO2009074368A2 (de
Inventor
Tjalf Pirk
Stefan Pinter
Christoph Friese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2009074368A2 publication Critical patent/WO2009074368A2/de
Publication of WO2009074368A3 publication Critical patent/WO2009074368A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/03—Microengines and actuators
    • B81B2201/033—Comb drives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/038—Bonding techniques not provided for in B81C2203/031 - B81C2203/037

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Herstellungsverfahren für ein mikromechanisches Bauelement (100) mit den Schritten: Bilden einer Isolierschicht (14) direkt auf einem ersten Halbleitersubstrat (10) und Ätzen mindestens eines Trenngrabens (26) durch das erste Halbleitersubstrat (10) zum Teilen des ersten Halbleitersubstrats (10) in mindestens ein elektrisch isoliertes Mittelteil (32 bis 38) und ein das Mittelteil (32 bis 38) umgebendes Rahmenteil (30). Des Weiteren betriff die Erfindung ein entsprechendes mikromechanisches Bauelement (100).
PCT/EP2008/063670 2007-12-12 2008-10-10 Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement Ceased WO2009074368A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007059856.6 2007-12-12
DE102007059856A DE102007059856A1 (de) 2007-12-12 2007-12-12 Herstellungsverfahren für ein mikromechanisches Bauelement und mikromechaniches Bauelement

Publications (2)

Publication Number Publication Date
WO2009074368A2 WO2009074368A2 (de) 2009-06-18
WO2009074368A3 true WO2009074368A3 (de) 2009-11-12

Family

ID=40679864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/063670 Ceased WO2009074368A2 (de) 2007-12-12 2008-10-10 Herstellungsverfahren für ein mikromechanisches bauelement und mikromechanisches bauelement

Country Status (2)

Country Link
DE (1) DE102007059856A1 (de)
WO (1) WO2009074368A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014210986A1 (de) * 2014-06-10 2015-12-17 Robert Bosch Gmbh Mikromechanische Schichtenanordnung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1180493A2 (de) * 2000-08-18 2002-02-20 Samsung Electronics Co., Ltd. Mikroaktor und dessen Herstellungsverfahren
US20040081391A1 (en) * 2002-10-18 2004-04-29 Samsung Electronics Co., Ltd. 2-D actuator and manufacturing method thereof
US20050117235A1 (en) * 2003-12-02 2005-06-02 Samsung Electronics Co., Ltd. Micro mirror and method for fabricating the same
EP1659437A2 (de) * 2004-10-19 2006-05-24 Samsung Electronics Co., Ltd. Zweiachsige Positioniereinrichtung und Verfahren zur Herstellung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19728598C2 (de) 1997-07-04 2000-12-14 Bosch Gmbh Robert Mikromechanische Spiegeleinrichtung
JP3827977B2 (ja) 2001-08-20 2006-09-27 富士通株式会社 マイクロミラー素子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1180493A2 (de) * 2000-08-18 2002-02-20 Samsung Electronics Co., Ltd. Mikroaktor und dessen Herstellungsverfahren
US20040081391A1 (en) * 2002-10-18 2004-04-29 Samsung Electronics Co., Ltd. 2-D actuator and manufacturing method thereof
US20050117235A1 (en) * 2003-12-02 2005-06-02 Samsung Electronics Co., Ltd. Micro mirror and method for fabricating the same
EP1659437A2 (de) * 2004-10-19 2006-05-24 Samsung Electronics Co., Ltd. Zweiachsige Positioniereinrichtung und Verfahren zur Herstellung

Also Published As

Publication number Publication date
WO2009074368A2 (de) 2009-06-18
DE102007059856A1 (de) 2009-06-18

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