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WO2009060705A1 - Electric circuit parts mounting method and system - Google Patents

Electric circuit parts mounting method and system Download PDF

Info

Publication number
WO2009060705A1
WO2009060705A1 PCT/JP2008/068865 JP2008068865W WO2009060705A1 WO 2009060705 A1 WO2009060705 A1 WO 2009060705A1 JP 2008068865 W JP2008068865 W JP 2008068865W WO 2009060705 A1 WO2009060705 A1 WO 2009060705A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
parts
substrate
face
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068865
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Ao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP2009540000A priority Critical patent/JP5308345B2/en
Priority to CN2008801150808A priority patent/CN101855956B/en
Publication of WO2009060705A1 publication Critical patent/WO2009060705A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)

Abstract

Provided is an electric circuit parts mounting system, which is constituted by arranging a plurality of mounting modules (2) having substrate conveyors of three lanes, and which is suited for producing double-sided mounting substrates extremely different in the number of mounted parts between the surface and the back. The not-shown parts mounting device for receiving parts from a parts feeding device (26) and mounting them can be mounted on a substrate (6), too, which is held on any of substrate conveyors (10, 12 and 14). The mounting on such a face (6b) of the substrate (6) as has the mounted parts of a small number is performed every time on the substrate conveyor (14), whereas the mounting on a face (6f) having the mounted parts of a large number is performed every other time on each of the substrate conveyors (10 and 12). In the working operation of one cycle, the parts mounting device can perform the mounting operation on each of the face (6f) and the face (6b) can be performed without any waiting time for delivering in and out the substrate (6) and for setting it, and the mounting operations on the surface and the back of the double-sided mounting substrates of a desired number can be substantially simultaneously completed.
PCT/JP2008/068865 2007-11-09 2008-10-17 Electric circuit parts mounting method and system Ceased WO2009060705A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009540000A JP5308345B2 (en) 2007-11-09 2008-10-17 Electrical circuit component mounting method and system
CN2008801150808A CN101855956B (en) 2007-11-09 2008-10-17 Circuit component mounting method and system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-292099 2007-11-09
JP2007292099 2007-11-09

Publications (1)

Publication Number Publication Date
WO2009060705A1 true WO2009060705A1 (en) 2009-05-14

Family

ID=40625605

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068865 Ceased WO2009060705A1 (en) 2007-11-09 2008-10-17 Electric circuit parts mounting method and system

Country Status (3)

Country Link
JP (1) JP5308345B2 (en)
CN (2) CN101855956B (en)
WO (1) WO2009060705A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009200475A (en) * 2008-01-23 2009-09-03 Panasonic Corp Method of determining mounting condition
JP2009218572A (en) * 2008-02-15 2009-09-24 Panasonic Corp Mounting condition determining method
US8315728B2 (en) 2008-01-23 2012-11-20 Panasonic Corporation Component mounting condition determination method
WO2016021042A1 (en) * 2014-08-08 2016-02-11 富士機械製造株式会社 Substrate production method and substrate production condition determination method
WO2016038730A1 (en) * 2014-09-12 2016-03-17 富士機械製造株式会社 Substrate work device and substrate work system
JPWO2015193975A1 (en) * 2014-06-17 2017-04-20 富士機械製造株式会社 Electronic component mounting method and electronic component mounting system
JP2017135296A (en) * 2016-01-29 2017-08-03 富士機械製造株式会社 Board production method and condition determination method of board production
JP2019054276A (en) * 2018-11-28 2019-04-04 株式会社Ｆｕｊｉ Control device for electronic component attaching system
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5480776B2 (en) * 2010-11-02 2014-04-23 ヤマハ発動機株式会社 Mounting mode determination method and component mounting system
JP5780905B2 (en) * 2011-09-28 2015-09-16 富士機械製造株式会社 Board work system
JP6277424B2 (en) * 2014-09-17 2018-02-14 パナソニックＩｐマネジメント株式会社 Component mounting apparatus and component mounting method
JP7142203B2 (en) * 2017-12-06 2022-09-27 パナソニックＩｐマネジメント株式会社 COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTING DEVICE, AND BOARD CONVEYING METHOD
KR102282096B1 (en) * 2017-12-15 2021-07-27 야마하하쓰도키 가부시키가이샤 Part mounting system, part mounting method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243896A (en) * 2002-02-18 2003-08-29 Fuji Mach Mfg Co Ltd Electronic circuit component mounting device
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391039B2 (en) * 1993-02-23 2003-03-31 松下電器産業株式会社 Mounting board production system
JP2001068898A (en) * 1999-08-26 2001-03-16 Matsushita Electric Ind Co Ltd Electronic component mounting equipment
JP2003517735A (en) * 1999-12-16 2003-05-27 シーメンス アクチエンゲゼルシヤフト Mounting equipment with multiple transport distance divisions for mounting boards
KR100581427B1 (en) * 2000-08-22 2006-05-17 마츠시타 덴끼 산교 가부시키가이샤 Component mounting apparatus and method
CN100508721C (en) * 2002-06-25 2009-07-01 富士机械制造株式会社 Substrate processing system
JP2004128400A (en) * 2002-10-07 2004-04-22 Fuji Mach Mfg Co Ltd Component mounting apparatus, program for controlling operation of the same apparatus, and component mounting system
JP4260721B2 (en) * 2004-10-29 2009-04-30 富士通株式会社 Electronic component board mounting method and board mounting apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243896A (en) * 2002-02-18 2003-08-29 Fuji Mach Mfg Co Ltd Electronic circuit component mounting device
JP2004031613A (en) * 2002-06-25 2004-01-29 Fuji Mach Mfg Co Ltd Substrate transportation apparatus of electronic component mounting apparatus

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8315728B2 (en) 2008-01-23 2012-11-20 Panasonic Corporation Component mounting condition determination method
JP2009200475A (en) * 2008-01-23 2009-09-03 Panasonic Corp Method of determining mounting condition
JP2009218572A (en) * 2008-02-15 2009-09-24 Panasonic Corp Mounting condition determining method
US10667448B2 (en) 2014-06-17 2020-05-26 Fuji Corporation Electronic component mounting method
JPWO2015193975A1 (en) * 2014-06-17 2017-04-20 富士機械製造株式会社 Electronic component mounting method and electronic component mounting system
WO2016021042A1 (en) * 2014-08-08 2016-02-11 富士機械製造株式会社 Substrate production method and substrate production condition determination method
JPWO2016021042A1 (en) * 2014-08-08 2017-05-25 富士機械製造株式会社 Substrate production method and substrate production condition determination method
WO2016038730A1 (en) * 2014-09-12 2016-03-17 富士機械製造株式会社 Substrate work device and substrate work system
US10181250B2 (en) 2014-09-12 2019-01-15 Fuji Corporation Board work device and board work system
JPWO2016038730A1 (en) * 2014-09-12 2017-06-22 富士機械製造株式会社 Anti-substrate work apparatus and anti-substrate operation system
JP2017135296A (en) * 2016-01-29 2017-08-03 富士機械製造株式会社 Board production method and condition determination method of board production
WO2019186925A1 (en) * 2018-03-29 2019-10-03 平田機工株式会社 Working system and work method
JPWO2019186925A1 (en) * 2018-03-29 2021-05-27 平田機工株式会社 Work system and work method
US11351639B2 (en) 2018-03-29 2022-06-07 Hirata Corporation Working system and work method
JP7114692B2 (en) 2018-03-29 2022-08-08 平田機工株式会社 Work system and work method
JP2019054276A (en) * 2018-11-28 2019-04-04 株式会社Ｆｕｊｉ Control device for electronic component attaching system
JP7018379B2 (en) 2018-11-28 2022-02-10 株式会社Fuji Control device for electronic component mounting system

Also Published As

Publication number Publication date
CN101855956A (en) 2010-10-06
CN102510718B (en) 2015-07-01
JP5308345B2 (en) 2013-10-09
JPWO2009060705A1 (en) 2011-03-24
CN101855956B (en) 2013-02-13
CN102510718A (en) 2012-06-20

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