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MY159009A - Apparatus and method for conveying singulated electronic component - Google Patents

Apparatus and method for conveying singulated electronic component

Info

Publication number
MY159009A
MY159009A MYPI2010002475A MYPI2010002475A MY159009A MY 159009 A MY159009 A MY 159009A MY PI2010002475 A MYPI2010002475 A MY PI2010002475A MY PI2010002475 A MYPI2010002475 A MY PI2010002475A MY 159009 A MY159009 A MY 159009A
Authority
MY
Malaysia
Prior art keywords
electronic components
conveying
reception part
sucking
pattern
Prior art date
Application number
MYPI2010002475A
Inventor
Yasuhiro Iwata
Shuzo Yamaji
Shinya Nakajima
Junko Kashimura
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY159009A publication Critical patent/MY159009A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

THE PRESENT INVENTION AIMS AT EFFICIENTLY CONVEYING SINGULATED ELECTRONIC COMPONENTS PLACED IN A GRID PATTERN ON A STAGE ONTO A TABLE TO ARRANGE THEM IN A ZIGZAG PATTERN, ANDTHEN EFFICIENTLY CONVEYING THEM FROM THE TABLE. ON A TABLE (TA) OF THE APPARATUS FOR CONVEYING SINGULATED ELECTRONIC COMPONENTS, A FIRST RECEPTION PART (S1) AND A SECOND RECEPTION PART (S2) ARE ADJACENTLY PROVIDED. THE FIRST RECEPTION PART IS FOR RECEIVING THE ELECTRONIC COMPONENTS (P) AT POSITIONS CORRESPONDING TO ONE COLOR OF A CHECKERED PATTERN AMONG A PLURALITY OF ELECTRONIC COMPONENTS AND THE SECOND RECEPTION PART FOR RECEIVING THE ELECTRONIC COMPONENT AT POSITIONS CORRESPONDING TO THE OTHER COLOR OF THE CHECKERED PATTERN. IN ADDITION, A CONVEYING MECHANISM (PU) IS PROVIDED WHICH IS FOR COLLECTIVELY SUCKING AND CONVEYING (FIVE) ELECTRONIC COMPONENTS CONTAINED IN ONE LINE ALONG AN X-DIRECTION AMONG THE PLURALITY OF ELECTRONIC COMPONENTS RECEIVED IN A ZIGZAG PATTERN WITH A PITCH OF (2P) ON THE TABLE. IN THE CONVEYING MECHANISM, A PLURALITY OF SUCKING MECHANISMS EACH FOR SUCKING ONE OF THE ELECTRONIC COMPONENTS ARE PROVIDED WITH A PITCH OF (2P).
MYPI2010002475A 2007-11-30 2008-11-20 Apparatus and method for conveying singulated electronic component MY159009A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007309905A JP5108481B2 (en) 2007-11-30 2007-11-30 Device and method for conveying individualized electronic components

Publications (1)

Publication Number Publication Date
MY159009A true MY159009A (en) 2016-11-30

Family

ID=40678180

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010002475A MY159009A (en) 2007-11-30 2008-11-20 Apparatus and method for conveying singulated electronic component

Country Status (6)

Country Link
JP (1) JP5108481B2 (en)
KR (1) KR101511402B1 (en)
CN (1) CN101878525B (en)
MY (1) MY159009A (en)
TW (1) TWI436443B (en)
WO (1) WO2009069268A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101258162B1 (en) * 2011-01-13 2013-04-25 (주)에이피텍 Unit and Method for Transferring of LED Chip
NL2008290C2 (en) * 2012-02-14 2013-08-19 Fico Bv METHOD AND DEVICE FOR PLACING ELECTRONIC COMPONENTS SUITED IN A MATRIX STRUCTURE.
JP6129201B2 (en) * 2012-10-30 2017-05-17 富士機械製造株式会社 Nozzle management machine
JP6017382B2 (en) * 2013-07-29 2016-11-02 Ｔｏｗａ株式会社 Device and method for conveying individualized electronic components
WO2015046136A1 (en) * 2013-09-30 2015-04-02 株式会社 村田製作所 Suction head and sheet handling device
US9205995B2 (en) * 2013-10-21 2015-12-08 International Business Machines Corporation Sorting, swapping, and organizing objects on transfer ball grids
JP6235391B2 (en) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 Inspection jig, cutting device, and cutting method
CN104476568B (en) * 2014-12-16 2015-11-18 贵州联合光电股份有限公司 For picking and placeing the adjustable pneumatic device of electronic component
JP6382132B2 (en) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 Cutting device, conveying method, conveying program, and recording medium storing conveying program
JP6382133B2 (en) * 2015-03-04 2018-08-29 Ｔｏｗａ株式会社 Cutting device, conveying method, conveying program, and recording medium storing conveying program
JP6555100B2 (en) * 2015-11-20 2019-08-07 富士ゼロックス株式会社 Manufacturing method of substrate device
JP6952515B2 (en) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 Work transfer device, electronic component manufacturing device, workpiece transfer method, and electronic component manufacturing method
KR102486822B1 (en) 2018-03-29 2023-01-10 삼성전자주식회사 Chip transfer device and chip transfering method using the same
KR101941541B1 (en) * 2018-05-10 2019-04-12 주식회사 팀즈 A Method of Carrying and Aligning Micro LEDs to the Substrates of the LED Display Panels, A Method of producing the Display Panels thereof, and a System of Carrying and Aligning Micro LEDs to the Substrates of LED Display panes
KR102173442B1 (en) * 2019-06-18 2020-11-03 주식회사 효준베스트진테크 apparatus for auto attaching rubber of TV stand
KR102091036B1 (en) * 2019-06-18 2020-03-19 주식회사 효준베스트진테크 apparatus and method for auto attaching rubber of TV stand
JP7498674B2 (en) * 2021-01-18 2024-06-12 Ｔｏｗａ株式会社 Conveying mechanism, cutting device and method for manufacturing cut products
TWI823679B (en) * 2021-11-19 2023-11-21 日商芝浦機械電子裝置股份有限公司 Supply device and film forming device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169423A (en) * 1986-01-22 1987-07-25 Hitachi Ltd Parts transfer device
JPH0736920Y2 (en) * 1987-06-18 1995-08-23 沖電気工業株式会社 Holding interval adjusting device for electronic component transportation
KR20000002851U (en) * 1998-07-11 2000-02-07 김영환 Handler for Semiconductor Package Transfer
JP2004055860A (en) * 2002-07-22 2004-02-19 Renesas Technology Corp Method for manufacturing semiconductor device
KR100479528B1 (en) * 2003-03-31 2005-03-31 한미반도체 주식회사 Latticed loading table of sawing equipment

Also Published As

Publication number Publication date
TW200938467A (en) 2009-09-16
TWI436443B (en) 2014-05-01
JP2009135259A (en) 2009-06-18
WO2009069268A1 (en) 2009-06-04
CN101878525A (en) 2010-11-03
KR101511402B1 (en) 2015-04-10
JP5108481B2 (en) 2012-12-26
KR20100089076A (en) 2010-08-11
CN101878525B (en) 2012-07-25

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