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WO2009054404A1 - 撮影画像に基づいた検査方法及び検査装置 - Google Patents

撮影画像に基づいた検査方法及び検査装置 Download PDF

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Publication number
WO2009054404A1
WO2009054404A1 PCT/JP2008/069126 JP2008069126W WO2009054404A1 WO 2009054404 A1 WO2009054404 A1 WO 2009054404A1 JP 2008069126 W JP2008069126 W JP 2008069126W WO 2009054404 A1 WO2009054404 A1 WO 2009054404A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspected
captured image
inspection
inspection device
inspection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/069126
Other languages
English (en)
French (fr)
Inventor
Yoshinori Hayashi
Hiroshi Wakaba
Yoko Ono
Koichi Miyazono
Masao Kawamura
Hideki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2009538228A priority Critical patent/JP5610462B2/ja
Priority to KR1020107007873A priority patent/KR101237583B1/ko
Priority to US12/738,768 priority patent/US8497985B2/en
Priority to DE112008002816.8T priority patent/DE112008002816B4/de
Publication of WO2009054404A1 publication Critical patent/WO2009054404A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

【課題】撮影画像に基づいて被検査体の表面における膜や欠陥部分等の状態をより精度良く検査することのできる検査方法及び検査装置を提供することである。 【解決手段】被検査体１０の表面を照明部からの白色光ＬOにて照明しつつ、被検査体１０の表面を撮影部１００によって撮影して撮影画像を取得し、該撮影画像に基づいて被検査体１０の表面の状態を検査する検査方法及び検査装置であって、被検査体１０の照明された部位から撮影部１００に入射する光ＬRの偏光状態を変え、前記撮影部１００に入射する異なる偏光状態の光ＬＲに基づいて複数の撮影画像を取得する構成となる。
PCT/JP2008/069126 2007-10-23 2008-10-22 撮影画像に基づいた検査方法及び検査装置 Ceased WO2009054404A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009538228A JP5610462B2 (ja) 2007-10-23 2008-10-22 撮影画像に基づいた検査方法及び検査装置
KR1020107007873A KR101237583B1 (ko) 2007-10-23 2008-10-22 촬영 화상에 기초한 검사 방법 및 검사 장치
US12/738,768 US8497985B2 (en) 2007-10-23 2008-10-22 Inspection method based on captured image and inspection device
DE112008002816.8T DE112008002816B4 (de) 2007-10-23 2008-10-22 Prüfverfahren anhand von erfassten Bildern und Prüfvorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007275835 2007-10-23
JP2007-275835 2007-10-23

Publications (1)

Publication Number Publication Date
WO2009054404A1 true WO2009054404A1 (ja) 2009-04-30

Family

ID=40579508

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069126 Ceased WO2009054404A1 (ja) 2007-10-23 2008-10-22 撮影画像に基づいた検査方法及び検査装置

Country Status (5)

Country Link
US (1) US8497985B2 (ja)
JP (1) JP5610462B2 (ja)
KR (1) KR101237583B1 (ja)
DE (1) DE112008002816B4 (ja)
WO (1) WO2009054404A1 (ja)

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JP2023033172A (ja) * 2021-08-26 2023-03-09 テックウイング インコーポレイテッド 電子部品テスター用ハンドラー及び電子部品テスト用ハンドラーにおける電子部品撮影方法

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JP5415162B2 (ja) * 2009-06-23 2014-02-12 昭和電工株式会社 円筒体の表面検査装置
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
JP6076039B2 (ja) * 2012-10-30 2017-02-08 株式会社日立製作所 回転電機の摺動状態診断装置及び方法
TWI477766B (zh) * 2012-12-18 2015-03-21 Ind Tech Res Inst 檢測裝置以及檢測方法
CN103674972B (zh) * 2013-12-17 2016-03-23 楚天科技股份有限公司 提高灯检机中相机采集速度的方法及装置
US9752992B2 (en) * 2014-03-25 2017-09-05 Kla-Tencor Corporation Variable image field curvature for object inspection
WO2018105489A1 (ja) * 2016-12-06 2018-06-14 日本電気硝子株式会社 帯状ガラスフィルムの品質検査方法、及び、ガラスロール
KR102520711B1 (ko) * 2018-05-15 2023-04-12 삼성디스플레이 주식회사 결정화도 검사 장치, 및 이를 이용한 검사 방법

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JP2001349838A (ja) * 2000-06-06 2001-12-21 Sumitomo Osaka Cement Co Ltd フィルムパッケージ検査装置及び検査方法

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JPH09222382A (ja) * 1995-12-14 1997-08-26 Asahi Optical Co Ltd 光学部材検査装置
JP2001349838A (ja) * 2000-06-06 2001-12-21 Sumitomo Osaka Cement Co Ltd フィルムパッケージ検査装置及び検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023033172A (ja) * 2021-08-26 2023-03-09 テックウイング インコーポレイテッド 電子部品テスター用ハンドラー及び電子部品テスト用ハンドラーにおける電子部品撮影方法
JP7453291B2 (ja) 2021-08-26 2024-03-19 テックウイング インコーポレイテッド 電子部品テスター用ハンドラー及び電子部品テスト用ハンドラーにおける電子部品撮影方法

Also Published As

Publication number Publication date
DE112008002816B4 (de) 2014-07-31
DE112008002816T5 (de) 2011-02-03
KR101237583B1 (ko) 2013-02-26
US20100245810A1 (en) 2010-09-30
JP5610462B2 (ja) 2014-10-22
US8497985B2 (en) 2013-07-30
KR20100053687A (ko) 2010-05-20
JPWO2009054404A1 (ja) 2011-03-03

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