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WO2009051067A1 - Composition adhésive, matériau de connexion de circuit utilisant la composition adhésive, procédé pour connecter un élément de circuit et corps de connexion de circuit - Google Patents

Composition adhésive, matériau de connexion de circuit utilisant la composition adhésive, procédé pour connecter un élément de circuit et corps de connexion de circuit Download PDF

Info

Publication number
WO2009051067A1
WO2009051067A1 PCT/JP2008/068422 JP2008068422W WO2009051067A1 WO 2009051067 A1 WO2009051067 A1 WO 2009051067A1 JP 2008068422 W JP2008068422 W JP 2008068422W WO 2009051067 A1 WO2009051067 A1 WO 2009051067A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
circuit connecting
epoxy resin
connecting body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068422
Other languages
English (en)
Japanese (ja)
Inventor
Masaru Tanaka
Takuya Chayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009538073A priority Critical patent/JP4930598B2/ja
Priority to CN200880111995A priority patent/CN101828434A/zh
Priority to KR1020117017892A priority patent/KR101183317B1/ko
Priority to KR1020097021232A priority patent/KR101130377B1/ko
Publication of WO2009051067A1 publication Critical patent/WO2009051067A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une composition adhésive pour lier des éléments de circuit les uns aux autres et pour connecter électriquement les unes aux autres des électrodes de circuit respectivement disposées sur les éléments de circuit. Le composant adhésif contient une résine époxy, un agent de durcissement de résine époxy et de fines particules de silicone ayant un diamètre moyen de grain primaire de 300 nm ou moins.
PCT/JP2008/068422 2007-10-18 2008-10-10 Composition adhésive, matériau de connexion de circuit utilisant la composition adhésive, procédé pour connecter un élément de circuit et corps de connexion de circuit Ceased WO2009051067A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009538073A JP4930598B2 (ja) 2007-10-18 2008-10-10 回路接続材料、回路接続体及び回路部材の接続方法
CN200880111995A CN101828434A (zh) 2007-10-18 2008-10-10 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体
KR1020117017892A KR101183317B1 (ko) 2007-10-18 2008-10-10 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
KR1020097021232A KR101130377B1 (ko) 2007-10-18 2008-10-10 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007271263 2007-10-18
JP2007-271263 2007-10-18
JP2008050383 2008-02-29
JP2008-050383 2008-02-29

Publications (1)

Publication Number Publication Date
WO2009051067A1 true WO2009051067A1 (fr) 2009-04-23

Family

ID=40567334

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068422 Ceased WO2009051067A1 (fr) 2007-10-18 2008-10-10 Composition adhésive, matériau de connexion de circuit utilisant la composition adhésive, procédé pour connecter un élément de circuit et corps de connexion de circuit

Country Status (5)

Country Link
JP (1) JP4930598B2 (fr)
KR (2) KR101183317B1 (fr)
CN (2) CN101828434A (fr)
TW (1) TWI402321B (fr)
WO (1) WO2009051067A1 (fr)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (fr) * 2009-04-28 2010-11-04 日立化成工業株式会社 Matériau de connexion de circuit, matériau de connexion de circuit de type film utilisant le matériau de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit
JP2011006658A (ja) * 2009-05-29 2011-01-13 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011080033A (ja) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd 接着剤組成物、接着剤シート及び半導体装置の製造方法
CN102295892A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
CN102295893A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
CN102295894A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
JP2012023096A (ja) * 2010-07-12 2012-02-02 Yokohama Rubber Co Ltd:The 導電性組成物および太陽電池セル
JP2012023025A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012021140A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012023024A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
WO2012137335A1 (fr) * 2011-04-07 2012-10-11 日立化成工業株式会社 Matériau de connexion de circuit et son utilisation, et structure de connexion et son procédé de production
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR20140082696A (ko) 2011-09-20 2014-07-02 히타치가세이가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착 시트, 회로 접속체, 회로 부재의 접속 방법, 접착제 조성물의 용도, 필름상 접착제의 용도 및 접착 시트의 용도
CN106833511A (zh) * 2017-02-27 2017-06-13 苏州巨峰电气绝缘系统股份有限公司 一种高导热有机硅灌封胶及其制备方法和应用
JP2018024746A (ja) * 2016-08-09 2018-02-15 京セラ株式会社 接着シート
CN111325071A (zh) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 光学粘合料及光学传感器模组
JP2020186327A (ja) * 2019-05-15 2020-11-19 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法
JPWO2019189238A1 (ja) * 2018-03-28 2021-03-18 株式会社カネカ 接着剤組成物
JP2021128913A (ja) * 2020-02-17 2021-09-02 昭和電工マテリアルズ株式会社 異方導電性接着フィルム、接続構造体及びその製造方法

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JP5223946B2 (ja) * 2010-06-14 2013-06-26 日立化成株式会社 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
CN103262172B (zh) * 2010-11-03 2018-05-15 阿尔发装配解决方案有限公司 烧结材料及使用该材料的附着方法
CN102709257B (zh) * 2012-05-10 2015-08-19 三星半导体(中国)研究开发有限公司 半导体塑封料及其制造方法和半导体封装件
KR101640631B1 (ko) * 2012-12-12 2016-07-18 제일모직주식회사 편광판용 접착 필름, 이를 위한 접착제 조성물, 이를 포함하는 편광판 및 이를 포함하는 광학 표시 장치
CN107148809B (zh) * 2014-10-17 2020-08-11 太阳油墨制造株式会社 干膜及柔性印刷电路板
TWI740807B (zh) * 2014-10-29 2021-10-01 日商迪睿合股份有限公司 導電材料、連接構造體、及連接構造體之製造方法
CN110050036A (zh) * 2016-12-09 2019-07-23 日立化成株式会社 组合物、粘接剂、烧结体、接合体和接合体的制造方法
WO2018105125A1 (fr) * 2016-12-09 2018-06-14 日立化成株式会社 Composition, agent adhésif, corps fritté, et corps lié ainsi que procédé de fabrication de celui-ci
KR102106996B1 (ko) * 2017-12-28 2020-05-07 주식회사 노피온 솔더입자를 포함한 시트를 사용한 부품 실장 방법
CN111902884B (zh) * 2018-04-04 2023-03-14 积水化学工业株式会社 导电性粒子、其制造方法、导电材料及连接结构体
KR102846920B1 (ko) * 2022-01-13 2025-08-20 후루카와 덴키 고교 가부시키가이샤 플렉시블 디바이스용 필름형 접착제, 플렉시블 디바이스용 접착 시트 및 플렉시블 디바이스의 제조 방법
CN116132890A (zh) * 2023-01-29 2023-05-16 歌尔股份有限公司 用于发声装置的振膜、发声装置及电子设备

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Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (fr) * 2009-04-28 2010-11-04 日立化成工業株式会社 Matériau de connexion de circuit, matériau de connexion de circuit de type film utilisant le matériau de connexion de circuit, structure de connexion d'élément de circuit et procédé de connexion d'élément de circuit
JP2011006658A (ja) * 2009-05-29 2011-01-13 Hitachi Chem Co Ltd 接着剤組成物、回路部材接続用接着剤シート及び半導体装置の製造方法
JP2011080033A (ja) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd 接着剤組成物、接着剤シート及び半導体装置の製造方法
KR101314007B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101380070B1 (ko) * 2010-06-14 2014-04-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
CN102295894A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
CN102295893A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
JP2012023025A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012021140A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012023024A (ja) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
CN102382580A (zh) * 2010-06-14 2012-03-21 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
CN102382581A (zh) * 2010-06-14 2012-03-21 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
KR101380043B1 (ko) * 2010-06-14 2014-04-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101313939B1 (ko) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
CN102295892A (zh) * 2010-06-14 2011-12-28 日立化成工业株式会社 电路连接用粘接膜及用途、结构体及制造方法和连接方法
JP2012023096A (ja) * 2010-07-12 2012-02-02 Yokohama Rubber Co Ltd:The 導電性組成物および太陽電池セル
WO2012137335A1 (fr) * 2011-04-07 2012-10-11 日立化成工業株式会社 Matériau de connexion de circuit et son utilisation, et structure de connexion et son procédé de production
KR20140082696A (ko) 2011-09-20 2014-07-02 히타치가세이가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착 시트, 회로 접속체, 회로 부재의 접속 방법, 접착제 조성물의 용도, 필름상 접착제의 용도 및 접착 시트의 용도
JP2017052956A (ja) * 2011-09-20 2017-03-16 日立化成株式会社 接着剤組成物、フィルム状接着剤、接着シート、回路接続体、回路部材の接続方法、接着剤組成物の使用、フィルム状接着剤の使用及び接着シートの使用
JP2018024746A (ja) * 2016-08-09 2018-02-15 京セラ株式会社 接着シート
CN106833511A (zh) * 2017-02-27 2017-06-13 苏州巨峰电气绝缘系统股份有限公司 一种高导热有机硅灌封胶及其制备方法和应用
JPWO2019189238A1 (ja) * 2018-03-28 2021-03-18 株式会社カネカ 接着剤組成物
JP7184874B2 (ja) 2018-03-28 2022-12-06 株式会社カネカ 接着剤組成物
CN111325071A (zh) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 光学粘合料及光学传感器模组
JP2020186327A (ja) * 2019-05-15 2020-11-19 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法
JP7234032B2 (ja) 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法
JP2021128913A (ja) * 2020-02-17 2021-09-02 昭和電工マテリアルズ株式会社 異方導電性接着フィルム、接続構造体及びその製造方法
JP7435001B2 (ja) 2020-02-17 2024-02-21 株式会社レゾナック 異方導電性接着フィルム、接続構造体及びその製造方法

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KR20100009545A (ko) 2010-01-27
KR101183317B1 (ko) 2012-09-14
TW200932861A (en) 2009-08-01
KR101130377B1 (ko) 2012-03-27
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JPWO2009051067A1 (ja) 2011-03-03
JP4930598B2 (ja) 2012-05-16

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