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WO2009051067A1 - Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body - Google Patents

Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body Download PDF

Info

Publication number
WO2009051067A1
WO2009051067A1 PCT/JP2008/068422 JP2008068422W WO2009051067A1 WO 2009051067 A1 WO2009051067 A1 WO 2009051067A1 JP 2008068422 W JP2008068422 W JP 2008068422W WO 2009051067 A1 WO2009051067 A1 WO 2009051067A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
circuit connecting
epoxy resin
connecting body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068422
Other languages
French (fr)
Japanese (ja)
Inventor
Masaru Tanaka
Takuya Chayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN200880111995A priority Critical patent/CN101828434A/en
Priority to JP2009538073A priority patent/JP4930598B2/en
Priority to KR1020097021232A priority patent/KR101130377B1/en
Priority to KR1020117017892A priority patent/KR101183317B1/en
Publication of WO2009051067A1 publication Critical patent/WO2009051067A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Provided is an adhesive composition for bonding circuit members with each other and for electrically connecting with each other circuit electrodes respectively provided on the circuit members. The adhesive component contains an epoxy resin, an epoxy resin curing agent, and silicone fine particles having a primary grain average diameter of 300nm or less.
PCT/JP2008/068422 2007-10-18 2008-10-10 Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body Ceased WO2009051067A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880111995A CN101828434A (en) 2007-10-18 2008-10-10 Adhesive composition, circuit connecting material using same, method for connecting circuit member, and circuit connected body
JP2009538073A JP4930598B2 (en) 2007-10-18 2008-10-10 Circuit connection material, circuit connection body and circuit member connection method
KR1020097021232A KR101130377B1 (en) 2007-10-18 2008-10-10 Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
KR1020117017892A KR101183317B1 (en) 2007-10-18 2008-10-10 Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-271263 2007-10-18
JP2007271263 2007-10-18
JP2008-050383 2008-02-29
JP2008050383 2008-02-29

Publications (1)

Publication Number Publication Date
WO2009051067A1 true WO2009051067A1 (en) 2009-04-23

Family

ID=40567334

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068422 Ceased WO2009051067A1 (en) 2007-10-18 2008-10-10 Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body

Country Status (5)

Country Link
JP (1) JP4930598B2 (en)
KR (2) KR101183317B1 (en)
CN (2) CN101828434A (en)
TW (1) TWI402321B (en)
WO (1) WO2009051067A1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (en) * 2009-04-28 2010-11-04 日立化成工業株式会社 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
JP2011006658A (en) * 2009-05-29 2011-01-13 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet for connection of circuit member, and process for manufacture of semiconductor device
JP2011080033A (en) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet, and method of manufacturing semiconductor device
CN102295892A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
CN102295893A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
CN102295894A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
JP2012023024A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
JP2012023025A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
JP2012023096A (en) * 2010-07-12 2012-02-02 Yokohama Rubber Co Ltd:The Conductive composition and solar cell
JP2012021140A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Circuit connecting adhesive film, circuit connecting structure using the same, and connecting method of circuit member
WO2012137335A1 (en) * 2011-04-07 2012-10-11 日立化成工業株式会社 Circuit connection material and use thereof, and connecting structure and method for producing same
KR101313939B1 (en) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 Circuit connecting adhesive film and use thereof, circuit connecting structure and method for manufacturing the same and circuit member connecting method
KR20140082696A (en) 2011-09-20 2014-07-02 히타치가세이가부시끼가이샤 Adhesive composition, adhesive film, adhesive sheet, circuitry connector, method for connecting circuitry member, use of adhesive composition, use of adhesive film, and use of adhesive sheet
CN106833511A (en) * 2017-02-27 2017-06-13 苏州巨峰电气绝缘系统股份有限公司 A kind of high heat conduction organosilicon filling and sealing gum and its preparation method and application
JP2018024746A (en) * 2016-08-09 2018-02-15 京セラ株式会社 Adhesive sheet
CN111325071A (en) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 Optical adhesive and optical sensor module
JP2020186327A (en) * 2019-05-15 2020-11-19 デクセリアルズ株式会社 Adhesive film production method, adhesive film, and connected body production method
JPWO2019189238A1 (en) * 2018-03-28 2021-03-18 株式会社カネカ Adhesive composition
JP2021128913A (en) * 2020-02-17 2021-09-02 昭和電工マテリアルズ株式会社 Anisotropic conductive adhesive film, connection structure, and manufacturing method thereof

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Publication number Priority date Publication date Assignee Title
JP5223946B2 (en) * 2010-06-14 2013-06-26 日立化成株式会社 Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
KR102713298B1 (en) * 2010-11-03 2024-10-04 알파 어셈블리 솔루션스 인크. Sintering materials and attachment methods using same
CN102709257B (en) * 2012-05-10 2015-08-19 三星半导体(中国)研究开发有限公司 Semiconductor plastic package material and manufacture method thereof and semiconductor package part
KR101640631B1 (en) * 2012-12-12 2016-07-18 제일모직주식회사 Adhesive film for polarizing plate, adhesive composition for the same, polarizing plate comprising the same and optical display apparatus comprising the same
WO2016060191A1 (en) * 2014-10-17 2016-04-21 太陽インキ製造株式会社 Dry film and flexible printed wiring board
CN112863732B (en) * 2014-10-29 2023-01-17 迪睿合株式会社 Method for manufacturing connection structure, and conductive material
WO2018105126A1 (en) * 2016-12-09 2018-06-14 日立化成株式会社 Composition, adhesive, sintered body, joined body, and method for producing joined body
WO2018105125A1 (en) * 2016-12-09 2018-06-14 日立化成株式会社 Composition, adhesive, sintered body, joined body, and method for producing joined body
KR102106996B1 (en) * 2017-12-28 2020-05-07 주식회사 노피온 Component mounting method using sheet containing solder particles
CN111902884B (en) * 2018-04-04 2023-03-14 积水化学工业株式会社 Conductive particle, method for producing same, conductive material, and connection structure
JP7445086B2 (en) * 2022-01-13 2024-03-06 古河電気工業株式会社 Film adhesive for flexible devices, adhesive sheet for flexible devices, and method for manufacturing flexible devices
CN116132890A (en) * 2023-01-29 2023-05-16 歌尔股份有限公司 Vibrating diaphragm for sound generating device, sound generating device and electronic equipment

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JP2003045235A (en) * 2001-07-27 2003-02-14 Mitsui Chemicals Inc Anisotropy conductive paste
JP2005512117A (en) * 2001-12-06 2005-04-28 バンティコ　アクチエンゲゼルシャフト Thermosetting resin composition
JP2006028521A (en) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd Addhesive for circuit connection
JP2007258141A (en) * 2006-02-27 2007-10-04 Hitachi Chem Co Ltd Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member

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TW383435B (en) * 1996-11-01 2000-03-01 Hitachi Chemical Co Ltd Electronic device
JPH10163254A (en) * 1996-12-03 1998-06-19 Hitachi Chem Co Ltd Circuit board
JPH11154687A (en) * 1997-09-18 1999-06-08 Hitachi Chem Co Ltd Circuit board
JP4747396B2 (en) * 2000-05-17 2011-08-17 日立化成工業株式会社 Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure
JP4055583B2 (en) * 2003-01-15 2008-03-05 日立化成工業株式会社 Adhesive composition for circuit connection, circuit terminal connection method using the same, and circuit terminal connection structure
JP5247968B2 (en) * 2003-12-02 2013-07-24 日立化成株式会社 Circuit connection material and circuit member connection structure using the same
US20060182949A1 (en) * 2005-02-17 2006-08-17 3M Innovative Properties Company Surfacing and/or joining method
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KR20110048079A (en) * 2005-11-18 2011-05-09 히다치 가세고교 가부시끼가이샤 Adhesive composition
JP5082296B2 (en) * 2005-12-19 2012-11-28 日立化成工業株式会社 Adhesive with wiring and circuit connection structure

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2003045235A (en) * 2001-07-27 2003-02-14 Mitsui Chemicals Inc Anisotropy conductive paste
JP2005512117A (en) * 2001-12-06 2005-04-28 バンティコ　アクチエンゲゼルシャフト Thermosetting resin composition
JP2006028521A (en) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd Addhesive for circuit connection
JP2007258141A (en) * 2006-02-27 2007-10-04 Hitachi Chem Co Ltd Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010125965A1 (en) * 2009-04-28 2010-11-04 日立化成工業株式会社 Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member
JP2011006658A (en) * 2009-05-29 2011-01-13 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet for connection of circuit member, and process for manufacture of semiconductor device
JP2011080033A (en) * 2009-05-29 2011-04-21 Hitachi Chem Co Ltd Adhesive composition, adhesive sheet, and method of manufacturing semiconductor device
KR101314007B1 (en) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 Circuit connecting adhesive film and use thereof, circuit connecting structure and method for manufacturing the same and circuit member connecting method
KR101380070B1 (en) * 2010-06-14 2014-04-01 히타치가세이가부시끼가이샤 Circuit connecting adhesive film and use thereof, circuit connecting structure and method for manufacturing the same and circuit member connecting method
CN102295894A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
JP2012023024A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
JP2012023025A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method
CN102295893A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
JP2012021140A (en) * 2010-06-14 2012-02-02 Hitachi Chem Co Ltd Circuit connecting adhesive film, circuit connecting structure using the same, and connecting method of circuit member
CN102382581A (en) * 2010-06-14 2012-03-21 日立化成工业株式会社 An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
CN102382580A (en) * 2010-06-14 2012-03-21 日立化成工业株式会社 An adhesive film for circuit connection, use thereof, a circuit connection structure, a manufacturing method thereof, and a connection method of a circuit member
KR101380043B1 (en) * 2010-06-14 2014-04-01 히타치가세이가부시끼가이샤 Circuit connecting adhesive film and use thereof, circuit connecting structure and method for manufacturing the same and circuit member connecting method
KR101313939B1 (en) * 2010-06-14 2013-10-01 히타치가세이가부시끼가이샤 Circuit connecting adhesive film and use thereof, circuit connecting structure and method for manufacturing the same and circuit member connecting method
CN102295892A (en) * 2010-06-14 2011-12-28 日立化成工业株式会社 Circuit connecting adhesive film and use thereof, structure body, manufacturing method and connection method thereof
JP2012023096A (en) * 2010-07-12 2012-02-02 Yokohama Rubber Co Ltd:The Conductive composition and solar cell
WO2012137335A1 (en) * 2011-04-07 2012-10-11 日立化成工業株式会社 Circuit connection material and use thereof, and connecting structure and method for producing same
KR20140082696A (en) 2011-09-20 2014-07-02 히타치가세이가부시끼가이샤 Adhesive composition, adhesive film, adhesive sheet, circuitry connector, method for connecting circuitry member, use of adhesive composition, use of adhesive film, and use of adhesive sheet
JP2017052956A (en) * 2011-09-20 2017-03-16 日立化成株式会社 Adhesive composition, film adhesive, adhesive sheet, circuit connector, circuit member connection method, use of adhesive composition, use of film adhesive and use of adhesive sheet
JP2018024746A (en) * 2016-08-09 2018-02-15 京セラ株式会社 Adhesive sheet
CN106833511A (en) * 2017-02-27 2017-06-13 苏州巨峰电气绝缘系统股份有限公司 A kind of high heat conduction organosilicon filling and sealing gum and its preparation method and application
JPWO2019189238A1 (en) * 2018-03-28 2021-03-18 株式会社カネカ Adhesive composition
JP7184874B2 (en) 2018-03-28 2022-12-06 株式会社カネカ adhesive composition
CN111325071A (en) * 2018-12-17 2020-06-23 上海箩箕技术有限公司 Optical adhesive and optical sensor module
JP2020186327A (en) * 2019-05-15 2020-11-19 デクセリアルズ株式会社 Adhesive film production method, adhesive film, and connected body production method
JP7234032B2 (en) 2019-05-15 2023-03-07 デクセリアルズ株式会社 Method for manufacturing adhesive film, method for manufacturing adhesive film, and connected body
JP2021128913A (en) * 2020-02-17 2021-09-02 昭和電工マテリアルズ株式会社 Anisotropic conductive adhesive film, connection structure, and manufacturing method thereof
JP7435001B2 (en) 2020-02-17 2024-02-21 株式会社レゾナック Anisotropic conductive adhesive film, connected structure and manufacturing method thereof

Also Published As

Publication number Publication date
JP4930598B2 (en) 2012-05-16
KR101130377B1 (en) 2012-03-27
CN104893655B (en) 2020-06-16
TW200932861A (en) 2009-08-01
KR101183317B1 (en) 2012-09-14
KR20100009545A (en) 2010-01-27
KR20110099793A (en) 2011-09-08
TWI402321B (en) 2013-07-21
JPWO2009051067A1 (en) 2011-03-03
CN104893655A (en) 2015-09-09
CN101828434A (en) 2010-09-08

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