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WO2008133229A1 - ケイ素含有化合物、硬化性組成物及び硬化物 - Google Patents

ケイ素含有化合物、硬化性組成物及び硬化物 Download PDF

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Publication number
WO2008133229A1
WO2008133229A1 PCT/JP2008/057665 JP2008057665W WO2008133229A1 WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1 JP 2008057665 W JP2008057665 W JP 2008057665W WO 2008133229 A1 WO2008133229 A1 WO 2008133229A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon
containing compound
curable composition
general formula
compound represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057665
Other languages
English (en)
French (fr)
Inventor
Takashi Sueyoshi
Ken-Ichiro Hiwatari
Tadashi Janado
Yoshikazu Shoji
Seiichi Saito
Yoshitaka Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Kansai Electric Power Co Inc
Original Assignee
Adeka Corp
Kansai Electric Power Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp, Kansai Electric Power Co Inc filed Critical Adeka Corp
Priority to CN2008800122001A priority Critical patent/CN101657491B/zh
Priority to EP08740710.2A priority patent/EP2141188B1/en
Priority to US12/596,933 priority patent/US8003736B2/en
Priority to KR1020097021058A priority patent/KR101437664B1/ko
Publication of WO2008133229A1 publication Critical patent/WO2008133229A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)

Abstract

　本発明のケイ素含有化合物は、下記一般式（１）で表されるものである。本発明の硬化性組成物は、下記一般式（１）におけるＺが水素原子である該ケイ素含有化合物、ＺがＣ2-4アルケニル基又はアルキニル基である該ケイ素含有化合物、及びヒドロシリル化反応触媒を含有してなるものであり、ハンドリング性及び硬化性に優れ、得られる硬化物が耐熱性及び可撓性に優れる。 （式中、Ｒa～ＲgはＣ1-12飽和脂肪族炭化水素基又はＣ6-12芳香族炭化水素基であり（但し、Ｒe及びＲfは同時にＣ1-12飽和脂肪族炭化水素基となることはない）、ＹはＣ2-4アルキレン基であり、Ｚは水素原子又はＣ2-4アルケニル基若しくはアルキニル基であり、Ｋは２～７の数であり、Ｔは１～７の数であり、Ｐは０～３の数である。Ｍ及びＮは、Ｎ：Ｍ＝１：１～１：１００且つ全てのＭと全てのＮの合計が１５以上となる数であって、且つ質量平均分子量を３０００～１００万とする数である。）
PCT/JP2008/057665 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物 Ceased WO2008133229A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800122001A CN101657491B (zh) 2007-04-23 2008-04-21 含硅化合物、固化性组合物及固化物
EP08740710.2A EP2141188B1 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product
US12/596,933 US8003736B2 (en) 2007-04-23 2008-04-21 Silicon-containing compound, curable composition and cured product
KR1020097021058A KR101437664B1 (ko) 2007-04-23 2008-04-21 규소함유 화합물, 경화성 조성물 및 경화물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007112738A JP5248033B2 (ja) 2007-04-23 2007-04-23 ケイ素含有化合物、硬化性組成物及び硬化物
JP2007-112738 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008133229A1 true WO2008133229A1 (ja) 2008-11-06

Family

ID=39925680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057665 Ceased WO2008133229A1 (ja) 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物

Country Status (7)

Country Link
US (1) US8003736B2 (ja)
EP (1) EP2141188B1 (ja)
JP (1) JP5248033B2 (ja)
KR (1) KR101437664B1 (ja)
CN (1) CN101657491B (ja)
TW (1) TWI424005B (ja)
WO (1) WO2008133229A1 (ja)

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WO2012014560A1 (ja) * 2010-07-27 2012-02-02 株式会社Adeka 半導体封止用硬化性組成物
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物

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JP5393373B2 (ja) * 2009-09-16 2014-01-22 関西電力株式会社 半導体装置
JP2011222869A (ja) * 2010-04-13 2011-11-04 Kansai Electric Power Co Inc:The 半導体装置
EP2581417A4 (en) * 2010-06-11 2015-06-24 Adeka Corp SILICATE-HARDENED COMPOSITION, CURED PRODUCT, MADE FROM SILICONE-CONTAINING CURRENT COMPOSITION, AND CIRCULAR PLATE SUPPLY MOLDED FROM SILICLE-CONTAINING HARDENING COMPOSITION
JP2013539484A (ja) * 2010-08-05 2013-10-24 バイオフィルム・アイピー・リミテッド・ライアビリティ・カンパニー シクロシロキサン置換ポリシロキサン化合物、該化合物を含有する組成物およびそれらの使用法
JP5781511B2 (ja) * 2011-02-04 2015-09-24 株式会社Adeka ヒンダードアミン骨格を有する化合物及び樹脂組成物
MY163345A (en) 2011-08-10 2017-09-15 Adeka Corp Silicon-containing curing composition and cured product thereof
TWI525184B (zh) 2011-12-16 2016-03-11 拜歐菲樂Ｉｐ有限責任公司 低溫注射組成物，用於低溫調節導管中流量之系統及方法
US8728568B2 (en) 2012-01-16 2014-05-20 Itron, Inc. Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier
US8481626B1 (en) 2012-01-16 2013-07-09 Itron, Inc. Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits
KR20150021099A (ko) * 2012-06-06 2015-02-27 헨켈 아이피 앤드 홀딩 게엠베하 비닐 카르보실록산 수지
US9518073B2 (en) 2013-04-12 2016-12-13 Milliken & Company Siloxane compound and process for producing the same
US9422317B2 (en) 2013-04-12 2016-08-23 Milliken & Company Siloxane compound and process for producing the same
US9388284B2 (en) * 2013-04-12 2016-07-12 Milliken & Company Cross-linked silicone polymer and process for producing the same
US9530946B2 (en) * 2013-04-12 2016-12-27 Milliken & Company Light emitting diode
US9334294B2 (en) 2013-04-12 2016-05-10 Milliken & Company Siloxane compound and process for producing the same
WO2015190644A1 (ko) * 2014-06-10 2015-12-17 한국과학기술원 세포배양 기판, 이의 제조방법 및 용도
CN108137810A (zh) * 2015-11-04 2018-06-08 美国陶氏有机硅公司 制备有机硅氧烷的方法
KR102590498B1 (ko) * 2016-02-19 2023-10-19 삼성디스플레이 주식회사 플렉서블 표시장치, 윈도우 부재의 제조방법 및 하드 코팅 조성물
EP3555213B1 (en) 2016-12-19 2022-01-26 Saint-Gobain Performance Plastics Corporation Silicone-based composition and article made therefrom
KR102812184B1 (ko) * 2023-12-26 2025-05-26 피씨케이(주) 연료전지 개스킷용 접착제 조성물

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Cited By (14)

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Publication number Priority date Publication date Assignee Title
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2016153512A (ja) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2012014560A1 (ja) * 2010-07-27 2012-02-02 株式会社Adeka 半導体封止用硬化性組成物
US8470937B2 (en) 2010-07-27 2013-06-25 Adeka Corporation Curable composition for semiconductor encapsulation
JPWO2012014560A1 (ja) * 2010-07-27 2013-09-12 株式会社Adeka 半導体封止用硬化性組成物
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
US9243007B2 (en) 2011-03-30 2016-01-26 Asahi Kasei Chemicals Corporation Organopolysiloxane, method for producing the same, and curable resin composition containing the organopolysiloxane
JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2012237801A (ja) * 2011-05-10 2012-12-06 Sumitomo Electric Ind Ltd 光ファイバ
US9297950B2 (en) 2011-05-10 2016-03-29 Sumitomo Electric Industries, Ltd. Optical fiber
WO2012153821A1 (ja) * 2011-05-10 2012-11-15 住友電気工業株式会社 光ファイバ
JP2013057732A (ja) * 2011-09-07 2013-03-28 Adeka Corp 光ファイバ
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
JPWO2015012141A1 (ja) * 2013-07-24 2017-03-02 株式会社Adeka 硬化性樹脂組成物

Also Published As

Publication number Publication date
CN101657491B (zh) 2012-05-23
EP2141188A4 (en) 2010-08-04
KR101437664B1 (ko) 2014-09-04
EP2141188B1 (en) 2014-04-23
JP5248033B2 (ja) 2013-07-31
JP2008266484A (ja) 2008-11-06
TW200911885A (en) 2009-03-16
US20100179283A1 (en) 2010-07-15
CN101657491A (zh) 2010-02-24
US8003736B2 (en) 2011-08-23
TWI424005B (zh) 2014-01-21
KR20090130035A (ko) 2009-12-17
EP2141188A1 (en) 2010-01-06

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