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WO2008133211A1 - Composé thermiquement conducteur et son procédé de production - Google Patents

Composé thermiquement conducteur et son procédé de production Download PDF

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Publication number
WO2008133211A1
WO2008133211A1 PCT/JP2008/057619 JP2008057619W WO2008133211A1 WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1 JP 2008057619 W JP2008057619 W JP 2008057619W WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive compound
powders
kneading
vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057619
Other languages
English (en)
Japanese (ja)
Inventor
Jyunji Sugino
Hiroaki Sawa
Mitsuru Shiiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of WO2008133211A1 publication Critical patent/WO2008133211A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un composé thermiquement conducteur dont la résistance au transfert thermique est faible et la résistance thermique est satisfaisante, qui évite les fuites d'huile, peut être utilisé même dans un grand espace et conserve sa forme. Le composé thermiquement conducteur est obtenu en malaxant une composition de résine comprenant (A) 30 à 60 % en volume de silicone liquide thermodurcissable et (B) 40 à 70 % en volume d'une ou plusieurs poudres thermiquement conductrices choisies dans le groupe constitué par les poudres d'oxyde d'aluminium, d'hydroxyde d'aluminium, d'oxyde de zinc, de silice, de nitrure de silicium et de nitrure de bore, le malaxage étant réalisé soit après la réaction et le durcissement de la silicone liquide thermodurcissable (A), soit en même temps que la réaction et le durcissement. En particulier, le composé thermiquement conducteur contient des poudres thermiquement conductrices possédant un diamètre moyen de particule de 5 µm à 70 µm. L'invention décrit également une pièce de circuit électronique utilisant le composé thermiquement conducteur, et un appareil électrique domestique, un appareil de bureautique ou un véhicule à moteur dans lesquels la pièce de circuit électronique est incorporée.
PCT/JP2008/057619 2007-04-20 2008-04-18 Composé thermiquement conducteur et son procédé de production Ceased WO2008133211A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007111106A JP2010155870A (ja) 2007-04-20 2007-04-20 熱伝導性コンパウンドおよびその製造方法
JP2007-111106 2007-04-20

Publications (1)

Publication Number Publication Date
WO2008133211A1 true WO2008133211A1 (fr) 2008-11-06

Family

ID=39925665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057619 Ceased WO2008133211A1 (fr) 2007-04-20 2008-04-18 Composé thermiquement conducteur et son procédé de production

Country Status (3)

Country Link
JP (1) JP2010155870A (fr)
TW (1) TW200911924A (fr)
WO (1) WO2008133211A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100093493A (ko) * 2009-02-16 2010-08-25 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 반도체 배열체
WO2012029538A1 (fr) * 2010-08-31 2012-03-08 東レ・ダウコーニング株式会社 Composition de polysiloxane et produit durci de ladite composition
JP4899137B2 (ja) * 2008-07-17 2012-03-21 ニホンハンダ株式会社 熱伝導性オイル組成物、放熱剤及び電子機器
CN103333494A (zh) * 2013-05-28 2013-10-02 东莞上海大学纳米技术研究院 一种导热绝缘硅橡胶热界面材料及其制备方法
CN106935342A (zh) * 2009-12-04 2017-07-07 Abb研究有限公司 高压电涌避雷器
CN107841282A (zh) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 一种导热灌封胶及其制备方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5418298B2 (ja) * 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
EP3299420A4 (fr) * 2015-05-22 2019-01-09 Momentive Performance Materials Japan LLC Composition thermoconductrice
WO2016190188A1 (fr) * 2015-05-22 2016-12-01 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Composition thermoconductrice
JP7070146B2 (ja) * 2018-06-25 2022-05-18 株式会社リコー 光源モジュール、及び光学装置
JP2020176201A (ja) * 2019-04-18 2020-10-29 信越化学工業株式会社 熱伝導性樹脂組成物及び熱伝導性樹脂硬化物
JP2021088621A (ja) * 2019-12-02 2021-06-10 信越化学工業株式会社 窒化ホウ素凝集粉を用いた熱伝導性樹脂組成物及び熱伝導性樹脂硬化物
CN114667319B (zh) * 2020-09-03 2025-02-18 富士高分子工业株式会社 导热性有机硅凝胶组合物、导热性有机硅片材及其制造方法
WO2022049815A1 (fr) * 2020-09-03 2022-03-10 富士高分子工業株式会社 Composition de gel de silicone thermoconductrice, feuille de silicone thermoconductrice, et leurs procédés de production

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121387A (ja) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk 高分子材料成形体とその用途
JPH1121388A (ja) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk 高分子材料成形体とその用途
JPH1187958A (ja) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JPH1187580A (ja) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JPH11121953A (ja) * 1997-10-16 1999-04-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JP2001230353A (ja) * 2000-02-17 2001-08-24 Denki Kagaku Kogyo Kk 放熱部材
JP2004363272A (ja) * 2003-06-04 2004-12-24 Denki Kagaku Kogyo Kk 放熱部材
JP2005209765A (ja) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk 混合粉末及びその用途

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121387A (ja) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk 高分子材料成形体とその用途
JPH1121388A (ja) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk 高分子材料成形体とその用途
JPH1187958A (ja) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JPH1187580A (ja) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JPH11121953A (ja) * 1997-10-16 1999-04-30 Denki Kagaku Kogyo Kk 放熱スペーサー
JP2001230353A (ja) * 2000-02-17 2001-08-24 Denki Kagaku Kogyo Kk 放熱部材
JP2004363272A (ja) * 2003-06-04 2004-12-24 Denki Kagaku Kogyo Kk 放熱部材
JP2005209765A (ja) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk 混合粉末及びその用途

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4899137B2 (ja) * 2008-07-17 2012-03-21 ニホンハンダ株式会社 熱伝導性オイル組成物、放熱剤及び電子機器
KR20100093493A (ko) * 2009-02-16 2010-08-25 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 반도체 배열체
JP2010199578A (ja) * 2009-02-16 2010-09-09 Semikron Elektronik Gmbh & Co Kg 半導体装置
KR101630879B1 (ko) 2009-02-16 2016-06-15 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 반도체 배열체
CN106935342A (zh) * 2009-12-04 2017-07-07 Abb研究有限公司 高压电涌避雷器
WO2012029538A1 (fr) * 2010-08-31 2012-03-08 東レ・ダウコーニング株式会社 Composition de polysiloxane et produit durci de ladite composition
CN103180393A (zh) * 2010-08-31 2013-06-26 道康宁东丽株式会社 聚硅氧烷组合物及其固化物
JP5856060B2 (ja) * 2010-08-31 2016-02-09 東レ・ダウコーニング株式会社 ポリシロキサン組成物及びその硬化物
US9328242B2 (en) 2010-08-31 2016-05-03 Dow Corning Toray Co., Ltd. Polysiloxane composition and cured product thereof
CN103333494A (zh) * 2013-05-28 2013-10-02 东莞上海大学纳米技术研究院 一种导热绝缘硅橡胶热界面材料及其制备方法
CN103333494B (zh) * 2013-05-28 2015-08-05 东莞上海大学纳米技术研究院 一种导热绝缘硅橡胶热界面材料及其制备方法
CN107841282A (zh) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 一种导热灌封胶及其制备方法

Also Published As

Publication number Publication date
JP2010155870A (ja) 2010-07-15
TW200911924A (en) 2009-03-16

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