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WO2008133211A1 - Thermally conductive compound and process for producing the same - Google Patents

Thermally conductive compound and process for producing the same Download PDF

Info

Publication number
WO2008133211A1
WO2008133211A1 PCT/JP2008/057619 JP2008057619W WO2008133211A1 WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1 JP 2008057619 W JP2008057619 W JP 2008057619W WO 2008133211 A1 WO2008133211 A1 WO 2008133211A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive compound
powders
kneading
vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057619
Other languages
French (fr)
Japanese (ja)
Inventor
Jyunji Sugino
Hiroaki Sawa
Mitsuru Shiiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of WO2008133211A1 publication Critical patent/WO2008133211A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A thermally conductive compound which has low heat transfer resistance and satisfactory heat resistance, is free from oil bleeding, can be used even in a wide gap, and has shape retentivity. The thermally conductive compound is obtained by kneading a resin composition comprising (A) 30-60 vol.% thermosetting liquid silicone and (B) 40-70 vol.% one or more thermally conductive powders selected from the group consisting of powders of aluminum oxide, aluminum hydroxide, zinc oxide, silica, silicon nitride, and boron nitride, the kneading being conducted either after the thermosetting liquid silicone (A) is reacted and cured or simultaneously with the reaction and curing. In particular, the thermally conductive compound is one in which the thermally conductive powders have an average particle diameter of 5-70 µm. Also provided are: an electronic circuit part employing the thermally conductive compound; and a domestic electrical appliance, OA apparatus, or motor vehicle each having the electronic circuit part incorporated therein.
PCT/JP2008/057619 2007-04-20 2008-04-18 Thermally conductive compound and process for producing the same Ceased WO2008133211A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-111106 2007-04-20
JP2007111106A JP2010155870A (en) 2007-04-20 2007-04-20 Thermally conductive compound and method for producing the same

Publications (1)

Publication Number Publication Date
WO2008133211A1 true WO2008133211A1 (en) 2008-11-06

Family

ID=39925665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057619 Ceased WO2008133211A1 (en) 2007-04-20 2008-04-18 Thermally conductive compound and process for producing the same

Country Status (3)

Country Link
JP (1) JP2010155870A (en)
TW (1) TW200911924A (en)
WO (1) WO2008133211A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100093493A (en) * 2009-02-16 2010-08-25 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Semiconductor arrangement
WO2012029538A1 (en) * 2010-08-31 2012-03-08 東レ・ダウコーニング株式会社 Polysiloxane composition, and cured product thereof
JP4899137B2 (en) * 2008-07-17 2012-03-21 ニホンハンダ株式会社 Thermally conductive oil composition, heat radiation agent and electronic device
CN103333494A (en) * 2013-05-28 2013-10-02 东莞上海大学纳米技术研究院 Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof
CN106935342A (en) * 2009-12-04 2017-07-07 Abb研究有限公司 High voltage surge arrester
CN107841282A (en) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 A kind of heat conduction casting glue and preparation method thereof

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5418298B2 (en) * 2010-02-26 2014-02-19 信越化学工業株式会社 Thermally conductive silicone composition and cured product thereof
CN107532000B (en) * 2015-05-22 2021-07-13 迈图高新材料日本合同公司 Thermally conductive composition
KR102544366B1 (en) * 2015-05-22 2023-06-19 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 thermally conductive composition
JP7070146B2 (en) * 2018-06-25 2022-05-18 株式会社リコー Light source module and optical device
JP2020176201A (en) * 2019-04-18 2020-10-29 信越化学工業株式会社 Thermally conductive resin composition and cured product of thermally conductive resin
JP2021088621A (en) * 2019-12-02 2021-06-10 信越化学工業株式会社 Heat-conductive resin composition using boron nitride aggregate powder and heat-conductive resin cured product
KR20230059675A (en) * 2020-09-03 2023-05-03 후지고분시고오교오가부시끼가이샤 Thermally conductive silicone gel composition, thermally conductive silicone sheet and manufacturing method thereof
WO2022049815A1 (en) * 2020-09-03 2022-03-10 富士高分子工業株式会社 Thermally conductive silicone gel composition, thermally conductive silicone sheet, and production methods therefor

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121388A (en) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk Polymeric material molding and its use
JPH1121387A (en) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk Polymeric material molding and its use
JPH1187580A (en) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk Heat-dissipating spacer
JPH1187958A (en) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk Cooling spacer
JPH11121953A (en) * 1997-10-16 1999-04-30 Denki Kagaku Kogyo Kk Heat dissipating spacer
JP2001230353A (en) * 2000-02-17 2001-08-24 Denki Kagaku Kogyo Kk Heat dissipation member
JP2004363272A (en) * 2003-06-04 2004-12-24 Denki Kagaku Kogyo Kk Heat dissipation member
JP2005209765A (en) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk Mixed powder and its use

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1121388A (en) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk Polymeric material molding and its use
JPH1121387A (en) * 1997-07-02 1999-01-26 Denki Kagaku Kogyo Kk Polymeric material molding and its use
JPH1187580A (en) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk Heat-dissipating spacer
JPH1187958A (en) * 1997-09-11 1999-03-30 Denki Kagaku Kogyo Kk Cooling spacer
JPH11121953A (en) * 1997-10-16 1999-04-30 Denki Kagaku Kogyo Kk Heat dissipating spacer
JP2001230353A (en) * 2000-02-17 2001-08-24 Denki Kagaku Kogyo Kk Heat dissipation member
JP2004363272A (en) * 2003-06-04 2004-12-24 Denki Kagaku Kogyo Kk Heat dissipation member
JP2005209765A (en) * 2004-01-21 2005-08-04 Denki Kagaku Kogyo Kk Mixed powder and its use

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4899137B2 (en) * 2008-07-17 2012-03-21 ニホンハンダ株式会社 Thermally conductive oil composition, heat radiation agent and electronic device
KR20100093493A (en) * 2009-02-16 2010-08-25 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Semiconductor arrangement
JP2010199578A (en) * 2009-02-16 2010-09-09 Semikron Elektronik Gmbh & Co Kg Semiconductor device
KR101630879B1 (en) 2009-02-16 2016-06-15 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Semiconductor arrangement
CN106935342A (en) * 2009-12-04 2017-07-07 Abb研究有限公司 High voltage surge arrester
WO2012029538A1 (en) * 2010-08-31 2012-03-08 東レ・ダウコーニング株式会社 Polysiloxane composition, and cured product thereof
CN103180393A (en) * 2010-08-31 2013-06-26 道康宁东丽株式会社 Polysiloxane composition, and cured product thereof
JP5856060B2 (en) * 2010-08-31 2016-02-09 東レ・ダウコーニング株式会社 Polysiloxane composition and cured product thereof
US9328242B2 (en) 2010-08-31 2016-05-03 Dow Corning Toray Co., Ltd. Polysiloxane composition and cured product thereof
CN103333494A (en) * 2013-05-28 2013-10-02 东莞上海大学纳米技术研究院 Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof
CN103333494B (en) * 2013-05-28 2015-08-05 东莞上海大学纳米技术研究院 A kind of Thermal-conductive insulation silicone rubber thermal interface material and preparation method thereof
CN107841282A (en) * 2016-09-19 2018-03-27 阿特斯(中国)投资有限公司 A kind of heat conduction casting glue and preparation method thereof

Also Published As

Publication number Publication date
TW200911924A (en) 2009-03-16
JP2010155870A (en) 2010-07-15

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