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WO2008133138A1 - 多面体構造ポリシロキサン変性体および該変性体を用いた組成物 - Google Patents

多面体構造ポリシロキサン変性体および該変性体を用いた組成物 Download PDF

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Publication number
WO2008133138A1
WO2008133138A1 PCT/JP2008/057415 JP2008057415W WO2008133138A1 WO 2008133138 A1 WO2008133138 A1 WO 2008133138A1 JP 2008057415 W JP2008057415 W JP 2008057415W WO 2008133138 A1 WO2008133138 A1 WO 2008133138A1
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WO
WIPO (PCT)
Prior art keywords
modified product
composition
polyhedral polysiloxane
disclosed
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057415
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English (en)
French (fr)
Inventor
Takao Manabe
Makoto Seino
Shinya Mizuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US12/450,905 priority Critical patent/US8399592B2/en
Priority to EP08740494.3A priority patent/EP2151443B1/en
Priority to EP18172761.1A priority patent/EP3378867B1/en
Priority to JP2009511822A priority patent/JP5536448B2/ja
Priority to EP20152225.7A priority patent/EP3656778A1/en
Priority to EP16153564.6A priority patent/EP3042909B1/en
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of WO2008133138A1 publication Critical patent/WO2008133138A1/ja
Anticipated expiration legal-status Critical
Priority to US13/770,089 priority patent/US9035009B2/en
Priority to US14/689,424 priority patent/US9422405B2/en
Priority to US14/689,454 priority patent/US9416231B2/en
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/21—Cyclic compounds having at least one ring containing silicon, but no carbon in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Optical Integrated Circuits (AREA)
  • Epoxy Resins (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

　成型加工性、透明性に優れる液状の多面体構造ポリシロキサン変性体および該変性体を用いた組成物を提供する。また取り扱い性の良い変性体、組成物が提供できる。 　アルケニル基および／またはヒドロシリル基を含有する多面体構造ポリシロキサン系化合物（ａ）に対して、前記（ａ）成分とヒドロシリル化反応可能なヒドロシリル基および／またはアルケニル基を有する化合物（ｂ）を変性して得られた多面体構造ポリシロキサン変性体、および、該変性を含有する組成物。
PCT/JP2008/057415 2007-04-17 2008-04-16 多面体構造ポリシロキサン変性体および該変性体を用いた組成物 Ceased WO2008133138A1 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP08740494.3A EP2151443B1 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
EP18172761.1A EP3378867B1 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
JP2009511822A JP5536448B2 (ja) 2007-04-17 2008-04-16 多面体構造ポリシロキサン変性体および該変性体を用いた組成物
EP20152225.7A EP3656778A1 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
EP16153564.6A EP3042909B1 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
US12/450,905 US8399592B2 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
US13/770,089 US9035009B2 (en) 2007-04-17 2013-02-19 Polyhedral polysiloxane modified product and composition using the modified product
US14/689,424 US9422405B2 (en) 2007-04-17 2015-04-17 Polyhedral polysiloxane modified product and composition using the modified product
US14/689,454 US9416231B2 (en) 2007-04-17 2015-04-17 Polyhedral polysiloxane modified product and composition using the modified product

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
JP2007108583 2007-04-17
JP2007-108583 2007-04-17
JP2007134431 2007-05-21
JP2007-134431 2007-05-21
JP2007336850 2007-12-27
JP2007-336850 2007-12-27
JP2008013185 2008-01-23
JP2008-013184 2008-01-23
JP2008-013185 2008-01-23
JP2008013182 2008-01-23
JP2008-013180 2008-01-23
JP2008013179 2008-01-23
JP2008013183 2008-01-23
JP2008-013183 2008-01-23
JP2008-013198 2008-01-23
JP2008-013179 2008-01-23
JP2008013198 2008-01-23
JP2008-013182 2008-01-23
JP2008013180 2008-01-23
JP2008013184 2008-01-23

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/450,905 A-371-Of-International US8399592B2 (en) 2007-04-17 2008-04-16 Polyhedral polysiloxane modified product and composition using the modified product
US13/770,089 Division US9035009B2 (en) 2007-04-17 2013-02-19 Polyhedral polysiloxane modified product and composition using the modified product

Publications (1)

Publication Number Publication Date
WO2008133138A1 true WO2008133138A1 (ja) 2008-11-06

Family

ID=39925594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057415 Ceased WO2008133138A1 (ja) 2007-04-17 2008-04-16 多面体構造ポリシロキサン変性体および該変性体を用いた組成物

Country Status (4)

Country Link
US (4) US8399592B2 (ja)
EP (5) EP3656778A1 (ja)
JP (5) JP5536448B2 (ja)
WO (1) WO2008133138A1 (ja)

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JPWO2008066116A1 (ja) * 2006-12-01 2010-03-11 株式会社カネカ ポリシロキサン系組成物
WO2010038767A1 (ja) * 2008-10-02 2010-04-08 株式会社カネカ 光硬化性組成物および硬化物
JP2010254814A (ja) * 2009-04-24 2010-11-11 Chisso Corp 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物
JP2010254927A (ja) * 2009-04-28 2010-11-11 Kaneka Corp 光硬化可能な組成物
JP2011016968A (ja) * 2009-07-10 2011-01-27 Kaneka Corp 多面体構造ポリシロキサン変性体、その製造方法および該変性体を含む組成物
JP2011052093A (ja) * 2009-09-01 2011-03-17 Kaneka Corp 多面体構造ポリシロキサン変性体およびこれから得られる組成物
JP2011068753A (ja) * 2009-09-25 2011-04-07 Kaneka Corp 多面体構造ポリシロキサン系変性体及び組成物
JP2011068752A (ja) * 2009-09-25 2011-04-07 Kaneka Corp ポリシロキサン系組成物およびそれから得られる硬化物、絶縁膜
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JP2019127505A (ja) * 2018-01-22 2019-08-01 株式会社カネカ ポリシロキサン系組成物。
US20220073801A1 (en) * 2018-12-27 2022-03-10 Nissan Chemical Corporation Adhesive composition for optical irradiation peeling, laminate body, and laminate body production method and peeling method
CN109942221A (zh) * 2019-03-13 2019-06-28 苏州科技大学 硅烷改性氧化石墨烯化学修饰型聚羧酸减水剂及其制备方法
JP2021052119A (ja) * 2019-09-26 2021-04-01 富士フイルム株式会社 Ｌｅｄ発光素子用反射基板、及びｌｅｄパッケージ
CN116568759B (zh) * 2020-11-20 2025-11-14 捷恩智株式会社 有机聚硅氧烷与其制造方法、包含其的分散剂、以及包含有机聚硅氧烷作为分散剂的分散液
WO2022168804A1 (ja) * 2021-02-05 2022-08-11 東亞合成株式会社 無機物質層積層用アンダーコート剤組成物、その硬化物及びその製造方法
KR102650741B1 (ko) * 2021-04-27 2024-03-26 다우 실리콘즈 코포레이션 라디칼 경화된 실리콘 감압성 접착제 및 조성물 및 이의 제조 방법 및 가요성 디스플레이 장치에서의 용도
CN113402866B (zh) * 2021-07-08 2022-09-27 长春工业大学 一种基于形状记忆调控药物释放的聚合物
TW202413476A (zh) * 2022-07-07 2024-04-01 日商積水化學工業股份有限公司 硬化性樹脂組成物及有機el顯示元件用密封劑
CN116284789A (zh) * 2023-02-09 2023-06-23 上海普信高分子材料有限公司 一种环氧基含镧聚倍半硅氧烷阻燃材料的制备方法
WO2024259430A1 (en) * 2023-06-16 2024-12-19 Acuity Polymers, Inc. Transparent polymeric materials with high oxygen diffusion that are free of the element fluorine

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939576A (en) * 1998-01-05 1999-08-17 The United States Of America As Represented By The Secretary Of The Air Force Method of functionalizing polycyclic silicones and the compounds so formed
WO2003042292A2 (de) * 2001-11-17 2003-05-22 Creavis Gesellschaft Für Technologie Und Innovation Mbh Polyolefinzusammensetzungen, verfahren zu deren herstellung und verwendung dieser zusammensetzungen
WO2004011525A1 (en) 2002-07-30 2004-02-05 University Of Connecticut Nonionic telechelic polymers incorporating polyhedral oligosilsesquioxane (poss) and uses thereof
WO2004022231A1 (en) * 2002-09-04 2004-03-18 Johnson Matthey Plc Catalysts
WO2004024741A1 (ja) * 2002-09-13 2004-03-25 Chisso Corporation シルセスキオキサン誘導体およびその製造方法
JP2004143449A (ja) 2002-09-30 2004-05-20 Nippon Steel Chem Co Ltd 官能基を有するかご型シルセスキオキサン樹脂とその製造方法
JP2004529984A (ja) 2000-10-27 2004-09-30 ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン 有機／無機ナノ複合体用の十分に規定されたナノサイズの構築ブロック
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005023256A (ja) 2003-07-04 2005-01-27 Toagosei Co Ltd カチオン硬化性組成物
JP2006022207A (ja) 2004-07-08 2006-01-26 Chisso Corp ケイ素化合物
JP2006233155A (ja) * 2005-02-28 2006-09-07 Chisso Corp 平坦化膜用塗布液および平坦化膜
JP2006269402A (ja) 2005-02-28 2006-10-05 Fuji Photo Film Co Ltd 絶縁材料形成用組成物および絶縁膜

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3159662A (en) 1962-07-02 1964-12-01 Gen Electric Addition reaction
ES305034A1 (es) 1963-10-18 1965-04-01 Ciba Geigy Procedimiento para endurecer compuestos poliepoxidos cicloalifaticos
US3708296A (en) 1968-08-20 1973-01-02 American Can Co Photopolymerization of epoxy monomers
US3586616A (en) 1969-03-14 1971-06-22 Minnesota Mining & Mfg Bis(perfluoroalkylsulfonyl)methane metal salts in cationic polymerization
US4058400A (en) 1974-05-02 1977-11-15 General Electric Company Cationically polymerizable compositions containing group VIa onium salts
US4161478A (en) 1974-05-02 1979-07-17 General Electric Company Photoinitiators
GB1512981A (en) 1974-05-02 1978-06-01 Gen Electric Curable epoxide compositions
JPS604640B2 (ja) 1975-07-30 1985-02-05 ソニー株式会社 擬似頭
US4256828A (en) 1975-09-02 1981-03-17 Minnesota Mining And Manufacturing Company Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
US4231951A (en) 1978-02-08 1980-11-04 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
US4139655A (en) 1978-05-09 1979-02-13 W. R. Grace & Co. Photocurable epoxy compositions containing thiopyrylium salts
US4618657A (en) * 1985-03-11 1986-10-21 Desoto, Inc. Heat curable polysiloxane release coatings which stratify when baked and paper coated therewith
EP0348705A3 (de) 1988-06-29 1991-02-27 Akademie der Wissenschaften der DDR Organophile Doppelringkieselsäurederivate mit käfigartigen Strukturen, Verfahren zu ihrer Herstellung und ihre Verwendung
DE3837397A1 (de) 1988-11-03 1990-05-10 Wacker Chemie Gmbh Neue organooligosilsesquioxane
US5160787A (en) * 1989-01-12 1992-11-03 Mitsubishi Gas Chemical Company, Inc. Electrical laminate having ability to absorb ultraviolet rays
DE4316101A1 (de) 1993-05-13 1994-11-17 Wacker Chemie Gmbh Organosiliciumverbindungen mit käfigartiger Struktur
US5554664A (en) 1995-03-06 1996-09-10 Minnesota Mining And Manufacturing Company Energy-activatable salts with fluorocarbon anions
JPH11124502A (ja) 1997-08-21 1999-05-11 Kanegafuchi Chem Ind Co Ltd 封止材料用硬化性組成物
JPH1171462A (ja) 1997-08-29 1999-03-16 Toshiba Silicone Co Ltd 新規な含ケイ素重合体
JP3511127B2 (ja) 1997-11-05 2004-03-29 信越化学工業株式会社 接着性シリコーン組成物
JP2979145B1 (ja) 1998-11-18 1999-11-15 工業技術院長 新型含シルセスキオキサンポリマー及びその製造方法
JP2000265066A (ja) 1999-03-17 2000-09-26 Dow Corning Asia Ltd 有機溶剤可溶性の水素化オクタシルセスキオキサン−ビニル基含有化合物共重合体及び同共重合体からなる絶縁材料
US6252030B1 (en) 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
US7553904B2 (en) 1999-08-04 2009-06-30 Hybrid Plastics, Inc. High use temperature nanocomposite resins
US6623711B2 (en) 2001-03-27 2003-09-23 Samsung Electronics Co., Ltd. Siloxane-based resin and method for forming insulating film between interconnect layers in semiconductor devices by using the same
JP2002363414A (ja) 2001-06-12 2002-12-18 Asahi Kasei Corp 籠状シルセスキオキサン含有組成物
JP4381636B2 (ja) 2001-11-05 2009-12-09 新日鐵化学株式会社 シリコーン樹脂組成物及びシリコーン樹脂成形体
JP4142385B2 (ja) 2002-10-03 2008-09-03 新日鐵化学株式会社 シリコーン樹脂組成物及びシリコーン樹脂成形体
JP2004175887A (ja) 2002-11-26 2004-06-24 Kanegafuchi Chem Ind Co Ltd 硬化性組成物
DE10258126B3 (de) 2002-12-12 2004-01-29 Wacker-Chemie Gmbh Alkinolgruppen aufweisende Organosiliciumverbindungen sowie diese enthaltend vernetzbare Massen und daraus herstellbare Formkörper
JP2007525803A (ja) * 2004-01-20 2007-09-06 ワールド・プロパティーズ・インコーポレイテッド 回路材料、回路、多層回路、およびそれらの製造方法
JP2005290352A (ja) 2004-03-12 2005-10-20 Asahi Kasei Corp カゴ状シルセスキオキサン構造を有する化合物
JP4645803B2 (ja) 2004-10-05 2011-03-09 信越化学工業株式会社 かご状オリゴシロキサン構造を有する一官能性モノマー及びその製造方法
JP2006131850A (ja) 2004-11-09 2006-05-25 Toagosei Co Ltd 熱硬化性組成物
US7915369B2 (en) 2004-12-07 2011-03-29 Panasonic Electric Works Co., Ltd. Ultraviolet transmissive polyhedral silsesquioxane polymers
JP2006265514A (ja) 2005-02-25 2006-10-05 Asahi Kasei Corp 共重合体およびその製造方法
JP2006299150A (ja) 2005-04-22 2006-11-02 Asahi Kasei Corp 封止材用組成物及び光学デバイス
JP2006299149A (ja) 2005-04-22 2006-11-02 Asahi Kasei Corp 封止材用組成物及び光学デバイス
JP4826160B2 (ja) 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
WO2007022367A2 (en) 2005-08-16 2007-02-22 Hybrid Plastics, Inc. Preparation of polyhedral oligomeric silsesquioxane silanols and siloxides functionalized with olefinic groups
KR101156426B1 (ko) 2005-08-25 2012-06-18 삼성모바일디스플레이주식회사 실세스퀴옥산계 화합물 및 이를 구비한 유기 발광 소자
JP2007091935A (ja) * 2005-09-29 2007-04-12 Fujifilm Corp ポリマー、膜形成用組成物、絶縁膜およびその製造方法
US7576140B2 (en) 2005-10-18 2009-08-18 Sabic Innovative Plastics Ip B.V. Method of improving abrasion resistance of plastic article and article produced thereby
JP4935972B2 (ja) 2005-12-21 2012-05-23 Ｊｓｒ株式会社 光半導体封止用組成物、その製造法および光半導体封止材
US8299198B2 (en) 2006-07-21 2012-10-30 Kaneka Corporation Polysiloxane composition, molded body obtained from the same, and optodevice member
TWI361205B (en) 2006-10-16 2012-04-01 Rohm & Haas Heat stable aryl polysiloxane compositions
KR101450929B1 (ko) 2006-11-20 2014-10-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 광원용 광학 접합 조성물
JP5670616B2 (ja) 2006-12-01 2015-02-18 株式会社カネカ ポリシロキサン系組成物
JP2008163260A (ja) 2006-12-28 2008-07-17 Showa Denko Kk 発光素子封止用樹脂組成物およびランプ
EP3656778A1 (en) 2007-04-17 2020-05-27 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
KR101800015B1 (ko) 2007-12-10 2017-11-21 카네카 코포레이션 알칼리 현상성을 갖는 경화성 조성물 및 그것을 사용한 절연성 박막 및 박막 트랜지스터
JP2009173759A (ja) 2008-01-23 2009-08-06 Kaneka Corp 多面体構造ポリシロキサン変性体および該変性体を用いた組成物、硬化物
JP5149022B2 (ja) 2008-01-25 2013-02-20 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体封止用シリコーン組成物及びそれを用いた光半導体装置
JP2009206124A (ja) 2008-02-26 2009-09-10 Shin Etsu Chem Co Ltd Ｌｅｄ装置の封止方法及びｌｅｄ装置
JP2010031254A (ja) 2008-06-27 2010-02-12 Showa Denko Kk ヒドロシリル化反応物およびその製造方法、該ヒドロシリル化反応物を含有する転写材料用硬化性組成物、ならびに該ヒドロシリル化反応物または該転写材料用硬化性組成物を用いた転写層の製造方法
JP5329904B2 (ja) 2008-10-16 2013-10-30 株式会社カネカ ポリシロキサン系組成物およびそれから得られる硬化物
JP2010254927A (ja) 2009-04-28 2010-11-11 Kaneka Corp 光硬化可能な組成物
JP2010265410A (ja) 2009-05-15 2010-11-25 Kaneka Corp Ｌｅｄ封止剤
JP5571329B2 (ja) 2009-06-24 2014-08-13 株式会社カネカ 多面体構造ポリシロキサン変性体、及び該変性体を含有する組成物。
JP2011016968A (ja) 2009-07-10 2011-01-27 Kaneka Corp 多面体構造ポリシロキサン変性体、その製造方法および該変性体を含む組成物
JP2011042732A (ja) 2009-08-20 2011-03-03 Kaneka Corp Ｌｅｄ封止剤
JP5616042B2 (ja) 2009-09-25 2014-10-29 株式会社カネカ 多面体構造ポリシロキサン系変性体及び組成物
KR101774306B1 (ko) 2010-05-28 2017-09-04 가부시키가이샤 가네카 폴리실록산계 조성물, 경화물, 및, 광학 디바이스
JP5877081B2 (ja) 2011-02-08 2016-03-02 株式会社カネカ 多面体構造ポリシロキサン変性体、該変性体を含有する組成物、該組成物を用いてなる封止剤、および光学デバイス

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5939576A (en) * 1998-01-05 1999-08-17 The United States Of America As Represented By The Secretary Of The Air Force Method of functionalizing polycyclic silicones and the compounds so formed
JP2004529984A (ja) 2000-10-27 2004-09-30 ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン 有機／無機ナノ複合体用の十分に規定されたナノサイズの構築ブロック
WO2003042292A2 (de) * 2001-11-17 2003-05-22 Creavis Gesellschaft Für Technologie Und Innovation Mbh Polyolefinzusammensetzungen, verfahren zu deren herstellung und verwendung dieser zusammensetzungen
WO2004011525A1 (en) 2002-07-30 2004-02-05 University Of Connecticut Nonionic telechelic polymers incorporating polyhedral oligosilsesquioxane (poss) and uses thereof
WO2004022231A1 (en) * 2002-09-04 2004-03-18 Johnson Matthey Plc Catalysts
WO2004024741A1 (ja) * 2002-09-13 2004-03-25 Chisso Corporation シルセスキオキサン誘導体およびその製造方法
JP2004143449A (ja) 2002-09-30 2004-05-20 Nippon Steel Chem Co Ltd 官能基を有するかご型シルセスキオキサン樹脂とその製造方法
JP2004359933A (ja) 2003-05-14 2004-12-24 Nagase Chemtex Corp 光素子用封止材
JP2005023256A (ja) 2003-07-04 2005-01-27 Toagosei Co Ltd カチオン硬化性組成物
JP2006022207A (ja) 2004-07-08 2006-01-26 Chisso Corp ケイ素化合物
JP2006233155A (ja) * 2005-02-28 2006-09-07 Chisso Corp 平坦化膜用塗布液および平坦化膜
JP2006269402A (ja) 2005-02-28 2006-10-05 Fuji Photo Film Co Ltd 絶縁材料形成用組成物および絶縁膜

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
J. AM. CHEM. SOC., vol. 120, 1998, pages 8380 - 8391
See also references of EP2151443A4

Cited By (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008066116A1 (ja) * 2006-12-01 2010-03-11 株式会社カネカ ポリシロキサン系組成物
US9422405B2 (en) 2007-04-17 2016-08-23 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
US9416231B2 (en) 2007-04-17 2016-08-16 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
US9035009B2 (en) 2007-04-17 2015-05-19 Kaneka Corporation Polyhedral polysiloxane modified product and composition using the modified product
US9464172B2 (en) 2007-12-10 2016-10-11 Kaneka Corporation Alkali-developable curable composition, insulating thin film using the same, and thin film transistor
WO2009075233A1 (ja) * 2007-12-10 2009-06-18 Kaneka Corporation アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
CN102171268A (zh) * 2008-10-02 2011-08-31 株式会社钟化 光固化性组合物以及固化物
WO2010038767A1 (ja) * 2008-10-02 2010-04-08 株式会社カネカ 光硬化性組成物および硬化物
US8809414B2 (en) 2008-10-02 2014-08-19 Kaneka Corporation Photocurable composition and cured product
JPWO2010038767A1 (ja) * 2008-10-02 2012-03-01 株式会社カネカ 光硬化性組成物および硬化物
JP2010254814A (ja) * 2009-04-24 2010-11-11 Chisso Corp 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物
JP2010254927A (ja) * 2009-04-28 2010-11-11 Kaneka Corp 光硬化可能な組成物
JP2011016968A (ja) * 2009-07-10 2011-01-27 Kaneka Corp 多面体構造ポリシロキサン変性体、その製造方法および該変性体を含む組成物
JP2011052093A (ja) * 2009-09-01 2011-03-17 Kaneka Corp 多面体構造ポリシロキサン変性体およびこれから得られる組成物
JP2011068752A (ja) * 2009-09-25 2011-04-07 Kaneka Corp ポリシロキサン系組成物およびそれから得られる硬化物、絶縁膜
JP2011068753A (ja) * 2009-09-25 2011-04-07 Kaneka Corp 多面体構造ポリシロキサン系変性体及び組成物
JP2011105883A (ja) * 2009-11-19 2011-06-02 Kaneka Corp 多面体構造ポリシロキサン変性体、及び該変性体を含有する組成物。
JP2011208074A (ja) * 2010-03-30 2011-10-20 Kaneka Corp 光硬化性組成物
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JP2011246653A (ja) * 2010-05-28 2011-12-08 Kaneka Corp 光学デバイス
US9688851B2 (en) 2010-05-28 2017-06-27 Kaneka Corporation Polysiloxane composition, hardened material and optical device
WO2011148896A1 (ja) * 2010-05-28 2011-12-01 株式会社カネカ ポリシロキサン系組成物、硬化物、及び、光学デバイス
US9822248B2 (en) 2010-05-28 2017-11-21 Kaneka Corporation Polysiloxane composition, hardened material and optical device
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WO2012111765A1 (ja) * 2011-02-18 2012-08-23 Jnc株式会社 硬化性樹脂組成物及びこれを用いた色変換材料
JP2013057031A (ja) * 2011-09-09 2013-03-28 Kaneka Corp オルガノポリシロキサン系組成物および硬化物
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WO2013061823A1 (ja) * 2011-10-25 2013-05-02 セントラル硝子株式会社 シロキサン系組成物およびその硬化物ならびにその用途
KR20140096311A (ko) * 2011-10-25 2014-08-05 샌트랄 글래스 컴퍼니 리미티드 실록산계 조성물 및 그 경화물 및 그 용도
JP2013108063A (ja) * 2011-10-25 2013-06-06 Central Glass Co Ltd シロキサン系組成物およびその硬化物ならびにその用途
US9080017B2 (en) 2011-10-25 2015-07-14 Central Glass Company, Limited Siloxane-based composition and cured product thereof, and use therefor
KR101598543B1 (ko) 2011-10-25 2016-02-29 샌트랄 글래스 컴퍼니 리미티드 실록산계 조성물 및 그 경화물 및 그 용도
JP2013147633A (ja) * 2011-12-20 2013-08-01 Jsr Corp 硬化性組成物、硬化物および光半導体装置
JP2014034593A (ja) * 2012-08-07 2014-02-24 Kaneka Corp 蛍光体含有シリコーン系組成物および該組成物で封止されてなる発光装置
JP2014034594A (ja) * 2012-08-07 2014-02-24 Kaneka Corp シリコーン処理蛍光体、シリコーン処理蛍光体含有シリコーン系硬化性組成物およびこれらの組成物で封止されてなる発光装置
WO2014061517A1 (ja) * 2012-10-18 2014-04-24 セントラル硝子株式会社 シリカ粒子を含む硬化性組成物およびその硬化物、並びにそれを用いた半導体封止材
JPWO2014065143A1 (ja) * 2012-10-22 2016-09-08 Jnc株式会社 熱硬化性樹脂組成物
US9512273B2 (en) 2012-10-22 2016-12-06 Jnc Corporation Thermosetting resin composition
WO2014065143A1 (ja) * 2012-10-22 2014-05-01 Jnc株式会社 熱硬化性樹脂組成物
JP2014208615A (ja) * 2013-03-26 2014-11-06 Jnc株式会社 アルコキシシリル基含有シルセスキオキサンおよびその組成物
JP2016529342A (ja) * 2013-07-03 2016-09-23 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 高温剥離性接着剤
KR101930128B1 (ko) * 2013-07-03 2018-12-17 헨켈 아이피 앤드 홀딩 게엠베하 고온 탈결합가능한 접착제
US9850409B2 (en) 2013-07-03 2017-12-26 Henkel Ag & Co. Kgaa High temperature debondable adhesive
JP2017527636A (ja) * 2014-06-24 2017-09-21 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 一成分型のｕｖおよび熱硬化高温剥離可能な接着剤
US10280349B2 (en) 2014-06-24 2019-05-07 Henkel Ag & Co. Kgaa 1K UV and thermal cure high temperature debondable adhesive
JP2015034303A (ja) * 2014-11-18 2015-02-19 株式会社カネカ オルガノポリシロキサン系組成物および硬化物
JP2015045024A (ja) * 2014-11-18 2015-03-12 株式会社カネカ 半導体パッケージ用硬化性樹脂組成物
JP2018506606A (ja) * 2014-12-23 2018-03-08 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ １ｋ高温用剥離可能接着剤
US10676643B2 (en) 2016-03-31 2020-06-09 Nissan Chemical Industries, Ltd. Coating film-forming composition and process for producing the same
JP2016172864A (ja) * 2016-04-27 2016-09-29 株式会社カネカ 半導体パッケージ用硬化性樹脂組成物
KR101826136B1 (ko) 2017-04-19 2018-02-06 한국과학기술원 투명 실록산경화물의 제조 방법
JP2017160453A (ja) * 2017-05-26 2017-09-14 株式会社カネカ 蛍光体含有シリコーン系組成物および該組成物で封止されてなる発光装置

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