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WO2008129815A1 - キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置 - Google Patents

キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置 Download PDF

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Publication number
WO2008129815A1
WO2008129815A1 PCT/JP2008/000688 JP2008000688W WO2008129815A1 WO 2008129815 A1 WO2008129815 A1 WO 2008129815A1 JP 2008000688 W JP2008000688 W JP 2008000688W WO 2008129815 A1 WO2008129815 A1 WO 2008129815A1
Authority
WO
WIPO (PCT)
Prior art keywords
prepreg
carrier
manufacturing
semiconductor device
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000688
Other languages
English (en)
French (fr)
Inventor
Ryoichi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2009510769A priority Critical patent/JP5370149B2/ja
Priority to CN2008800102898A priority patent/CN101646720B/zh
Priority to US12/530,209 priority patent/US8362363B2/en
Priority to KR1020097021016A priority patent/KR101359769B1/ko
Publication of WO2008129815A1 publication Critical patent/WO2008129815A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

　本発明によれば、シート状基材と、前記シート状基材の表面を覆うように設けられた第一の絶縁樹脂層と、前記第一の絶縁樹脂層を覆うように設けられた第一のキャリアと、前記シート状基材の裏面を覆うように設けられた第二の絶縁樹脂層と、前記第二の絶縁樹脂層を覆うように設けられた第二のキャリアと、を備えるキャリア付きプリプレグであって、前記第一および前記第二の絶縁樹脂層は、樹脂組成が互いに異なるか、または前記第一および前記第二の絶縁樹脂層は、厚みが互いに異なり、前記キャリア付きプリプレグの表面と裏面とは視覚的に識別可能である、キャリア付きプリプレグが提供される。
PCT/JP2008/000688 2007-03-30 2008-03-24 キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置 Ceased WO2008129815A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009510769A JP5370149B2 (ja) 2007-03-30 2008-03-24 キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置
CN2008800102898A CN101646720B (zh) 2007-03-30 2008-03-24 带有载体的预浸料坯及其制造方法、多层印刷线路板和半导体器件
US12/530,209 US8362363B2 (en) 2007-03-30 2008-03-24 Prepreg with carrier and process for manufacturing same, multi-layered printed wiring board and semiconductor device
KR1020097021016A KR101359769B1 (ko) 2007-03-30 2008-03-24 캐리어 부착 프리프레그 및 그 제조 방법, 다층 프린트 배선판, 그리고 반도체 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-095139 2007-03-30
JP2007095139 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008129815A1 true WO2008129815A1 (ja) 2008-10-30

Family

ID=39875348

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000688 Ceased WO2008129815A1 (ja) 2007-03-30 2008-03-24 キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置

Country Status (7)

Country Link
US (1) US8362363B2 (ja)
JP (1) JP5370149B2 (ja)
KR (1) KR101359769B1 (ja)
CN (1) CN101646720B (ja)
MY (1) MY149785A (ja)
TW (1) TWI443134B (ja)
WO (1) WO2008129815A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012051232A (ja) * 2010-09-01 2012-03-15 Sumitomo Bakelite Co Ltd 積層シートの製造方法および積層シート
JP2013144372A (ja) * 2012-01-13 2013-07-25 Panasonic Corp Ｓｍｃシートの切断位置表示装置
JP2013209626A (ja) * 2012-02-28 2013-10-10 Sumitomo Bakelite Co Ltd プリプレグおよびプリプレグの製造方法
JP2015070025A (ja) * 2013-09-27 2015-04-13 住友ベークライト株式会社 積層体の製造方法、プリプレグ、金属張積層板、プリント配線基板、半導体装置、およびプリプレグの表裏識別方法
JP2021031576A (ja) * 2019-08-23 2021-03-01 横浜ゴム株式会社 プリプレグおよびその製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110139462A (ko) * 2010-06-23 2011-12-29 삼성전기주식회사 절연수지 조성물 및 이를 이용하여 제조된 인쇄회로기판
US10404186B2 (en) * 2016-10-27 2019-09-03 General Electric Company Power module systems and methods having reduced common mode capacitive currents and reduced electromagnetic interference
WO2018088493A1 (ja) 2016-11-09 2018-05-17 日立化成株式会社 プリント配線板及び半導体パッケージ
CN108347820B (zh) * 2017-01-25 2020-09-15 奥特斯(中国)有限公司 容纳部件的基底结构上的高导热涂层
JP6879844B2 (ja) * 2017-06-30 2021-06-02 帝人株式会社 釣り具用部材及びそれを用いた釣り用リールのドラグ装置
WO2019107289A1 (ja) * 2017-11-28 2019-06-06 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
DE102019116103B4 (de) 2019-06-13 2021-04-22 Notion Systems GmbH Verfahren zum Beschriften einer Leiterplatte durch Erzeugen von Schattierungen in einer funktionalen Lackschicht
DE102023209201B3 (de) 2023-09-21 2025-02-13 Vitesco Technologies GmbH Schaltungsträger und Verfahren

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JP2004123870A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd プリプレグの製造方法および転写シート
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JPH02110376U (ja) * 1989-02-21 1990-09-04
JP2001212823A (ja) * 2000-01-31 2001-08-07 Matsushita Electric Works Ltd 多層プリント配線板及びその製造方法並びに積層板の製造方法
JP2004123870A (ja) * 2002-10-01 2004-04-22 Sumitomo Bakelite Co Ltd プリプレグの製造方法および転写シート
JP2004342871A (ja) * 2003-05-16 2004-12-02 Nec Toppan Circuit Solutions Inc 多層プリント配線板及びその製造方法
JP2006152099A (ja) * 2004-11-29 2006-06-15 Toray Ind Inc プリプレグ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012051232A (ja) * 2010-09-01 2012-03-15 Sumitomo Bakelite Co Ltd 積層シートの製造方法および積層シート
JP2013144372A (ja) * 2012-01-13 2013-07-25 Panasonic Corp Ｓｍｃシートの切断位置表示装置
JP2013209626A (ja) * 2012-02-28 2013-10-10 Sumitomo Bakelite Co Ltd プリプレグおよびプリプレグの製造方法
JP2015070025A (ja) * 2013-09-27 2015-04-13 住友ベークライト株式会社 積層体の製造方法、プリプレグ、金属張積層板、プリント配線基板、半導体装置、およびプリプレグの表裏識別方法
JP2021031576A (ja) * 2019-08-23 2021-03-01 横浜ゴム株式会社 プリプレグおよびその製造方法
WO2021039590A1 (ja) * 2019-08-23 2021-03-04 横浜ゴム株式会社 プリプレグおよびその製造方法
JP7088143B2 (ja) 2019-08-23 2022-06-21 横浜ゴム株式会社 プリプレグおよびその製造方法

Also Published As

Publication number Publication date
KR101359769B1 (ko) 2014-02-06
KR20090127161A (ko) 2009-12-09
TWI443134B (zh) 2014-07-01
TW200846397A (en) 2008-12-01
CN101646720B (zh) 2012-07-04
US8362363B2 (en) 2013-01-29
US20100065317A1 (en) 2010-03-18
JPWO2008129815A1 (ja) 2010-07-22
MY149785A (en) 2013-10-14
CN101646720A (zh) 2010-02-10
JP5370149B2 (ja) 2013-12-18

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