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WO2008126742A4 - レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 - Google Patents

レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 Download PDF

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Publication number
WO2008126742A4
WO2008126742A4 PCT/JP2008/056583 JP2008056583W WO2008126742A4 WO 2008126742 A4 WO2008126742 A4 WO 2008126742A4 JP 2008056583 W JP2008056583 W JP 2008056583W WO 2008126742 A4 WO2008126742 A4 WO 2008126742A4
Authority
WO
WIPO (PCT)
Prior art keywords
work
laser beam
back surface
channel
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056583
Other languages
English (en)
French (fr)
Other versions
WO2008126742A1 (ja
Inventor
Masanao Kamata
Tetsumi Sumiyoshi
Susumu Tsujikawa
Hitoshi Sekita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyber Laser Inc
Original Assignee
Cyber Laser Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyber Laser Inc filed Critical Cyber Laser Inc
Priority to CN2008800109736A priority Critical patent/CN101663125B/zh
Priority to KR1020097022418A priority patent/KR101333518B1/ko
Priority to JP2009509277A priority patent/JP5784273B2/ja
Publication of WO2008126742A1 publication Critical patent/WO2008126742A1/ja
Publication of WO2008126742A4 publication Critical patent/WO2008126742A4/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)

Abstract

【課題】被加工物体を超短パルスにより効率的に加工する方法を提供する。 【解決手段】基板などのレーザ光加工方法である。被加工物体に対して透明な波長となる、超短パルスレーザを集光し、被加工物体のウラ面に向けてオモテ面から照射し、集光されたレーザ光のビームウェスト位置を被加工物体ウラ面から離間して形成させる。これにより、被加工物体内のレーザ光伝播による自己集束作用で形成されるビームウェストから光進行方向に長い集光チャンネルが物体内に形成される。このチャンネル内の物質がレーザ光で分解されてその物質をウラ面から排出されることで上記チャンネルに空洞を形成することを特徴とする。空洞を形成しながらレーザ光を走査させると、加工面が形成されるので、その後弱い曲げ応力にて被加工物体を切断することができる。本方法は、２枚の基板が対向した配置された場合にも適用でき、液晶パネルのガラス基板分割に利用可能である。
PCT/JP2008/056583 2007-04-05 2008-04-02 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法 Ceased WO2008126742A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800109736A CN101663125B (zh) 2007-04-05 2008-04-02 激光加工方法及切割方法以及具有多层基板的结构体的分割方法
KR1020097022418A KR101333518B1 (ko) 2007-04-05 2008-04-02 레이저 가공 방법 및 절단 방법 및 다층 기판을 가지는 구조체의 분할 방법
JP2009509277A JP5784273B2 (ja) 2007-04-05 2008-04-02 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-099868 2007-04-05
JP2007099868 2007-04-05
JP2007218524 2007-08-24
JP2007-218524 2007-08-24
JP2007275395 2007-10-23
JP2007-275395 2007-10-23

Publications (2)

Publication Number Publication Date
WO2008126742A1 WO2008126742A1 (ja) 2008-10-23
WO2008126742A4 true WO2008126742A4 (ja) 2009-01-22

Family

ID=39863843

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056583 Ceased WO2008126742A1 (ja) 2007-04-05 2008-04-02 レーザ加工方法及び切断方法並びに多層基板を有する構造体の分割方法

Country Status (5)

Country Link
JP (2) JP5784273B2 (ja)
KR (1) KR101333518B1 (ja)
CN (1) CN101663125B (ja)
TW (1) TWI445586B (ja)
WO (1) WO2008126742A1 (ja)

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KR101333518B1 (ko) 2013-11-28
TW200848190A (en) 2008-12-16
JP2013223886A (ja) 2013-10-31
TWI445586B (zh) 2014-07-21
CN101663125B (zh) 2012-11-28
JP5822873B2 (ja) 2015-11-25
CN101663125A (zh) 2010-03-03
JPWO2008126742A1 (ja) 2010-07-22
KR20100015948A (ko) 2010-02-12
JP5784273B2 (ja) 2015-09-24

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