[go: up one dir, main page]

WO2008126681A1 - 電気・電子機器用銅合金およびその製造方法 - Google Patents

電気・電子機器用銅合金およびその製造方法 Download PDF

Info

Publication number
WO2008126681A1
WO2008126681A1 PCT/JP2008/055785 JP2008055785W WO2008126681A1 WO 2008126681 A1 WO2008126681 A1 WO 2008126681A1 JP 2008055785 W JP2008055785 W JP 2008055785W WO 2008126681 A1 WO2008126681 A1 WO 2008126681A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
electrical
producing
electronic device
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055785
Other languages
English (en)
French (fr)
Inventor
Ryosuke Matsuo
Tatsuhiko Eguchi
Kuniteru Mihara
Hiroshi Kaneko
Kiyoshige Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to US12/593,024 priority Critical patent/US20100193092A1/en
Priority to EP08722882A priority patent/EP2143810A4/en
Priority to CN200880017586A priority patent/CN101680057A/zh
Publication of WO2008126681A1 publication Critical patent/WO2008126681A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/005—Dielectrophoresis, i.e. dielectric particles migrating towards the region of highest field strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/02—Separators
    • B03C5/022—Non-uniform field separators
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Conductive Materials (AREA)

Abstract

　ニッケル（Ｎｉ）を１．５～５．０質量％、ケイ素（Ｓｉ）を０．４～１．５質量％含有し、ニッケル（Ｎｉ）／ケイ素（Ｓｉ）の質量比が２以上７以下で、残部が銅（Ｃｕ）と不可避不純物とからなり、平均結晶粒径が２μｍ以上２０μｍ以下で、かつ、その結晶粒径の標準偏差が１０μｍ以下である電気・電子機器用銅合金。
PCT/JP2008/055785 2007-03-26 2008-03-26 電気・電子機器用銅合金およびその製造方法 Ceased WO2008126681A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/593,024 US20100193092A1 (en) 2007-03-26 2008-03-26 Copper alloy for electrical/electronic device and method for producing the same
EP08722882A EP2143810A4 (en) 2007-03-26 2008-03-26 COPPER ALLOY FOR ELECTRICAL / ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THEREOF
CN200880017586A CN101680057A (zh) 2007-03-26 2008-03-26 电气电子设备用铜合金及其制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-080266 2007-03-26
JP2007080266 2007-03-26
JP2008079256A JP5170881B2 (ja) 2007-03-26 2008-03-25 電気・電子機器用銅合金材およびその製造方法
JP2008-079256 2008-03-25

Publications (1)

Publication Number Publication Date
WO2008126681A1 true WO2008126681A1 (ja) 2008-10-23

Family

ID=39863792

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055785 Ceased WO2008126681A1 (ja) 2007-03-26 2008-03-26 電気・電子機器用銅合金およびその製造方法

Country Status (5)

Country Link
US (1) US20100193092A1 (ja)
EP (1) EP2143810A4 (ja)
JP (1) JP5170881B2 (ja)
CN (1) CN101680057A (ja)
WO (1) WO2008126681A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012224898A (ja) * 2011-04-18 2012-11-15 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
US20140305551A1 (en) * 2012-11-09 2014-10-16 Poongsan Corporation Copper alloy material for electrical and electronic components and method of preparing the same
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5009849B2 (ja) * 2008-03-31 2012-08-22 日本精線株式会社 高強度ばね用の銅合金線、及び該銅合金線を用いた銅合金ばね
KR101114147B1 (ko) * 2008-03-31 2012-03-13 후루카와 덴키 고교 가부시키가이샤 전기전자기기용 동합금 재료 및 전기전자부품
JP4653240B2 (ja) * 2008-03-31 2011-03-16 古河電気工業株式会社 電気電子機器用銅合金材料および電気電子部品
JP5261161B2 (ja) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4708485B2 (ja) 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5140045B2 (ja) * 2009-08-06 2013-02-06 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条
KR20120054099A (ko) * 2009-09-28 2012-05-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
CN102822364A (zh) * 2010-04-02 2012-12-12 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si系合金
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4834781B1 (ja) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
KR20140025607A (ko) * 2011-08-04 2014-03-04 가부시키가이샤 고베 세이코쇼 구리 합금
JP6246454B2 (ja) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6222885B2 (ja) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
JP5773929B2 (ja) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
JP5501495B1 (ja) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品及び端子
CN104178660B (zh) * 2014-08-29 2016-11-02 河南科技大学 一种高强度Cu-Ni-Si合金及其制备方法
JP6821290B2 (ja) * 2015-03-19 2021-01-27 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
CN104928527A (zh) * 2015-07-13 2015-09-23 苏州科茂电子材料科技有限公司 一种电缆用导电铜材料及其制备方法
JP6879971B2 (ja) * 2018-03-30 2021-06-02 Ｊｘ金属株式会社 銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
JP6830135B2 (ja) * 2019-08-06 2021-02-17 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JPH1060562A (ja) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
JPH11222641A (ja) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2002038228A (ja) * 2000-07-25 2002-02-06 Furukawa Electric Co Ltd:The 電子電気機器部品用銅合金材
WO2002053790A1 (fr) * 2000-12-28 2002-07-11 Nippon Mining & Metals Co., Ltd. Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage
JP2004052008A (ja) * 2002-07-16 2004-02-19 Yamaha Metanikusu Kk チタン銅合金材及びその製造方法
JP2005089843A (ja) 2003-09-18 2005-04-07 Kobe Steel Ltd 高強度銅合金板および高強度銅合金板の製造方法
JP2006089763A (ja) 2004-09-21 2006-04-06 Dowa Mining Co Ltd 銅合金およびその製造法
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品
JP2007314847A (ja) * 2006-05-26 2007-12-06 Kobe Steel Ltd 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
JP4566048B2 (ja) * 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JPH1060562A (ja) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The 電子機器用銅合金及びその製造方法
JPH11222641A (ja) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2002038228A (ja) * 2000-07-25 2002-02-06 Furukawa Electric Co Ltd:The 電子電気機器部品用銅合金材
WO2002053790A1 (fr) * 2000-12-28 2002-07-11 Nippon Mining & Metals Co., Ltd. Alliage de cuivre haute resistance ayant une excellente aptitude au pliage et son procede de fabrication, terminal et connecteur comportant cet alliage
JP2004052008A (ja) * 2002-07-16 2004-02-19 Yamaha Metanikusu Kk チタン銅合金材及びその製造方法
JP2005089843A (ja) 2003-09-18 2005-04-07 Kobe Steel Ltd 高強度銅合金板および高強度銅合金板の製造方法
JP2006089763A (ja) 2004-09-21 2006-04-06 Dowa Mining Co Ltd 銅合金およびその製造法
JP2006200042A (ja) * 2006-03-23 2006-08-03 Kobe Steel Ltd 曲げ加工性に優れた銅合金板からなる電子部品
JP2007314847A (ja) * 2006-05-26 2007-12-06 Kobe Steel Ltd 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2143810A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same
CN103140591A (zh) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 电子材料用Cu-Co-Si类铜合金及其制备方法
JP2012224898A (ja) * 2011-04-18 2012-11-15 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
US20140305551A1 (en) * 2012-11-09 2014-10-16 Poongsan Corporation Copper alloy material for electrical and electronic components and method of preparing the same

Also Published As

Publication number Publication date
US20100193092A1 (en) 2010-08-05
JP5170881B2 (ja) 2013-03-27
JP2008266783A (ja) 2008-11-06
EP2143810A4 (en) 2012-06-27
EP2143810A1 (en) 2010-01-13
CN101680057A (zh) 2010-03-24

Similar Documents

Publication Publication Date Title
WO2008126681A1 (ja) 電気・電子機器用銅合金およびその製造方法
WO2008099892A1 (ja) 強度と成形性に優れる電気電子部品用銅合金板
AU2013207042B2 (en) Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method for manufacturing copper alloy for electronic/electric device, and conductive part and terminal for electronic/electric device
EP2426224A3 (en) Copper alloy with high strength, high electrical conductivity, and excellent bendability
MY142123A (en) Copper alloy
TW200729238A (en) Electric wire conductor for wiring, electric wire for wiring, and method of producing these
EP3009523A3 (en) Copper alloy for electronic device, method for producing it, and rolled material from it
MX2007006353A (es) Aleacion para soldar.
TW200802711A (en) Method and structure for reducing contact resistance between silicide contact and overlying metallization
EP2276063A3 (en) Improvement of solder interconnect by addition of copper
WO2009030865A3 (fr) Substrat metallique texture cristallographiquement, dispositif texture cristallographiquement, cellule et module photovoltaïque comprenant un tel dispositif et procede de depot de couches minces
TW200735308A (en) On-chip interconnect-stack cooling using sacrificial interconnect segments
JP2011241413A5 (ja)
WO2009044822A1 (ja) 電気・電子部品用銅合金板材
WO2010104274A3 (en) Lead frame and method for manufacturing the same
WO2008123436A1 (ja) 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法
MX2012002899A (es) Material activo del electrodo negativo, de aleacion de si, para dispositivos electricos.
JP5437519B1 (ja) Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
MX2016000027A (es) Aleacion de cobre para equipo electronico y electrico, hoja delgada de aleacion de cobre para equipo electronico y/o electrico, y componente conductor para equipo electronico y electrico y terminal.
WO2011160617A3 (de) Nickelbasislegierung
TW200504229A (en) Copper alloy with high strength and high conductivity
TW200426232A (en) Cu-Ni-Si alloy and production method thereof
PH12017502294B1 (en) Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
TW200706508A (en) Method for producing an electronic component passivated by lead free glass
WO2009008457A1 (ja) 電子部品用放熱部品、電子部品用ケース、電子部品用キャリアおよび電子部品用パッケージ

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880017586.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722882

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008722882

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12593024

Country of ref document: US