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WO2008123362A1 - 重合性組成物及び成形体 - Google Patents

重合性組成物及び成形体 Download PDF

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Publication number
WO2008123362A1
WO2008123362A1 PCT/JP2008/055902 JP2008055902W WO2008123362A1 WO 2008123362 A1 WO2008123362 A1 WO 2008123362A1 JP 2008055902 W JP2008055902 W JP 2008055902W WO 2008123362 A1 WO2008123362 A1 WO 2008123362A1
Authority
WO
WIPO (PCT)
Prior art keywords
soft magnetic
polymerizable composition
magnetic body
shape
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055902
Other languages
English (en)
French (fr)
Inventor
Akihiko Yoshiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Priority to JP2009509167A priority Critical patent/JPWO2008123362A1/ja
Publication of WO2008123362A1 publication Critical patent/WO2008123362A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Soft Magnetic Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

　本発明は、形状異方性をもった軟磁性体を均一に分散し充填することで磁気特性、特に透磁率に優れ、かつ耐汚染性に優れた成形体を高い生産性で製造することが可能な、軟磁性体含有重合性組成物を提供することを目的としている。 　本発明に係る重合性組成物は、形状異方性を有する軟磁性体および分子内に１以上の反応性不飽和結合を有する塊状重合性モノマーを含んでなり、特に軟磁性体の形状が、長軸長（Ｘ）と短軸長（Ｙ）との比（Ｘ／Ｙ）が２以上１０，０００以下であることが好ましい。
PCT/JP2008/055902 2007-03-27 2008-03-27 重合性組成物及び成形体 Ceased WO2008123362A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009509167A JPWO2008123362A1 (ja) 2007-03-27 2008-03-27 重合性組成物及び成形体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-082622 2007-03-27
JP2007082622 2007-03-27

Publications (1)

Publication Number Publication Date
WO2008123362A1 true WO2008123362A1 (ja) 2008-10-16

Family

ID=39830851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055902 Ceased WO2008123362A1 (ja) 2007-03-27 2008-03-27 重合性組成物及び成形体

Country Status (2)

Country Link
JP (1) JPWO2008123362A1 (ja)
WO (1) WO2008123362A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168484A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
JP2011023662A (ja) * 2009-07-17 2011-02-03 Alps Electric Co Ltd Ｒｆｉｄ用磁性部材
JP2013036010A (ja) * 2011-08-11 2013-02-21 Nippon Zeon Co Ltd 架橋樹脂成形体の製造方法
JP2015199939A (ja) * 2014-03-31 2015-11-12 三井化学株式会社 樹脂組成物およびその用途
US20170330662A1 (en) * 2015-06-04 2017-11-16 Poco Holding Co., Ltd. Novel high-density magnetic composite material for inductor
EP3306629A4 (en) * 2015-06-04 2019-01-23 Poco Holding Co., Ltd. METHOD FOR PRODUCING A HIGH-DENSITY UNIFORMLY SHAPED INDUCTOR
EP3648304A3 (en) * 2018-10-31 2020-07-01 Hamilton Sundstrand Corporation Stator core comprising cobalt carbide and method of making the same
EP3699935A1 (en) * 2019-02-22 2020-08-26 LG Electronics Inc. Magnetic shielding sheet and method of preparation thereof
EP3007187B1 (en) * 2013-05-27 2021-01-06 Nitto Denko Corporation Soft-magnetic resin composition, soft-magnetic adhesive film, circuit board with soft-magnetic film laminated thereto, and position detection device
US20230036342A1 (en) * 2019-12-27 2023-02-02 Sumitomo Bakelite Co., Ltd. Solid resin molding material, molded product, and method for producing molded product
WO2023201045A1 (en) * 2022-04-14 2023-10-19 Raytheon Company Low-k and low dielectric loss dielectric composition for aerosol jet printing

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035973A (ja) * 1999-07-19 2001-02-09 Tokin Corp 半導体装置封止材料
JP2002110863A (ja) * 2000-09-28 2002-04-12 Kankyo Denji Gijutsu Kenkyusho:Kk 半導体デバイス用パッケージ
JP2003218249A (ja) * 2002-01-18 2003-07-31 Mitsui Chemicals Inc 半導体中空パッケージ
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法
WO2005014690A1 (ja) * 2003-08-07 2005-02-17 Zeon Corporation 重合性組成物及びその成形体
WO2005016991A1 (ja) * 2003-08-13 2005-02-24 Zeon Corporation 重合性組成物、及びそれを用いてなる成形体
WO2005017033A1 (ja) * 2003-08-13 2005-02-24 Zeon Corporation 架橋性樹脂組成物およびその樹脂成形体
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001035973A (ja) * 1999-07-19 2001-02-09 Tokin Corp 半導体装置封止材料
JP2002110863A (ja) * 2000-09-28 2002-04-12 Kankyo Denji Gijutsu Kenkyusho:Kk 半導体デバイス用パッケージ
JP2003218249A (ja) * 2002-01-18 2003-07-31 Mitsui Chemicals Inc 半導体中空パッケージ
JP2004244609A (ja) * 2002-07-29 2004-09-02 Nippon Zeon Co Ltd 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法
WO2005014690A1 (ja) * 2003-08-07 2005-02-17 Zeon Corporation 重合性組成物及びその成形体
WO2005016991A1 (ja) * 2003-08-13 2005-02-24 Zeon Corporation 重合性組成物、及びそれを用いてなる成形体
WO2005017033A1 (ja) * 2003-08-13 2005-02-24 Zeon Corporation 架橋性樹脂組成物およびその樹脂成形体
JP2007031695A (ja) * 2005-06-20 2007-02-08 Achilles Corp 電磁波吸収性と熱伝導性を有するアクリル系樹脂組成物及び樹脂シート

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168484A (ja) * 2009-01-23 2010-08-05 Nippon Zeon Co Ltd 重合性組成物、架橋体および架橋樹脂複合体
JP2011023662A (ja) * 2009-07-17 2011-02-03 Alps Electric Co Ltd Ｒｆｉｄ用磁性部材
JP2013036010A (ja) * 2011-08-11 2013-02-21 Nippon Zeon Co Ltd 架橋樹脂成形体の製造方法
EP3007187B1 (en) * 2013-05-27 2021-01-06 Nitto Denko Corporation Soft-magnetic resin composition, soft-magnetic adhesive film, circuit board with soft-magnetic film laminated thereto, and position detection device
JP2015199939A (ja) * 2014-03-31 2015-11-12 三井化学株式会社 樹脂組成物およびその用途
US20170330662A1 (en) * 2015-06-04 2017-11-16 Poco Holding Co., Ltd. Novel high-density magnetic composite material for inductor
EP3306629A4 (en) * 2015-06-04 2019-01-23 Poco Holding Co., Ltd. METHOD FOR PRODUCING A HIGH-DENSITY UNIFORMLY SHAPED INDUCTOR
EP3648304A3 (en) * 2018-10-31 2020-07-01 Hamilton Sundstrand Corporation Stator core comprising cobalt carbide and method of making the same
EP3699935A1 (en) * 2019-02-22 2020-08-26 LG Electronics Inc. Magnetic shielding sheet and method of preparation thereof
US10999959B2 (en) 2019-02-22 2021-05-04 Lg Electronics Inc. Magnetic shielding sheet and method of preparation thereof
US20230036342A1 (en) * 2019-12-27 2023-02-02 Sumitomo Bakelite Co., Ltd. Solid resin molding material, molded product, and method for producing molded product
WO2023201045A1 (en) * 2022-04-14 2023-10-19 Raytheon Company Low-k and low dielectric loss dielectric composition for aerosol jet printing

Also Published As

Publication number Publication date
JPWO2008123362A1 (ja) 2010-07-15

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