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WO2008120764A1 - ポリアミック酸樹脂組成物、該樹脂組成物を用いた硬化膜および半導体装置 - Google Patents

ポリアミック酸樹脂組成物、該樹脂組成物を用いた硬化膜および半導体装置 Download PDF

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Publication number
WO2008120764A1
WO2008120764A1 PCT/JP2008/056230 JP2008056230W WO2008120764A1 WO 2008120764 A1 WO2008120764 A1 WO 2008120764A1 JP 2008056230 W JP2008056230 W JP 2008056230W WO 2008120764 A1 WO2008120764 A1 WO 2008120764A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
polyamic acid
cured film
semiconductor device
film produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056230
Other languages
English (en)
French (fr)
Inventor
Rieko Hayashi
Osamu Matsuzaka
Takenori Ookubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009507544A priority Critical patent/JPWO2008120764A1/ja
Priority to KR1020097014995A priority patent/KR101109871B1/ko
Publication of WO2008120764A1 publication Critical patent/WO2008120764A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

　本発明のポリアミック酸樹脂組成物は、主鎖に炭素数５～２０のアルキレン鎖を有するポリアミック酸を含む樹脂組成物であって、イミド化率が８０％以上となる温度で加熱硬化された厚さ２０μｍの樹脂組成物硬化膜の引張弾性率が１００以上１５００ＭＰａ未満であることを特徴とする。本発明によれば、ポリイミド樹脂前駆体（ポリアミック酸）を用いつつ、一回の塗布（スピンコート）で厚膜形成（～２００μm）が可能であり、且つ、低温作業性（～２００°C）を有し、低反り性、耐熱性、絶縁性、低吸水性に優れた硬化膜を得ることのできる、半導体基板の保護コート剤に用いて好適なポリアミック酸樹脂組成物と該樹脂組成物から得られた硬化膜を有する半導体措置を提供することができる。
PCT/JP2008/056230 2007-03-29 2008-03-28 ポリアミック酸樹脂組成物、該樹脂組成物を用いた硬化膜および半導体装置 Ceased WO2008120764A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009507544A JPWO2008120764A1 (ja) 2007-03-29 2008-03-28 ポリアミック酸樹脂組成物、該樹脂組成物を用いた硬化膜および半導体装置
KR1020097014995A KR101109871B1 (ko) 2007-03-29 2008-03-28 폴리아믹산 수지 조성물, 그 수지 조성물을 이용한 경화막 및 반도체장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007088293 2007-03-29
JP2007-088293 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120764A1 true WO2008120764A1 (ja) 2008-10-09

Family

ID=39808344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056230 Ceased WO2008120764A1 (ja) 2007-03-29 2008-03-28 ポリアミック酸樹脂組成物、該樹脂組成物を用いた硬化膜および半導体装置

Country Status (4)

Country Link
JP (1) JPWO2008120764A1 (ja)
KR (1) KR101109871B1 (ja)
TW (1) TW200909520A (ja)
WO (1) WO2008120764A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014029966A1 (en) * 2012-08-24 2014-02-27 Croda International Plc Polyimide composition
JP2021155717A (ja) * 2020-03-26 2021-10-07 東レ株式会社 樹脂組成物、硬化膜、硬化膜のパターンの製造方法および電子部品

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228697A (ja) * 1994-02-15 1995-08-29 Hitachi Chem Co Ltd 接着フィルム
JP2003327697A (ja) * 2002-05-13 2003-11-19 Nippon Steel Chem Co Ltd シロキサン変性ポリイミド樹脂
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2005023184A (ja) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd 樹脂組成物及びこれを用いた半導体装置
JP2005197603A (ja) * 2004-01-09 2005-07-21 Nitto Denko Corp 半導体装置の除塵用基板
JP2006089524A (ja) * 2004-09-21 2006-04-06 Nitto Denko Corp 耐熱性樹脂、その製造方法及び該樹脂を用いた除塵用基板
JP2006143997A (ja) * 2004-10-19 2006-06-08 Nitto Denko Corp 基板処理装置の除塵用基板及びそれに好適な耐熱性樹脂
WO2007116979A1 (ja) * 2006-04-12 2007-10-18 Hitachi Chemical Company, Ltd. 封止充填剤用樹脂組成物、それを用いたフリップチップ実装法及びフリップチップ実装品

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228697A (ja) * 1994-02-15 1995-08-29 Hitachi Chem Co Ltd 接着フィルム
JP2003327697A (ja) * 2002-05-13 2003-11-19 Nippon Steel Chem Co Ltd シロキサン変性ポリイミド樹脂
JP2004211053A (ja) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd フィルム状接着剤、接着シート及び半導体装置
JP2005023184A (ja) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd 樹脂組成物及びこれを用いた半導体装置
JP2005197603A (ja) * 2004-01-09 2005-07-21 Nitto Denko Corp 半導体装置の除塵用基板
JP2006089524A (ja) * 2004-09-21 2006-04-06 Nitto Denko Corp 耐熱性樹脂、その製造方法及び該樹脂を用いた除塵用基板
JP2006143997A (ja) * 2004-10-19 2006-06-08 Nitto Denko Corp 基板処理装置の除塵用基板及びそれに好適な耐熱性樹脂
WO2007116979A1 (ja) * 2006-04-12 2007-10-18 Hitachi Chemical Company, Ltd. 封止充填剤用樹脂組成物、それを用いたフリップチップ実装法及びフリップチップ実装品

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014029966A1 (en) * 2012-08-24 2014-02-27 Croda International Plc Polyimide composition
CN104583274A (zh) * 2012-08-24 2015-04-29 禾大国际股份公开有限公司 聚酰亚胺组合物
US10214615B2 (en) 2012-08-24 2019-02-26 Croda International Plc Polyimide composition
JP2021155717A (ja) * 2020-03-26 2021-10-07 東レ株式会社 樹脂組成物、硬化膜、硬化膜のパターンの製造方法および電子部品
JP7666026B2 (ja) 2020-03-26 2025-04-22 東レ株式会社 樹脂組成物、硬化膜、硬化膜のパターンの製造方法および電子部品

Also Published As

Publication number Publication date
KR20090094845A (ko) 2009-09-08
TW200909520A (en) 2009-03-01
KR101109871B1 (ko) 2012-02-14
JPWO2008120764A1 (ja) 2010-07-15

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