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WO2008120764A1 - Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device - Google Patents

Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device Download PDF

Info

Publication number
WO2008120764A1
WO2008120764A1 PCT/JP2008/056230 JP2008056230W WO2008120764A1 WO 2008120764 A1 WO2008120764 A1 WO 2008120764A1 JP 2008056230 W JP2008056230 W JP 2008056230W WO 2008120764 A1 WO2008120764 A1 WO 2008120764A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
polyamic acid
cured film
semiconductor device
film produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056230
Other languages
French (fr)
Japanese (ja)
Inventor
Rieko Hayashi
Osamu Matsuzaka
Takenori Ookubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2009507544A priority Critical patent/JPWO2008120764A1/en
Priority to KR1020097014995A priority patent/KR101109871B1/en
Publication of WO2008120764A1 publication Critical patent/WO2008120764A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Formation Of Insulating Films (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Disclosed is a polyamic acid resin composition comprising a polyamic acid having an alkylene chain containing 5 to 20 carbon atoms as the main chain, which can be cured by heating at a temperature at which the rate of imidation becomes 80% or more to form a cured film having a tensile elastic modulus of not less than 100 MPa and less than 1500 MPa as measured at a film thickness of 20 μm. It becomes possible to provide: a polyamic acid resin composition which comprises a polyimide resin precursor (a polyamic acid), which can form a thick film (not greater than 200 μm) by only one coating operation (spin coating), has good workability at a lower temperature (not higher than 200˚C), and enables to form a cured film having low warpage property, excellent heat resistance, insulating property, and low moisture-absorbability, and which is suitable as a protective coating agent for a semiconductor substrate; and a semiconductor device having a cured film produced from the resin composition.
PCT/JP2008/056230 2007-03-29 2008-03-28 Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device Ceased WO2008120764A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009507544A JPWO2008120764A1 (en) 2007-03-29 2008-03-28 Polyamic acid resin composition, cured film and semiconductor device using the resin composition
KR1020097014995A KR101109871B1 (en) 2007-03-29 2008-03-28 Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007088293 2007-03-29
JP2007-088293 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008120764A1 true WO2008120764A1 (en) 2008-10-09

Family

ID=39808344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056230 Ceased WO2008120764A1 (en) 2007-03-29 2008-03-28 Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device

Country Status (4)

Country Link
JP (1) JPWO2008120764A1 (en)
KR (1) KR101109871B1 (en)
TW (1) TW200909520A (en)
WO (1) WO2008120764A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014029966A1 (en) * 2012-08-24 2014-02-27 Croda International Plc Polyimide composition
JP2021155717A (en) * 2020-03-26 2021-10-07 東レ株式会社 Resin composition, cured film, cured film pattern manufacturing method and electronic components

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228697A (en) * 1994-02-15 1995-08-29 Hitachi Chem Co Ltd Adhesive film
JP2003327697A (en) * 2002-05-13 2003-11-19 Nippon Steel Chem Co Ltd Siloxane-modified polyimide resin
JP2004211053A (en) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd Film adhesive, adhesive sheet, and semiconductor device
JP2005023184A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same
JP2005197603A (en) * 2004-01-09 2005-07-21 Nitto Denko Corp Semiconductor device dust removal board
JP2006089524A (en) * 2004-09-21 2006-04-06 Nitto Denko Corp Heat resistant resin, method for producing the same, and substrate for dust removal using the resin
JP2006143997A (en) * 2004-10-19 2006-06-08 Nitto Denko Corp Dust removal substrate for substrate processing apparatus and heat resistant resin suitable for it
WO2007116979A1 (en) * 2006-04-12 2007-10-18 Hitachi Chemical Company, Ltd. Resin composition for encapsulating filler, method of flip chip mounting with the same, and product of flip chip mounting

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228697A (en) * 1994-02-15 1995-08-29 Hitachi Chem Co Ltd Adhesive film
JP2003327697A (en) * 2002-05-13 2003-11-19 Nippon Steel Chem Co Ltd Siloxane-modified polyimide resin
JP2004211053A (en) * 2002-06-26 2004-07-29 Hitachi Chem Co Ltd Film adhesive, adhesive sheet, and semiconductor device
JP2005023184A (en) * 2003-07-01 2005-01-27 Hitachi Chem Co Ltd Resin composition and semiconductor device obtained by using the same
JP2005197603A (en) * 2004-01-09 2005-07-21 Nitto Denko Corp Semiconductor device dust removal board
JP2006089524A (en) * 2004-09-21 2006-04-06 Nitto Denko Corp Heat resistant resin, method for producing the same, and substrate for dust removal using the resin
JP2006143997A (en) * 2004-10-19 2006-06-08 Nitto Denko Corp Dust removal substrate for substrate processing apparatus and heat resistant resin suitable for it
WO2007116979A1 (en) * 2006-04-12 2007-10-18 Hitachi Chemical Company, Ltd. Resin composition for encapsulating filler, method of flip chip mounting with the same, and product of flip chip mounting

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014029966A1 (en) * 2012-08-24 2014-02-27 Croda International Plc Polyimide composition
CN104583274A (en) * 2012-08-24 2015-04-29 禾大国际股份公开有限公司 Polyimide composition
US10214615B2 (en) 2012-08-24 2019-02-26 Croda International Plc Polyimide composition
JP2021155717A (en) * 2020-03-26 2021-10-07 東レ株式会社 Resin composition, cured film, cured film pattern manufacturing method and electronic components
JP7666026B2 (en) 2020-03-26 2025-04-22 東レ株式会社 Resin composition, cured film, method for producing a pattern of the cured film, and electronic component

Also Published As

Publication number Publication date
KR101109871B1 (en) 2012-02-14
TW200909520A (en) 2009-03-01
KR20090094845A (en) 2009-09-08
JPWO2008120764A1 (en) 2010-07-15

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