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WO2008120622A1 - 管体の残留応力改善装置 - Google Patents

管体の残留応力改善装置 Download PDF

Info

Publication number
WO2008120622A1
WO2008120622A1 PCT/JP2008/055657 JP2008055657W WO2008120622A1 WO 2008120622 A1 WO2008120622 A1 WO 2008120622A1 JP 2008055657 W JP2008055657 W JP 2008055657W WO 2008120622 A1 WO2008120622 A1 WO 2008120622A1
Authority
WO
WIPO (PCT)
Prior art keywords
tubular body
residual stress
laser beams
circumferential direction
mirrors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055657
Other languages
English (en)
French (fr)
Inventor
Shuho Tsubota
Takashi Ishide
Takashi Akaba
Hironori Onitsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to US12/593,459 priority Critical patent/US20100059491A1/en
Priority to EP08738881A priority patent/EP2135702A1/en
Publication of WO2008120622A1 publication Critical patent/WO2008120622A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B23K31/027—Making tubes with soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26—Methods of annealing
    • C21D1/30—Stress-relieving
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D11/00—Process control or regulation for heat treatments
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/08—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for tubular bodies or pipes
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/50—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for welded joints
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/06—Surface hardening
    • C21D1/09—Surface hardening by direct application of electrical or wave energy; by particle radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Heat Treatment Of Articles (AREA)
  • Laser Beam Processing (AREA)

Abstract

　レーザ光の光路を制御して、不必要な領域への照射を抑制する管体の残留応力改善装置を提供する。そのため、管体の残留応力改善装置において、光制御部５Ｃは、複数のレーザ光（Ｐ１～Ｐｎ）の光学系の最終段に共用可能に配設され、かつ、管体２へ照射される複数のレーザ光の最終的な光路に対し、該光路の管体２の周方向の両側に配設された１対のミラー２１、２２と、複数のレーザ光の両端部の光学系の最終段に配設され、かつ、管体２へ照射される複数のレーザ光の最終的な光路に対して、該光路の管体２の軸方向の両側に配設された１対のミラー２３、２４とを有し、該２対のミラー２１～２４により、各レーザ光の管体２の周方向における裾野部分を内側に反射すると共に、両端のレーザ光の管体２の軸方向における裾野部分を内側に反射して、管体２へ照射する。
PCT/JP2008/055657 2007-03-30 2008-03-26 管体の残留応力改善装置 Ceased WO2008120622A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/593,459 US20100059491A1 (en) 2007-03-30 2008-03-26 Apparatus for improving residual stress in tubular body
EP08738881A EP2135702A1 (en) 2007-03-30 2008-03-26 Residual stress improving device of tubular body

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-090409 2007-03-30
JP2007090409A JP5185557B2 (ja) 2007-03-30 2007-03-30 管体の残留応力改善装置

Publications (1)

Publication Number Publication Date
WO2008120622A1 true WO2008120622A1 (ja) 2008-10-09

Family

ID=39808204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055657 Ceased WO2008120622A1 (ja) 2007-03-30 2008-03-26 管体の残留応力改善装置

Country Status (4)

Country Link
US (1) US20100059491A1 (ja)
EP (1) EP2135702A1 (ja)
JP (1) JP5185557B2 (ja)
WO (1) WO2008120622A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020180316A (ja) * 2019-04-24 2020-11-05 公立大学法人 滋賀県立大学 レーザ加工装置及びレーザ加工方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2141252A1 (en) * 2007-04-20 2010-01-06 Mitsubishi Heavy Industries, Ltd. Method and device for improving residual stress in pipe body

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316722A (ja) * 1993-04-30 1994-11-15 Ntn Corp 円筒表面のレーザ焼入加工装置
JPH0819881A (ja) * 1994-06-30 1996-01-23 Mitsubishi Heavy Ind Ltd 管状体加熱用のレーザ装置
JPH08142203A (ja) * 1994-11-15 1996-06-04 Japan Synthetic Rubber Co Ltd 光造形装置
WO1996020435A1 (fr) * 1994-12-28 1996-07-04 Shinozaki Manufacturing Co., Ltd. Procede et appareil de traitement de rouleaux et autres par faisceau laser
JP2005177859A (ja) * 2003-08-21 2005-07-07 Leister Process Technologies 複数個の材料を同時に加熱するための方法ならびに装置
JP2005232586A (ja) 2004-01-22 2005-09-02 Mitsubishi Heavy Ind Ltd 管体の残留応力改善方法及び改善装置
JP2006015399A (ja) 2004-06-04 2006-01-19 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006037199A (ja) 2004-07-29 2006-02-09 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006035292A (ja) 2004-07-29 2006-02-09 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006045598A (ja) * 2004-08-03 2006-02-16 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置

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JPS60165616A (ja) * 1984-02-08 1985-08-28 Toshiba Corp ビ−ム変換装置
US4793694A (en) * 1986-04-23 1988-12-27 Quantronix Corporation Method and apparatus for laser beam homogenization
JPS63203292A (ja) * 1987-02-18 1988-08-23 Toshiba Corp レ−ザ光の強度分布制御装置
JP2617040B2 (ja) * 1991-03-11 1997-06-04 学校法人東海大学 多面凸型プリズム
JPH0790358A (ja) * 1993-09-28 1995-04-04 Brother Ind Ltd レーザ焼入れ装置
JP3428175B2 (ja) * 1994-10-05 2003-07-22 株式会社日立製作所 表面処理層を有する構造物および表面処理層の形成方法
JPH1197340A (ja) * 1997-09-17 1999-04-09 Omron Corp 露光光学系、光加工装置、露光装置及び光結合装置
JP2003048095A (ja) * 2001-08-06 2003-02-18 Mitsubishi Heavy Ind Ltd レーザ加工ヘッド及びこれを用いる加工方法
JP2003211280A (ja) * 2002-01-21 2003-07-29 Nippon Sheet Glass Co Ltd レーザ発生装置、レーザ発生方法およびレーザを用いた加工方法
JP2004114065A (ja) * 2002-09-24 2004-04-15 Sharp Corp レーザ照射装置
TW200503057A (en) * 2003-06-11 2005-01-16 Adv Lcd Tech Dev Ct Co Ltd Crystallization apparatus, crystallization method, method of manufacturing thin film transistor, thin film transistor, and display apparatus
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
JP4697699B2 (ja) * 2004-04-28 2011-06-08 株式会社東芝 レーザー加工装置
US7708893B2 (en) * 2005-02-11 2010-05-04 General Electric Company System and method for providing filtration in a sun pinion bore
JP4589788B2 (ja) * 2005-04-04 2010-12-01 住友重機械工業株式会社 レーザ照射方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316722A (ja) * 1993-04-30 1994-11-15 Ntn Corp 円筒表面のレーザ焼入加工装置
JPH0819881A (ja) * 1994-06-30 1996-01-23 Mitsubishi Heavy Ind Ltd 管状体加熱用のレーザ装置
JPH08142203A (ja) * 1994-11-15 1996-06-04 Japan Synthetic Rubber Co Ltd 光造形装置
WO1996020435A1 (fr) * 1994-12-28 1996-07-04 Shinozaki Manufacturing Co., Ltd. Procede et appareil de traitement de rouleaux et autres par faisceau laser
JP2005177859A (ja) * 2003-08-21 2005-07-07 Leister Process Technologies 複数個の材料を同時に加熱するための方法ならびに装置
JP2005232586A (ja) 2004-01-22 2005-09-02 Mitsubishi Heavy Ind Ltd 管体の残留応力改善方法及び改善装置
JP2006015399A (ja) 2004-06-04 2006-01-19 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006037199A (ja) 2004-07-29 2006-02-09 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006035292A (ja) 2004-07-29 2006-02-09 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置
JP2006045598A (ja) * 2004-08-03 2006-02-16 Mitsubishi Heavy Ind Ltd 配管の残留応力改善装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020180316A (ja) * 2019-04-24 2020-11-05 公立大学法人 滋賀県立大学 レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
JP5185557B2 (ja) 2013-04-17
US20100059491A1 (en) 2010-03-11
EP2135702A1 (en) 2009-12-23
JP2008248310A (ja) 2008-10-16

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