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WO2008117513A1 - 導電性バンプとその製造方法および電子部品実装構造体 - Google Patents

導電性バンプとその製造方法および電子部品実装構造体 Download PDF

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Publication number
WO2008117513A1
WO2008117513A1 PCT/JP2008/000428 JP2008000428W WO2008117513A1 WO 2008117513 A1 WO2008117513 A1 WO 2008117513A1 JP 2008000428 W JP2008000428 W JP 2008000428W WO 2008117513 A1 WO2008117513 A1 WO 2008117513A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive bump
electronic component
producing
same
component mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000428
Other languages
English (en)
French (fr)
Inventor
Daisuke Sakurai
Yoshihiko Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2009506199A priority Critical patent/JP5152177B2/ja
Priority to CN2008800036928A priority patent/CN101601127B/zh
Priority to KR1020097015956A priority patent/KR101087344B1/ko
Priority to US12/522,239 priority patent/US8575751B2/en
Publication of WO2008117513A1 publication Critical patent/WO2008117513A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
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    • G—PHYSICS
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    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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Abstract

本発明は電子部品の電極面に形成された導電性バンプであって、導電性バンプが、異なる導電フィラー含有率を有する複数の感光性樹脂層よりなる構成を有する。これにより、電極と導電性バンプの接着強度の向上と接続抵抗の低減という相反する機能を備えた導電性バンプを実現できる。
PCT/JP2008/000428 2007-03-23 2008-03-04 導電性バンプとその製造方法および電子部品実装構造体 Ceased WO2008117513A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009506199A JP5152177B2 (ja) 2007-03-23 2008-03-04 導電性バンプとその製造方法および電子部品実装構造体
CN2008800036928A CN101601127B (zh) 2007-03-23 2008-03-04 导电性凸起及其制造方法以及电子部件安装结构体
KR1020097015956A KR101087344B1 (ko) 2007-03-23 2008-03-04 도전성 범프와 그 제조 방법 및 전자 부품 실장 구조체
US12/522,239 US8575751B2 (en) 2007-03-23 2008-03-04 Conductive bump, method for producing the same, and electronic component mounted structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-076317 2007-03-23
JP2007076317 2007-03-23

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WO2008117513A1 true WO2008117513A1 (ja) 2008-10-02

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PCT/JP2008/000428 Ceased WO2008117513A1 (ja) 2007-03-23 2008-03-04 導電性バンプとその製造方法および電子部品実装構造体

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