[go: up one dir, main page]

WO2008114797A1 - Composition de précurseur polyimide photosensible de type positif - Google Patents

Composition de précurseur polyimide photosensible de type positif Download PDF

Info

Publication number
WO2008114797A1
WO2008114797A1 PCT/JP2008/055006 JP2008055006W WO2008114797A1 WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1 JP 2008055006 W JP2008055006 W JP 2008055006W WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide precursor
positive type
type photosensitive
precursor composition
photosensitive polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055006
Other languages
English (en)
Japanese (ja)
Inventor
Yasuharu Yamada
Tomoyuki Suzuki
Yusuke Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Nagoya Industrial Science Research Institute
Original Assignee
Ibiden Co Ltd
Nagoya Industrial Science Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd, Nagoya Industrial Science Research Institute filed Critical Ibiden Co Ltd
Priority to JP2009505225A priority Critical patent/JP5188495B2/ja
Publication of WO2008114797A1 publication Critical patent/WO2008114797A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/005—Dendritic macromolecules
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

Cette invention concerne une composition de précurseur polyimide photosensible de type positif, laquelle composition adopte une nouvelle structure à l'état cuit et présente d'excellentes caractéristiques mécaniques et une excellente résistance à la chaleur. Cette composition est préparée au moyen d'un précurseur polyimide à plusieurs ramifications présentant une structure dendritique en tant que structure de base et au moyen d'un composé quinonediazide.
PCT/JP2008/055006 2007-03-19 2008-03-18 Composition de précurseur polyimide photosensible de type positif Ceased WO2008114797A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505225A JP5188495B2 (ja) 2007-03-19 2008-03-18 ポジ型感光性ポリイミド前駆体組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-069883 2007-03-19
JP2007069883 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008114797A1 true WO2008114797A1 (fr) 2008-09-25

Family

ID=39765904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055006 Ceased WO2008114797A1 (fr) 2007-03-19 2008-03-18 Composition de précurseur polyimide photosensible de type positif

Country Status (2)

Country Link
JP (1) JP5188495B2 (fr)
WO (1) WO2008114797A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175358A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009175357A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009258433A (ja) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
CN110128651A (zh) * 2019-05-10 2019-08-16 成都工业学院 一种可中温成型的含硅线性聚酰亚胺、制备方法及应用
CN110892004A (zh) * 2018-06-21 2020-03-17 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
CN112080003A (zh) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 一种支化聚酰亚胺前驱体树脂、光敏树脂组合物及其用途
US20220220308A1 (en) * 2019-04-09 2022-07-14 Lg Chem, Ltd. Polyamide-imide block copolymers, preparation method thereof and polyamide-imide film comprising the same
WO2024141321A1 (fr) * 2022-12-29 2024-07-04 Basf Se Polyimide hyper-ramifié photodurcissable et procédé de préparation correspondant

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102550865B1 (ko) * 2022-11-28 2023-07-04 주식회사 피엔에스테크놀로지 폴리아믹산에스테르와 이의 제조방법 및 상기 폴리아믹산에스테르를 포함하는 감광성 수지 조성물.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (ja) * 2001-01-29 2002-08-09 Jsr Corp ポジ型感光性ポリイミド組成物およびポリイミド膜
WO2004003057A1 (fr) * 2002-06-26 2004-01-08 Kanagawa University Composition durcissable, article durci obtenu a partir de cette composition et resine polyimide a utiliser dans cette composition
WO2004087793A1 (fr) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. Polyimide reticule, composition comprenant ce polyimide et procede permettant sa production
JP2006131706A (ja) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology ポリイミド系低誘電材料および高効率分離膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (ja) * 2001-01-29 2002-08-09 Jsr Corp ポジ型感光性ポリイミド組成物およびポリイミド膜
WO2004003057A1 (fr) * 2002-06-26 2004-01-08 Kanagawa University Composition durcissable, article durci obtenu a partir de cette composition et resine polyimide a utiliser dans cette composition
WO2004087793A1 (fr) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. Polyimide reticule, composition comprenant ce polyimide et procede permettant sa production
JP2006131706A (ja) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology ポリイミド系低誘電材料および高効率分離膜

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175358A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009175357A (ja) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂前駆体組成物、パターン硬化膜の製造方法及び電子部品
JP2009258433A (ja) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
CN110892004A (zh) * 2018-06-21 2020-03-17 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
JP2020527625A (ja) * 2018-06-21 2020-09-10 エルジー・ケム・リミテッド 分岐型共重合体、それを用いた感光性樹脂組成物、感光性樹脂フィルムおよび光学装置
CN110892004B (zh) * 2018-06-21 2022-03-18 株式会社Lg化学 支化共聚物以及使用其的光敏树脂组合物、光敏树脂膜和光学器件
JP7055463B2 (ja) 2018-06-21 2022-04-18 エルジー・ケム・リミテッド 分岐型共重合体、それを用いた感光性樹脂組成物、感光性樹脂フィルムおよび光学装置
US11981775B2 (en) 2018-06-21 2024-05-14 Lg Chem, Ltd. Branched copolymer, and photosensitive resin composition, photosensitive resin film and optical device using the same
US20220220308A1 (en) * 2019-04-09 2022-07-14 Lg Chem, Ltd. Polyamide-imide block copolymers, preparation method thereof and polyamide-imide film comprising the same
CN110128651A (zh) * 2019-05-10 2019-08-16 成都工业学院 一种可中温成型的含硅线性聚酰亚胺、制备方法及应用
CN112080003A (zh) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 一种支化聚酰亚胺前驱体树脂、光敏树脂组合物及其用途
WO2024141321A1 (fr) * 2022-12-29 2024-07-04 Basf Se Polyimide hyper-ramifié photodurcissable et procédé de préparation correspondant

Also Published As

Publication number Publication date
JPWO2008114797A1 (ja) 2010-07-08
JP5188495B2 (ja) 2013-04-24

Similar Documents

Publication Publication Date Title
WO2008114797A1 (fr) Composition de précurseur polyimide photosensible de type positif
WO2008126818A1 (fr) Composition de résine photosensible
WO2009014639A3 (fr) Biomarqueurs du prédiabète, des maladies cardiovasculaires et d'autres troubles liés au syndrome métabolique, et méthodes d'utilisation de ces biomarqueurs
WO2009038020A1 (fr) Composition adhésive pour composants électroniques et feuille adhésive pour composants électroniques utilisant cette composition
EP2177562A3 (fr) Polymère, composition en caoutchouc et pneumatique l'utilisant
DE112008002980A5 (de) Drehmomentwandler mit Turbinen-Massentilger
WO2009041172A3 (fr) Structure de stator
PL2222612T3 (pl) Kopolimer na bazie związku zawierającego grupę kwasu sulfonowego
EP1842408A4 (fr) Ensemble de module de puissance de resistance thermique faible
JP2008095094A5 (fr)
WO2008070234A3 (fr) Additifs d'amélioration de l'asphalte
DE602007007392D1 (de) Turbinentriebwerk mit einem Nachbrennkanal, der durch einen Lüftungsstrom verstellbarer Stärke gekühlt wird
DE602005005326D1 (de) Antifoulingzusammensetzungen mit salzgruppenhaltigem polymer
WO2008153154A1 (fr) Composé cyclique, matériau de base pour résine photosensible et composition pour résine photosensible
DE112006003626A5 (de) Drehmomentwandler mit Überbrückungskupplung zwischen zwei Dämpfern
ZA200709899B (en) Turbine fuel composition exhibiting improved cold properties
WO2012005452A3 (fr) Composé de résine polyester cristal-liquide entièrement aromatique ayant des propriétés isolantes améliorées
GB0712980D0 (en) Engine performance model
DE112007000500A5 (de) Einwegkupplung mit integriertem Stator
EP2110708A4 (fr) Composition de resine photosensible de type positif
EP2087296A4 (fr) Pompe à chaleur avec refroidisseur intermédiaire
JP2008285553A5 (fr)
EP1950249A4 (fr) Composition de resine a excellente resistance thermique
WO2008087991A1 (fr) Composition de résine, procédé servant à produire celle-ci et copolymère
WO2009011819A3 (fr) Compositions durcissables par voie aérobie à résistance thermique

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08738663

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009505225

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08738663

Country of ref document: EP

Kind code of ref document: A1