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WO2008114797A1 - Positive type photosensitive polyimide precursor composition - Google Patents

Positive type photosensitive polyimide precursor composition Download PDF

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Publication number
WO2008114797A1
WO2008114797A1 PCT/JP2008/055006 JP2008055006W WO2008114797A1 WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1 JP 2008055006 W JP2008055006 W JP 2008055006W WO 2008114797 A1 WO2008114797 A1 WO 2008114797A1
Authority
WO
WIPO (PCT)
Prior art keywords
polyimide precursor
positive type
type photosensitive
precursor composition
photosensitive polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/055006
Other languages
French (fr)
Japanese (ja)
Inventor
Yasuharu Yamada
Tomoyuki Suzuki
Yusuke Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Nagoya Industrial Science Research Institute
Original Assignee
Ibiden Co Ltd
Nagoya Industrial Science Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd, Nagoya Industrial Science Research Institute filed Critical Ibiden Co Ltd
Priority to JP2009505225A priority Critical patent/JP5188495B2/en
Publication of WO2008114797A1 publication Critical patent/WO2008114797A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/005—Dendritic macromolecules
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

A positive type photosensitive polyimide precursor composition which takes a novel structure in a cured state and which can exert excellent mechanical characteristics and heat resistance. The positive type photosensitive polyimide precursor composition is prepared by using both a multibranched polyimide precursor having a dendritic structure as the basic structure and a quinonediazide compound.
PCT/JP2008/055006 2007-03-19 2008-03-18 Positive type photosensitive polyimide precursor composition Ceased WO2008114797A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505225A JP5188495B2 (en) 2007-03-19 2008-03-18 Positive photosensitive polyimide precursor composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-069883 2007-03-19
JP2007069883 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008114797A1 true WO2008114797A1 (en) 2008-09-25

Family

ID=39765904

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055006 Ceased WO2008114797A1 (en) 2007-03-19 2008-03-18 Positive type photosensitive polyimide precursor composition

Country Status (2)

Country Link
JP (1) JP5188495B2 (en)
WO (1) WO2008114797A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175358A (en) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin precursor composition, method for producing patterned cured film, and electronic component
JP2009175357A (en) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin precursor composition, method for producing patterned cured film, and electronic component
JP2009258433A (en) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, production method of patterned cured film and electronic component
CN110128651A (en) * 2019-05-10 2019-08-16 成都工业学院 A kind of silicon-containing linear polyimide that can be molded at medium temperature, preparation method and application
CN110892004A (en) * 2018-06-21 2020-03-17 株式会社Lg化学 Branched copolymer and photosensitive resin composition, photosensitive resin film and optical device using the same
CN112080003A (en) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 Branched polyimide precursor resin, photosensitive resin composition and application thereof
US20220220308A1 (en) * 2019-04-09 2022-07-14 Lg Chem, Ltd. Polyamide-imide block copolymers, preparation method thereof and polyamide-imide film comprising the same
WO2024141321A1 (en) * 2022-12-29 2024-07-04 Basf Se Photocurable hyperbranched polyimide and preparation process thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102550865B1 (en) * 2022-11-28 2023-07-04 주식회사 피엔에스테크놀로지 Polyamic acid ester, method for its production and photosensitive resin composition comprising the polyamic acid ester.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (en) * 2001-01-29 2002-08-09 Jsr Corp Positive photosensitive polyimide composition and polyimide film
WO2004003057A1 (en) * 2002-06-26 2004-01-08 Kanagawa University Curable composition, cured article obtained therefrom, and polyimide resin for use in the same
WO2004087793A1 (en) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. Crosslinked polyimide, composition comprising the same and method for producing the same
JP2006131706A (en) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology Polyimide-based low dielectric material and highly efficient separation membrane

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002221793A (en) * 2001-01-29 2002-08-09 Jsr Corp Positive photosensitive polyimide composition and polyimide film
WO2004003057A1 (en) * 2002-06-26 2004-01-08 Kanagawa University Curable composition, cured article obtained therefrom, and polyimide resin for use in the same
WO2004087793A1 (en) * 2003-03-28 2004-10-14 Pi R & D Co. Ltd. Crosslinked polyimide, composition comprising the same and method for producing the same
JP2006131706A (en) * 2004-11-04 2006-05-25 Nagoya Institute Of Technology Polyimide-based low dielectric material and highly efficient separation membrane

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009175358A (en) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin precursor composition, method for producing patterned cured film, and electronic component
JP2009175357A (en) * 2008-01-23 2009-08-06 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin precursor composition, method for producing patterned cured film, and electronic component
JP2009258433A (en) * 2008-04-17 2009-11-05 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, production method of patterned cured film and electronic component
CN110892004A (en) * 2018-06-21 2020-03-17 株式会社Lg化学 Branched copolymer and photosensitive resin composition, photosensitive resin film and optical device using the same
JP2020527625A (en) * 2018-06-21 2020-09-10 エルジー・ケム・リミテッド Branched copolymer, photosensitive resin composition using the branched copolymer, photosensitive resin film and optical device
CN110892004B (en) * 2018-06-21 2022-03-18 株式会社Lg化学 Branched copolymer, and photosensitive resin composition, photosensitive resin film and optical device using the same
JP7055463B2 (en) 2018-06-21 2022-04-18 エルジー・ケム・リミテッド Branched copolymer, photosensitive resin composition using it, photosensitive resin film and optical device
US11981775B2 (en) 2018-06-21 2024-05-14 Lg Chem, Ltd. Branched copolymer, and photosensitive resin composition, photosensitive resin film and optical device using the same
US20220220308A1 (en) * 2019-04-09 2022-07-14 Lg Chem, Ltd. Polyamide-imide block copolymers, preparation method thereof and polyamide-imide film comprising the same
CN110128651A (en) * 2019-05-10 2019-08-16 成都工业学院 A kind of silicon-containing linear polyimide that can be molded at medium temperature, preparation method and application
CN112080003A (en) * 2019-06-13 2020-12-15 北京鼎材科技有限公司 Branched polyimide precursor resin, photosensitive resin composition and application thereof
WO2024141321A1 (en) * 2022-12-29 2024-07-04 Basf Se Photocurable hyperbranched polyimide and preparation process thereof

Also Published As

Publication number Publication date
JPWO2008114797A1 (en) 2010-07-08
JP5188495B2 (en) 2013-04-24

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