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WO2008114520A1 - 化学機械研磨パッドおよび化学機械研磨方法 - Google Patents

化学機械研磨パッドおよび化学機械研磨方法 Download PDF

Info

Publication number
WO2008114520A1
WO2008114520A1 PCT/JP2008/050393 JP2008050393W WO2008114520A1 WO 2008114520 A1 WO2008114520 A1 WO 2008114520A1 JP 2008050393 W JP2008050393 W JP 2008050393W WO 2008114520 A1 WO2008114520 A1 WO 2008114520A1
Authority
WO
WIPO (PCT)
Prior art keywords
chemical mechanical
mechanical polishing
polishing
layer
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050393
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Tano
Hideki Nishimura
Takafumi Shimizu
Daohai Wang
Iwao Mihara
Masayuki Motonari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Priority to JP2009505090A priority Critical patent/JPWO2008114520A1/ja
Publication of WO2008114520A1 publication Critical patent/WO2008114520A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　　本発明にかかる化学機械研磨パッド１０は、研磨装置定盤１３に固定されるための化学機械研磨パッドであって、研磨層１１と、前記研磨層と前記研磨装置定盤との間に設けられた接着層１２と、を含み、前記接着層において、前記研磨層の中央部を含む中央領域Ａの接着強度が、他の領域の接着強度より低い。
PCT/JP2008/050393 2007-03-19 2008-01-16 化学機械研磨パッドおよび化学機械研磨方法 Ceased WO2008114520A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009505090A JPWO2008114520A1 (ja) 2007-03-19 2008-01-16 化学機械研磨パッドおよび化学機械研磨方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007070116 2007-03-19
JP2007-070116 2007-03-19

Publications (1)

Publication Number Publication Date
WO2008114520A1 true WO2008114520A1 (ja) 2008-09-25

Family

ID=39765638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050393 Ceased WO2008114520A1 (ja) 2007-03-19 2008-01-16 化学機械研磨パッドおよび化学機械研磨方法

Country Status (3)

Country Link
JP (1) JPWO2008114520A1 (ja)
TW (1) TW200845170A (ja)
WO (1) WO2008114520A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028113A (ja) * 2008-07-18 2010-02-04 Rohm & Haas Electronic Materials Cmp Holdings Inc 複数層化学機械研磨パッド製造方法
WO2011118419A1 (ja) * 2010-03-25 2011-09-29 東洋ゴム工業株式会社 積層研磨パッド
JP2015532015A (ja) * 2012-09-19 2015-11-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を結合する方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159171A (ja) * 1987-12-15 1989-06-22 Toshiba Corp 研磨定盤
JP2000306870A (ja) * 1999-04-22 2000-11-02 Sumitomo Metal Ind Ltd 研磨パッド及び試料吸着パッド並びにこれらを用いた試料研磨装置及び試料研磨方法
JP2001219364A (ja) * 2000-02-04 2001-08-14 Hitachi Ltd 研磨パッド及び研磨方法及び研磨パッドを用いた加工物の製造方法
JP2007319980A (ja) * 2006-05-31 2007-12-13 Nitta Haas Inc 研磨パッド

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01159171A (ja) * 1987-12-15 1989-06-22 Toshiba Corp 研磨定盤
JP2000306870A (ja) * 1999-04-22 2000-11-02 Sumitomo Metal Ind Ltd 研磨パッド及び試料吸着パッド並びにこれらを用いた試料研磨装置及び試料研磨方法
JP2001219364A (ja) * 2000-02-04 2001-08-14 Hitachi Ltd 研磨パッド及び研磨方法及び研磨パッドを用いた加工物の製造方法
JP2007319980A (ja) * 2006-05-31 2007-12-13 Nitta Haas Inc 研磨パッド

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028113A (ja) * 2008-07-18 2010-02-04 Rohm & Haas Electronic Materials Cmp Holdings Inc 複数層化学機械研磨パッド製造方法
WO2011118419A1 (ja) * 2010-03-25 2011-09-29 東洋ゴム工業株式会社 積層研磨パッド
JP2012106328A (ja) * 2010-03-25 2012-06-07 Toyo Tire & Rubber Co Ltd 積層研磨パッド
JP2015532015A (ja) * 2012-09-19 2015-11-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を結合する方法
JP2018137480A (ja) * 2012-09-19 2018-08-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を結合する方法
US10131126B2 (en) 2012-09-19 2018-11-20 Applied Materials, Inc. Methods for bonding substrates

Also Published As

Publication number Publication date
JPWO2008114520A1 (ja) 2010-07-01
TW200845170A (en) 2008-11-16

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