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WO2008108359A1 - ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板 - Google Patents

ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板 Download PDF

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Publication number
WO2008108359A1
WO2008108359A1 PCT/JP2008/053831 JP2008053831W WO2008108359A1 WO 2008108359 A1 WO2008108359 A1 WO 2008108359A1 JP 2008053831 W JP2008053831 W JP 2008053831W WO 2008108359 A1 WO2008108359 A1 WO 2008108359A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder resist
cured product
compound
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053831
Other languages
English (en)
French (fr)
Inventor
Nobuaki Otsuki
Manabu Akiyama
Shouji Minegishi
Masao Arima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Shokubai Co Ltd
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Nippon Shokubai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Nippon Shokubai Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to US12/449,970 priority Critical patent/US8722816B2/en
Priority to CN200880006862.8A priority patent/CN101622578B/zh
Publication of WO2008108359A1 publication Critical patent/WO2008108359A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

　露光時の感度とアルカリ現像性を両立させることができ、温度変化による寸法安定性にも優れつつも脆さが発現せず、さらには、耐水性、電気絶縁性、冷熱サイクル耐性（耐ＴＣＴ）等に優れた硬化物を与えるソルダーレジスト、ソルダーレジスト層を備えたドライフィルム、硬化物ならびにプリント配線板を提供する。エポキシ化合物、フェノール化合物、不飽和一塩基酸、多塩基酸無水物から合成され、エポキシ化合物の少なくとも一部として融点９０°C以上の結晶性エポキシ樹脂を用い、フェノール化合物の少なくとも一部としてビスフェノールＳ骨格を有するものを用いて得られた酸変性ビニルエステルを含有するソルダーレジストである。
PCT/JP2008/053831 2007-03-05 2008-03-04 ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板 Ceased WO2008108359A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/449,970 US8722816B2 (en) 2007-03-05 2008-03-04 Solder resist, dry film thereof, cured product, and printed wiring board
CN200880006862.8A CN101622578B (zh) 2007-03-05 2008-03-04 阻焊剂、干膜及固化物以及印刷线路板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007053622 2007-03-05
JP2007-053622 2007-03-05

Publications (1)

Publication Number Publication Date
WO2008108359A1 true WO2008108359A1 (ja) 2008-09-12

Family

ID=39738237

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053831 Ceased WO2008108359A1 (ja) 2007-03-05 2008-03-04 ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板

Country Status (6)

Country Link
US (1) US8722816B2 (ja)
JP (2) JP4376290B2 (ja)
KR (1) KR100967086B1 (ja)
CN (1) CN101622578B (ja)
TW (1) TWI399393B (ja)
WO (1) WO2008108359A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4376290B2 (ja) * 2007-03-05 2009-12-02 株式会社日本触媒 ソルダーレジスト、そのドライフィルム及び硬化物ならびにプリント配線板
JP5439075B2 (ja) 2009-07-21 2014-03-12 太陽ホールディングス株式会社 光硬化性樹脂組成物
CN102792224A (zh) 2010-03-08 2012-11-21 株式会社Lg化学 具有优良耐热性和机械性能的光敏树脂组合物及印刷电路板用保护膜
WO2014021386A1 (ja) 2012-07-31 2014-02-06 旭化成イーマテリアルズ株式会社 エポキシ樹脂組成物、エポキシ樹脂、及び硬化物
TWI557176B (zh) * 2014-01-14 2016-11-11 Taiyo Ink Mfg Co Ltd A thermosetting resin composition, a hardened product thereof, and a printed wiring board using the same
CN105467753B (zh) * 2014-07-31 2020-01-14 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
JP6557155B2 (ja) * 2015-02-02 2019-08-07 株式会社日本触媒 硬化性樹脂およびその製造方法
KR101943934B1 (ko) * 2015-06-24 2019-01-30 고오 가가쿠고교 가부시키가이샤 솔더 레지스트 조성물, 피막, 피복 프린트 배선판, 피막의 제조 방법, 및 피복 프린트 배선판의 제조 방법
KR102574957B1 (ko) * 2015-09-30 2023-09-05 다이요 홀딩스 가부시키가이샤 경화성 수지 조성물, 드라이 필름 및 그것을 사용한 프린트 배선판
KR102527764B1 (ko) 2015-12-17 2023-05-02 삼성전자주식회사 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴
WO2018155174A1 (ja) * 2017-02-24 2018-08-30 富士フイルム株式会社 光硬化性インク組成物、及び、画像形成方法
JP2018168329A (ja) * 2017-03-30 2018-11-01 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および、カルボキシル基含有樹脂の製造方法
JPWO2023182273A1 (ja) * 2022-03-25 2023-09-28
KR20250103750A (ko) * 2022-11-21 2025-07-07 가부시기가이샤 닛뽕쇼꾸바이 알칼리 가용성 수지, 감광성 수지 조성물, 그 제조 방법, 및 그 용도
CN120276214B (zh) * 2024-11-18 2025-11-18 广东诚展科技股份有限公司 感光树脂组合物、阻焊油墨、干膜及固化物

Citations (2)

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Also Published As

Publication number Publication date
CN101622578B (zh) 2012-12-05
TWI399393B (zh) 2013-06-21
US20100243304A1 (en) 2010-09-30
KR20090130852A (ko) 2009-12-24
CN101622578A (zh) 2010-01-06
JP2008250306A (ja) 2008-10-16
JP4376290B2 (ja) 2009-12-02
KR100967086B1 (ko) 2010-07-01
JP4774070B2 (ja) 2011-09-14
JP2008250305A (ja) 2008-10-16
US8722816B2 (en) 2014-05-13
TW200842146A (en) 2008-11-01

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