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WO2008108341A1 - 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板 - Google Patents

表面粗化銅板の製造方法及び装置、並びに表面粗化銅板 Download PDF

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Publication number
WO2008108341A1
WO2008108341A1 PCT/JP2008/053786 JP2008053786W WO2008108341A1 WO 2008108341 A1 WO2008108341 A1 WO 2008108341A1 JP 2008053786 W JP2008053786 W JP 2008053786W WO 2008108341 A1 WO2008108341 A1 WO 2008108341A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper plate
copper
surface roughened
roughened copper
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053786
Other languages
English (en)
French (fr)
Inventor
Hajime Watanabe
Sadao Ishihama
Kiyoteru Yamamoto
Takahiro Imai
Toshihiro Oyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
Original Assignee
Furukawa Electric Co Ltd
Furukawa Automotive Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd, Furukawa Automotive Systems Inc filed Critical Furukawa Electric Co Ltd
Priority to JP2009502576A priority Critical patent/JP5323677B2/ja
Priority to CN2008800069014A priority patent/CN101622380B/zh
Priority to US12/529,560 priority patent/US8815072B2/en
Priority to EP08721206.4A priority patent/EP2133448B1/en
Publication of WO2008108341A1 publication Critical patent/WO2008108341A1/ja
Anticipated expiration legal-status Critical
Priority to US14/337,264 priority patent/US9758890B2/en
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

【課題】銅板の両面に微細瘤状突起を形成して銅板の両面を粗化する方法で、電気銅めっき液の劣化が進行し難い方法を提供する。 【解決手段】電気銅めっき液２中に、同極の電極３、３を対向配置し、その間に銅板４を配置して、まず銅板４を陽極、電極３、３を陰極とする電気分解により銅板４の両面に銅微粒子を生成させる陽極処理を行う。その後、銅板４を陰極、電極３、３を陽極とする電気銅めっきにより前記銅微粒子を銅板４の表面に定着させる陰極処理を行う。陽極処理と陰極処理を１サイクル以上行うことで、前記微細瘤状突起を形成する。
PCT/JP2008/053786 2007-03-02 2008-03-03 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板 Ceased WO2008108341A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009502576A JP5323677B2 (ja) 2007-03-02 2008-03-03 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板
CN2008800069014A CN101622380B (zh) 2007-03-02 2008-03-03 表面粗化铜板的制造方法和装置、以及表面粗化铜板
US12/529,560 US8815072B2 (en) 2007-03-02 2008-03-03 Method for producing a surface roughened copper plate
EP08721206.4A EP2133448B1 (en) 2007-03-02 2008-03-03 Production method and device for surface roughening of a copper plate
US14/337,264 US9758890B2 (en) 2007-03-02 2014-07-22 Production method and device of surface roughened copper plate, and surface roughened copper plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007052568 2007-03-02
JP2007-052568 2007-03-02

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/529,560 A-371-Of-International US8815072B2 (en) 2007-03-02 2008-03-03 Method for producing a surface roughened copper plate
US14/337,264 Division US9758890B2 (en) 2007-03-02 2014-07-22 Production method and device of surface roughened copper plate, and surface roughened copper plate

Publications (1)

Publication Number Publication Date
WO2008108341A1 true WO2008108341A1 (ja) 2008-09-12

Family

ID=39738219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053786 Ceased WO2008108341A1 (ja) 2007-03-02 2008-03-03 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板

Country Status (5)

Country Link
US (2) US8815072B2 (ja)
EP (1) EP2133448B1 (ja)
JP (2) JP5323677B2 (ja)
CN (2) CN102517617B (ja)
WO (1) WO2008108341A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011084801A (ja) * 2009-10-19 2011-04-28 Furukawa Electric Co Ltd:The 表面粗化銅板の製造方法および製造装置
JP2013028828A (ja) * 2011-07-27 2013-02-07 Furukawa Electric Co Ltd:The レーザ加工用銅板
KR20160047412A (ko) * 2014-10-22 2016-05-02 제이엑스 킨조쿠 가부시키가이샤 구리 방열재, 캐리어 부착 동박, 커넥터, 단자, 적층체, 실드재, 프린트 배선판, 금속 가공 부재, 전자 기기, 및, 프린트 배선판의 제조 방법
JPWO2019131092A1 (ja) * 2017-12-26 2020-12-03 Ｊｘ金属株式会社 放熱用銅箔及び放熱部材

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IN2014KN01697A (ja) * 2012-02-24 2015-10-23 Jfe Steel Corp
JP6062341B2 (ja) * 2013-10-23 2017-01-18 古河電気工業株式会社 銅・樹脂複合体、及びその製造方法
DE102014211298A1 (de) * 2014-06-13 2015-12-17 Robert Bosch Gmbh Substrat mit einer Oberflächenbeschichtung und Verfahren zum Beschichten einer Oberfläche eines Substrates
KR101615552B1 (ko) * 2014-11-17 2016-04-27 에스피텍 주식회사 다공성 구조를 가지는 도금층의 제조방법
JP6188959B2 (ja) 2015-02-26 2017-08-30 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． アタッチメントコーム及びヘアカッティング器具
CN106637318A (zh) * 2015-10-29 2017-05-10 神华集团有限责任公司 一种纳米结构阵列及其制备方法
WO2017111125A1 (ja) * 2015-12-25 2017-06-29 太陽誘電株式会社 プリント配線板、及びカメラモジュール
CN108330489A (zh) * 2018-04-20 2018-07-27 云南惠铜新材料科技有限公司 一种平滑轮廓铜箔表面粗化处理方法
CN114521069B (zh) * 2020-11-19 2024-02-23 健鼎（无锡）电子有限公司 铜块棕化治具及其制造方法
KR102454686B1 (ko) * 2020-12-30 2022-10-13 에스케이씨 주식회사 표면 처리 동박 및 이를 포함하는 회로 기판
CN114108055A (zh) * 2021-12-30 2022-03-01 四会富仕电子科技股份有限公司 一种电解粗化铜面的方法
CN117956692B (zh) * 2024-03-27 2024-05-28 深圳市板明科技股份有限公司 一种线路板碱性去悬铜液及其制备方法与去悬铜方法

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Title
See also references of EP2133448A4

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011084801A (ja) * 2009-10-19 2011-04-28 Furukawa Electric Co Ltd:The 表面粗化銅板の製造方法および製造装置
JP2013028828A (ja) * 2011-07-27 2013-02-07 Furukawa Electric Co Ltd:The レーザ加工用銅板
KR20160047412A (ko) * 2014-10-22 2016-05-02 제이엑스 킨조쿠 가부시키가이샤 구리 방열재, 캐리어 부착 동박, 커넥터, 단자, 적층체, 실드재, 프린트 배선판, 금속 가공 부재, 전자 기기, 및, 프린트 배선판의 제조 방법
JP2016084528A (ja) * 2014-10-22 2016-05-19 Ｊｘ金属株式会社 銅放熱材、キャリア付銅箔、コネクタ、端子、積層体、シールド材、プリント配線板、金属加工部材、電子機器、及び、プリント配線板の製造方法
US10464291B2 (en) 2014-10-22 2019-11-05 Jx Nippon Mining & Metals Corporation Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board
KR102475944B1 (ko) * 2014-10-22 2022-12-08 제이엑스금속주식회사 구리 방열재, 캐리어 부착 동박, 커넥터, 단자, 적층체, 실드재, 프린트 배선판, 금속 가공 부재, 전자 기기, 및, 프린트 배선판의 제조 방법
JPWO2019131092A1 (ja) * 2017-12-26 2020-12-03 Ｊｘ金属株式会社 放熱用銅箔及び放熱部材
JP7068341B2 (ja) 2017-12-26 2022-05-16 Ｊｘ金属株式会社 放熱用銅箔及び放熱部材

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US9758890B2 (en) 2017-09-12
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CN101622380A (zh) 2010-01-06
CN102517617A (zh) 2012-06-27
JP5684328B2 (ja) 2015-03-11
US20140339094A1 (en) 2014-11-20
EP2133448A1 (en) 2009-12-16
JP2013177695A (ja) 2013-09-09
EP2133448B1 (en) 2019-10-30
CN101622380B (zh) 2012-05-30
EP2133448A4 (en) 2011-04-27
JP5323677B2 (ja) 2013-10-23
US8815072B2 (en) 2014-08-26

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