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WO2008107991A1 - 電磁波吸収体 - Google Patents

電磁波吸収体 Download PDF

Info

Publication number
WO2008107991A1
WO2008107991A1 PCT/JP2007/054534 JP2007054534W WO2008107991A1 WO 2008107991 A1 WO2008107991 A1 WO 2008107991A1 JP 2007054534 W JP2007054534 W JP 2007054534W WO 2008107991 A1 WO2008107991 A1 WO 2008107991A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
absorbing layer
aluminum
electromagnetic
electromagnetic absorbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/054534
Other languages
English (en)
French (fr)
Inventor
Takao Ochiai
Yutaka Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/054534 priority Critical patent/WO2008107991A1/ja
Publication of WO2008107991A1 publication Critical patent/WO2008107991A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

 電磁波吸収体では、ガラス基板、プラスチック基板、半導体基板、セラミックス基板、粘着テープ等の高分子基材の基材上に、シード層が形成されている。シード層上に、アルミニウム層及び電磁波吸収層(10)がこの順で形成されている。アルミニウム層及び電磁波吸収層(10)の総厚は1μm程度である。電磁波吸収層(10)上に、保護膜が形成されている。電磁波吸収層(10)は、例えばアルミニウム又はアルミニウム合金の陽極酸化により形成された陽極酸化皮膜(4)が含まれている。陽極酸化皮膜(4)には、複数の円筒状のナノホール(5)が形成されている。ナノホール(5)の直径は、数nm~数百nm程度であり、ピッチは数十nm~500nm程度である。そして、各ナノホール(5)内に柱状の磁性材(6)が埋め込まれている。磁性材(6)は、例えばCo等の強磁性金属からなる。
PCT/JP2007/054534 2007-03-08 2007-03-08 電磁波吸収体 Ceased WO2008107991A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054534 WO2008107991A1 (ja) 2007-03-08 2007-03-08 電磁波吸収体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/054534 WO2008107991A1 (ja) 2007-03-08 2007-03-08 電磁波吸収体

Publications (1)

Publication Number Publication Date
WO2008107991A1 true WO2008107991A1 (ja) 2008-09-12

Family

ID=39737896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/054534 Ceased WO2008107991A1 (ja) 2007-03-08 2007-03-08 電磁波吸収体

Country Status (1)

Country Link
WO (1) WO2008107991A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189688A (ja) * 2009-02-17 2010-09-02 Fujifilm Corp 微細構造体の製造方法および微細構造体
CN103194776A (zh) * 2013-03-25 2013-07-10 东莞旭光五金氧化制品有限公司 铝基电磁吸收板材制作方法
US20130176683A1 (en) * 2012-01-06 2013-07-11 Tatung Company Electronic assembly

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057461A (ja) * 2001-05-10 2003-02-26 Canon Inc 光電融合基板および電子機器
JP2003124680A (ja) * 2001-10-15 2003-04-25 Sumitomo Electric Ind Ltd 電磁波吸収材料とその製造方法
JP2003152382A (ja) * 2001-11-09 2003-05-23 Hitachi Metals Ltd 電磁波吸収体およびその製造方法ならびに電子機器
JP2003229694A (ja) * 2002-02-05 2003-08-15 Sony Corp 電磁波吸収体およびその製造方法
JP2006075946A (ja) * 2004-09-09 2006-03-23 Fujitsu Ltd ナノホール構造体及びその製造方法、並びに、磁気記録媒体及びその製造方法
JP2006075942A (ja) * 2004-09-09 2006-03-23 Fujitsu Ltd 積層構造体、磁気記録媒体及びその製造方法、磁気記録装置及び磁気記録方法、並びに、該積層構造体を用いた素子
JP2006247795A (ja) * 2005-03-11 2006-09-21 Furukawa Electric Co Ltd:The ナノ構造体及びそれを用いた磁気記憶材料、配線基板、アンテナ基材
JP2006322067A (ja) * 2005-04-18 2006-11-30 Fujifilm Holdings Corp 構造体の製造方法
JP2007035149A (ja) * 2005-07-26 2007-02-08 Canon Inc 磁気構造体

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057461A (ja) * 2001-05-10 2003-02-26 Canon Inc 光電融合基板および電子機器
JP2003124680A (ja) * 2001-10-15 2003-04-25 Sumitomo Electric Ind Ltd 電磁波吸収材料とその製造方法
JP2003152382A (ja) * 2001-11-09 2003-05-23 Hitachi Metals Ltd 電磁波吸収体およびその製造方法ならびに電子機器
JP2003229694A (ja) * 2002-02-05 2003-08-15 Sony Corp 電磁波吸収体およびその製造方法
JP2006075946A (ja) * 2004-09-09 2006-03-23 Fujitsu Ltd ナノホール構造体及びその製造方法、並びに、磁気記録媒体及びその製造方法
JP2006075942A (ja) * 2004-09-09 2006-03-23 Fujitsu Ltd 積層構造体、磁気記録媒体及びその製造方法、磁気記録装置及び磁気記録方法、並びに、該積層構造体を用いた素子
JP2006247795A (ja) * 2005-03-11 2006-09-21 Furukawa Electric Co Ltd:The ナノ構造体及びそれを用いた磁気記憶材料、配線基板、アンテナ基材
JP2006322067A (ja) * 2005-04-18 2006-11-30 Fujifilm Holdings Corp 構造体の製造方法
JP2007035149A (ja) * 2005-07-26 2007-02-08 Canon Inc 磁気構造体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010189688A (ja) * 2009-02-17 2010-09-02 Fujifilm Corp 微細構造体の製造方法および微細構造体
US20130176683A1 (en) * 2012-01-06 2013-07-11 Tatung Company Electronic assembly
US8891241B2 (en) * 2012-01-06 2014-11-18 Tatung Company Electronic assembly
TWI492704B (zh) * 2012-01-06 2015-07-11 大同股份有限公司 電子組件
CN103194776A (zh) * 2013-03-25 2013-07-10 东莞旭光五金氧化制品有限公司 铝基电磁吸收板材制作方法
CN103194776B (zh) * 2013-03-25 2015-12-02 东莞旭光五金氧化制品有限公司 铝基电磁吸收板材制作方法

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