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WO2008106847A1 - Structure de dissipation thermique de del - Google Patents

Structure de dissipation thermique de del Download PDF

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Publication number
WO2008106847A1
WO2008106847A1 PCT/CN2007/003458 CN2007003458W WO2008106847A1 WO 2008106847 A1 WO2008106847 A1 WO 2008106847A1 CN 2007003458 W CN2007003458 W CN 2007003458W WO 2008106847 A1 WO2008106847 A1 WO 2008106847A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
hole
base
power led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2007/003458
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English (en)
French (fr)
Inventor
Ben Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshan Lide Electronic Enterprise Co Ltd
Original Assignee
Heshan Lide Electronic Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshan Lide Electronic Enterprise Co Ltd filed Critical Heshan Lide Electronic Enterprise Co Ltd
Publication of WO2008106847A1 publication Critical patent/WO2008106847A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Definitions

  • the utility model belongs to the field of lighting lamps, in particular to a high-power LED. Background technique
  • LEDs Light-emitting diodes
  • the existing solutions basically use heat-dissipating metal to dissipate the light-emitting diodes.
  • the purpose of the utility model is to provide a high-power LED with low thermal resistance, good heat dissipation effect, simple production process and low cost, so as to solve the above technical problems.
  • the utility model relates to a high-power LED, which comprises a transparent cover, a chip, a base, an electrode piece and a heat sink.
  • the base is in the shape of a cup and has a circular through hole at a central portion thereof, and the heat sink is in the through hole.
  • the inner wall of the circular through hole and the heat sink form a lamp cup
  • the chip is located in the lamp cup and is closely attached to the heat sink
  • the electrode piece of each polarity has at least two pieces at one end. Part electrode.
  • the chip is located on the axis of the circular through hole constituting the above lamp cup.
  • the inner wall of the circular through hole constituting the lamp cup is provided with a light reflecting layer.
  • the electrode sheets are divided into positive and negative polarities, and are connected to both sides of the base according to their polarities, and are in the same plane as the heat sink.
  • One end of the electrode sheet of the same polarity in the electrode sheet has two partial electrode sheets, that is, the entire electrode sheet has four partial electrode sheets.
  • a wire is connected between the chip and each of the partial electrodes in accordance with their polarities.
  • the side wall of the base has a recessed hole
  • the side wall of the transparent cover has an annular lug, and the annular lug is matched with the recessed hole.
  • the base has a boss, and a top surface of the boss is flush with a bottom surface of the recess.
  • the chip in the lamp cup is covered with a mixture of phosphor and silica gel.
  • the structure of the utility model is very simple, and the transparent cover and the base can be directly fabricated in the mold by using relatively cheap plastic materials, so the production process is simple, the cost is low, and the utility model is suitable for mass production; It is important to use the LED structure described above that it has less heat dissipation medium and less thermal resistance. After testing, its thermal resistance is below 10K/W (on/watt), so its heat dissipation effect is good.
  • the utility model is characterized in that the material with low price is used, and the thermal resistance of the heat dissipation system is also reduced, which not only achieves the purpose of heat dissipation but also saves cost.
  • Figure 1 is an external view of the utility model
  • Figure 2 is an exploded perspective view of the utility model
  • Figure 3 is a schematic view of the base of the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 5 is a plan view of the electrode sheet and the heat sink of the present invention. detailed description
  • the present invention includes a transparent cover 1, a base 2, a chip 3, an electrode sheet 4, and a heat sink 5.
  • the transparent cover 1 is a hemispherical shape having a certain curvature inside, so that it can refract light at a certain angle, and the side walls are provided with annular lugs 11; as shown in FIG. 2 and FIG.
  • the base 2 has a cup-shaped shape as a whole, and has a circular through hole 23 at a central portion thereof, two recessed holes 21 in the side wall, and four bosses 22 in the base near the side wall;
  • the electrode sheet 4 at the end of the base 2 is divided into two partial electrode sheets, and the heat sink 5 has a circular portion 51 in the middle and a square portion 52 on both sides.
  • Both the transparent cover 1 and the base 2 are made of plastic and molded in one time by a special mold. While the susceptor 2 is being formed, the electrode sheet 4 and the heat sink 5 are placed in the mold. After the susceptor 2 is formed, the electrode sheet 4 and the heat sink 5 are both embedded in the susceptor 2, as shown in FIGS. 1 and 2. The structure shown. The radius of the circular portion 51 in the middle of the heat sink 5 coincides with the radius of the circular through hole 23 on the base 2, and the circular portion 51 of the heat sink 5 is caught in the circular through hole 23, and the square portion 52 thereof penetrates.
  • the heat sink 5 and the inner wall of the circular through hole 23 form a lamp cup, and the chip 3 is located in the lamp cup and is in close contact with the heat sink 5, as shown in FIG.
  • the transparent cover 1 is placed on the base 2, and the lugs 11 on both sides of the transparent cover 1 cover the recesses 21 in the base 2 matching the lugs 11, and the remaining edges are covered in the base 2 Boss 22
  • the lugs 11 on both sides of the transparent cover 1 cover the recesses 21 in the base 2 matching the lugs 11, and the remaining edges are covered in the base 2 Boss 22
  • the bottom surface of the recessed hole 21 is in the same plane as the top surface of the four bosses 22.
  • the utility model has two main heat dissipation paths.
  • the main way is to transfer heat to the outside through the heat sink 5, and the secondary way is to dissipate heat through the electrode sheets 4.
  • the hot chip 3 is attached to the heat sink 5, and the heat sink 5 can be attached to other heat-conducting brackets to conduct heat;
  • the second way the electrode sheets on both sides of the base 2 are 4 points.
  • the two sub-electrode pieces are in the same plane as the heat sink 5, as shown in FIG. 5, and the chip 3 and the electrode sheet 4 are connected in polarity by the wire 6 with good thermal conductivity, and the chip 3 is produced.
  • the heat is conducted to the electrode sheet 4 via the wire 6, and is then radiated by the electrode sheet 4.
  • the electrode sheet 4 is divided into two partial electrode sheets to increase the heat dissipation area.
  • the partial electrode sheets at one end are connected by a plurality of wires 6 and a corresponding one pole on the chip 3.
  • the electrode sheets are respectively connected to the chip 3 by using two wires 6, that is, a total of four wires are used for connection to enhance the heat transfer effect.
  • the above structure makes the utility model have excellent heat dissipation effect, and the thermal resistance of the heat dissipation system of the utility model can be tested to be less than 10K/W (open/watt).
  • the utility model also adopts a series of corresponding measures.
  • the transparent cover 1 has a certain curvature, so that the light is refracted after being refracted at a certain angle.
  • the utility model is further plated with a reflective layer 231 on the inner wall of the circular through hole 23 to reflect a part of the light that is directed to the side.
  • the present invention sets the chip 3 at the center of the heat sink 5, that is, on the axis of the circular through hole 23; finally, on the chip 3 Covered with a mixture of phosphor and silica gel to increase luminescence and astigmatism.
  • the utility model has the advantages that the production process is simple, the cost is low, and the thermal resistance of the heat dissipation system is also reduced, which not only achieves the purpose of heat dissipation but also saves cost, and is suitable for mass production.

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

LED的散热结构 技术领域
本实用新型属于照明灯具领域， 尤其是指一种大功率 LED。 背景技术
发光二极管 (LED)作为照明灯具已经非常广泛地被使用， 为了追求更理想的照明光线效 果， 提升发光二极管的功率是最常用， 也是最经济的一种方法。 但随着发光二极管功率的 提高， 它的发热程度也更为严重。 发光二极管的发热， 对它的发光效率和使用寿命都有着 极为负面的影响， 因此现阶段人们对发光二极管的散热方法都进行了许多不同的尝试。 现 有的方案基本都是采用散热性能良好的金属给发光二极管散热， 比如使用全金属的灯座， 再附加散热块等等， 虽然有一定效果， 但是这样的方法成本太高， 散热介质多， 而且对于 金属的加工生产工艺很麻烦， 不适合大批量生产。 对于 LED的散热， 散热系统热阻的大小 是一个关键， 减少散热介质对降低热阻有明显的效果。 因此， 仅使用导热良好的材料并不 是最为有效且经济的方法， 减小散热系统的热阻才是最有效的手段。 发明内容
本实用新型的目的就是为了提供一种热阻低、 散热效果好， 且生产工艺简单、 成本低 的大功率 LED, 以解决上述存在的技术问题。
本实用新型是一种大功率 LED, 包括透明罩， 芯片， 基座， 电极片和散热片， 上述基座 呈杯碗状， 其中心部位有一个圆形通孔， 上述散热片在所述通孔内， 其特征是： 所述圆形 通孔内壁与散热片组成一个灯杯， 芯片位于此灯杯内且紧贴在散热片上， 所述每个极性的 电极片一端带有至少二片分电极片。
所述芯片位于构成上述灯杯的圆形通孔的轴线上。
所述构成上述灯杯的圆形通孔内壁上带有反光层。
所述电极片分为正、 负二个极性， 并按其极性连接在基座的两侧， 且与散热片在同一 个平面内。
所述电极片中同一个极性的电极片一端有二片分电极片， 即整个电极片有四片分电极 片。
所述的芯片与每一片分电极片之间有一根导线按其极性相连接。 所述基座的侧壁上有凹孔， 透明罩的侧壁上有环形凸耳， 该环形凸耳与上述凹孔相匹 配。
所述的基座内有凸台， 该凸台的顶面与上述凹孔的底面平齐。
所述灯杯内芯片上覆盖有荧光粉与硅胶的混合物。
本实用新型釆用上述的方案后， 它的结构非常简单， 透明罩与基座都可以采用相对便 宜的塑料材料直接在模具里制作， 因此生产工艺也简单， 成本低， 适合大批量生产； 更为 重要的一点是， 采用上述的 LED结构后， 它的散热介质少， 热阻小， 经过测试， '其热阻在 10K/W (开 /瓦） 以下， 因此它的散热效果良好。 本实用新型的特点在于使用价格便宜的材 料， 同时也减小了散热系统的热阻， 既达到了散热的目的又节省了成本。 附图说明
图 1是本实用新型的外观图；
图 2是本实用新型的分解示意图；
图 3是本实用新型中基座的示意图；
图 4是图 1中的 A-A剖视图；
图 5是本实用新型的电极片与散热片的俯视图。 具体实施方式
如图 1和图 2所示， 本实用新型包括透明罩 1， 基座 2, 芯片 3， 电极片 4和散热片 5。 如图 2和图 4中所示， 透明罩 1是一个半球形， 内部有一定的弧度， 使它能使光线折射一 定角度， 两侧壁上带有环形凸耳 11 ; 如图 2和图 3中所示， 基座 2整体呈杯碗状， 其中心 部位有一个圆形通孔 23， 侧壁上有两个凹孔 21，基座内靠近侧壁有四个凸台 22; 如图 5所 示， 位于基座 2—端的电极片 4分成两片分电极片， 散热片 5中间是圆形部位 51， 两侧延 伸有方形部位 52。
透明罩 1与基座 2都采用塑料制成， 通过专门的模具一次成型。在基座 2成型的同时， 将电极片 4和散热片 5置于模具内，基座 2成型后， 电极片 4和散热片 5都被镶嵌在基座 2 内，如图 1和图 2中所示结构。散热片 5中间的圆形部位 51的半径与基座 2上圆形通孔 23 的半径一致， 散热片 5的圆形部位 51卡在圆形通孔 23内， 而它的方形部位 52则贯穿于圆 形通孔 23的内壁， 这样散热片 5与圆形通孔 23内壁就形成了一个灯杯， 芯片 3位于此灯 杯内且紧贴在散热片 5上， 如图 2中所示。透明罩 1盖在基座 2上， 透明罩 1两侧的凸耳 11盖在基座 2上与凸耳 11相匹配的凹孔 21内， 其余边缘处则盖在基座 2内的四个凸台 22 上， 为了使透明罩 1平稳地盖在基座 2上， 所以制作基座 2时， 确保凹孔 21的底面与四个 凸台 22的顶面在同一个平面内。
本实用新型有主辅两个散热途径。 其主要途径即通过散热片 5传热至外界， 次要途径 是通过电极片 4散热。 第一个途径， 发热的芯片 3紧贴于散热片 5上， 散热片 5可贴附于 其它导热良好的支架上， 以传导热量； 第二个途径， 基座 2两侧的电极片 4分为两个分电 极片，此分电极片与散热片 5位于同一平面内， 如图 5中所示， 再用导热性能良好的导线 6 将芯片 3与电极片 4按极性连接，芯片 3产生的热量经导线 6传导至电极片 4，再由电极片 4散热。 电极片 4分为两个分电极片以增大散热面积， 另外为了更好的导热效果，一端的分 电极片都采用多根导线 6与芯片 3上相应的一极连接， 本实用新型一个分电极片分别使用 二根导线 6与芯片 3连接， 即总共使用四根导线连接， 增强传热效果。 以上结构使本实用 新型具备了优异的散热效果， 经测试本实用新型散热系统的热阻可以达到 10K/W (开 /瓦） 以下。
为了达到更好的光线效果， 本实用新型也采取了一系列相应的措施。 首先， 透明罩 1 带有一定弧度， 使光线经过一定角度的折射后出射； 其次， 本实用新型还在圆形通孔 23的 内壁上电镀有反光层 231， 使射向侧边的一部分光线反射向透明罩 1 ; 再者， 为了使光线效. 果更佳， 本实用新型将芯片 3设置于散热片 5的中心位置， 即位于圆形通孔 23的轴线上； 最后， 在芯片 3上还覆盖有荧光粉与硅胶的混合物， 以增加发光和散光效果。
本实用新型生产工艺也简单， 成本低， 同时也减小了散热系统的热阻， 既达到了散热 的目的又节省了成本， 适合于大批量生产。

Claims

权利要求
、 一种大功率 LED, 包括透明罩， 芯片， 基座， 电极片和散热片， 上述基座呈杯碗状， 其 中心部位有一个圆形通孔， 上述散热片在所述通孔内， 其特征是： 所述圆形通孔内壁与 散热片组成一个灯杯， 芯片位于此灯杯内且紧贴在散热片上， 所述每个极性的电极片一 端带有至少二片分电极片。
、 根据权利要求 1所述的大功率 LED, 其特征是： 所述芯片位于构成上述灯杯的圆形通孔. 的轴线上。
、 根据权利要求 1所述的大功率 LED, 其特征是： 所述构成上述灯杯的圆形通孔内壁上带 有反光层。
、 根据权利要求 1所述的大功率 LED, 其特征是： 所述电极片分为正、 负二个极性， 并按 其极性连接在基座的两侧， 且与散热片在同一个平面内。
、 根据权利要求 4所述的大功率 LED, 其特征是： 所述电极片中同一个极性的电极片一端 有二片分电极片， 即整个电极片有四片分电极片。
、 根据权利要求 5所述的大功率 LED, 其特征是： 所述的芯片与每一片分电极片之间都有 一根导线按其极性相连接。
、 根据权利要求 1所述的大功率 LED, 其特征是： 所述基座的侧壁上有凹孔， 透明罩的侧 壁上有环形凸耳， 该环形凸耳与上述凹孔相匹配。
、 根据权利要求 7所述的大功率 LED, 其特征是： 所述的基座内有凸台， 该凸台的顶面与 上述凹孔的底面平齐。
PCT/CN2007/003458 2007-03-08 2007-12-06 Structure de dissipation thermique de del Ceased WO2008106847A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200720049177.6 2007-03-08
CN200720049177.6U CN201038186Y (zh) 2007-03-08 2007-03-08 一种大功率led

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WO2008106847A1 true WO2008106847A1 (fr) 2008-09-12

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CN (1) CN201038186Y (zh)
WO (1) WO2008106847A1 (zh)

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CN201038186Y (zh) 2008-03-19

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