[go: up one dir, main page]

WO2008106847A1 - Structure de dissipation thermique de del - Google Patents

Structure de dissipation thermique de del Download PDF

Info

Publication number
WO2008106847A1
WO2008106847A1 PCT/CN2007/003458 CN2007003458W WO2008106847A1 WO 2008106847 A1 WO2008106847 A1 WO 2008106847A1 CN 2007003458 W CN2007003458 W CN 2007003458W WO 2008106847 A1 WO2008106847 A1 WO 2008106847A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
hole
base
power led
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2007/003458
Other languages
English (en)
Chinese (zh)
Inventor
Ben Fan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshan Lide Electronic Enterprise Co Ltd
Original Assignee
Heshan Lide Electronic Enterprise Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshan Lide Electronic Enterprise Co Ltd filed Critical Heshan Lide Electronic Enterprise Co Ltd
Publication of WO2008106847A1 publication Critical patent/WO2008106847A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Definitions

  • the utility model belongs to the field of lighting lamps, in particular to a high-power LED. Background technique
  • LEDs Light-emitting diodes
  • the existing solutions basically use heat-dissipating metal to dissipate the light-emitting diodes.
  • the purpose of the utility model is to provide a high-power LED with low thermal resistance, good heat dissipation effect, simple production process and low cost, so as to solve the above technical problems.
  • the utility model relates to a high-power LED, which comprises a transparent cover, a chip, a base, an electrode piece and a heat sink.
  • the base is in the shape of a cup and has a circular through hole at a central portion thereof, and the heat sink is in the through hole.
  • the inner wall of the circular through hole and the heat sink form a lamp cup
  • the chip is located in the lamp cup and is closely attached to the heat sink
  • the electrode piece of each polarity has at least two pieces at one end. Part electrode.
  • the chip is located on the axis of the circular through hole constituting the above lamp cup.
  • the inner wall of the circular through hole constituting the lamp cup is provided with a light reflecting layer.
  • the electrode sheets are divided into positive and negative polarities, and are connected to both sides of the base according to their polarities, and are in the same plane as the heat sink.
  • One end of the electrode sheet of the same polarity in the electrode sheet has two partial electrode sheets, that is, the entire electrode sheet has four partial electrode sheets.
  • a wire is connected between the chip and each of the partial electrodes in accordance with their polarities.
  • the side wall of the base has a recessed hole
  • the side wall of the transparent cover has an annular lug, and the annular lug is matched with the recessed hole.
  • the base has a boss, and a top surface of the boss is flush with a bottom surface of the recess.
  • the chip in the lamp cup is covered with a mixture of phosphor and silica gel.
  • the structure of the utility model is very simple, and the transparent cover and the base can be directly fabricated in the mold by using relatively cheap plastic materials, so the production process is simple, the cost is low, and the utility model is suitable for mass production; It is important to use the LED structure described above that it has less heat dissipation medium and less thermal resistance. After testing, its thermal resistance is below 10K/W (on/watt), so its heat dissipation effect is good.
  • the utility model is characterized in that the material with low price is used, and the thermal resistance of the heat dissipation system is also reduced, which not only achieves the purpose of heat dissipation but also saves cost.
  • Figure 1 is an external view of the utility model
  • Figure 2 is an exploded perspective view of the utility model
  • Figure 3 is a schematic view of the base of the present invention.
  • Figure 4 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 5 is a plan view of the electrode sheet and the heat sink of the present invention. detailed description
  • the present invention includes a transparent cover 1, a base 2, a chip 3, an electrode sheet 4, and a heat sink 5.
  • the transparent cover 1 is a hemispherical shape having a certain curvature inside, so that it can refract light at a certain angle, and the side walls are provided with annular lugs 11; as shown in FIG. 2 and FIG.
  • the base 2 has a cup-shaped shape as a whole, and has a circular through hole 23 at a central portion thereof, two recessed holes 21 in the side wall, and four bosses 22 in the base near the side wall;
  • the electrode sheet 4 at the end of the base 2 is divided into two partial electrode sheets, and the heat sink 5 has a circular portion 51 in the middle and a square portion 52 on both sides.
  • Both the transparent cover 1 and the base 2 are made of plastic and molded in one time by a special mold. While the susceptor 2 is being formed, the electrode sheet 4 and the heat sink 5 are placed in the mold. After the susceptor 2 is formed, the electrode sheet 4 and the heat sink 5 are both embedded in the susceptor 2, as shown in FIGS. 1 and 2. The structure shown. The radius of the circular portion 51 in the middle of the heat sink 5 coincides with the radius of the circular through hole 23 on the base 2, and the circular portion 51 of the heat sink 5 is caught in the circular through hole 23, and the square portion 52 thereof penetrates.
  • the heat sink 5 and the inner wall of the circular through hole 23 form a lamp cup, and the chip 3 is located in the lamp cup and is in close contact with the heat sink 5, as shown in FIG.
  • the transparent cover 1 is placed on the base 2, and the lugs 11 on both sides of the transparent cover 1 cover the recesses 21 in the base 2 matching the lugs 11, and the remaining edges are covered in the base 2 Boss 22
  • the lugs 11 on both sides of the transparent cover 1 cover the recesses 21 in the base 2 matching the lugs 11, and the remaining edges are covered in the base 2 Boss 22
  • the bottom surface of the recessed hole 21 is in the same plane as the top surface of the four bosses 22.
  • the utility model has two main heat dissipation paths.
  • the main way is to transfer heat to the outside through the heat sink 5, and the secondary way is to dissipate heat through the electrode sheets 4.
  • the hot chip 3 is attached to the heat sink 5, and the heat sink 5 can be attached to other heat-conducting brackets to conduct heat;
  • the second way the electrode sheets on both sides of the base 2 are 4 points.
  • the two sub-electrode pieces are in the same plane as the heat sink 5, as shown in FIG. 5, and the chip 3 and the electrode sheet 4 are connected in polarity by the wire 6 with good thermal conductivity, and the chip 3 is produced.
  • the heat is conducted to the electrode sheet 4 via the wire 6, and is then radiated by the electrode sheet 4.
  • the electrode sheet 4 is divided into two partial electrode sheets to increase the heat dissipation area.
  • the partial electrode sheets at one end are connected by a plurality of wires 6 and a corresponding one pole on the chip 3.
  • the electrode sheets are respectively connected to the chip 3 by using two wires 6, that is, a total of four wires are used for connection to enhance the heat transfer effect.
  • the above structure makes the utility model have excellent heat dissipation effect, and the thermal resistance of the heat dissipation system of the utility model can be tested to be less than 10K/W (open/watt).
  • the utility model also adopts a series of corresponding measures.
  • the transparent cover 1 has a certain curvature, so that the light is refracted after being refracted at a certain angle.
  • the utility model is further plated with a reflective layer 231 on the inner wall of the circular through hole 23 to reflect a part of the light that is directed to the side.
  • the present invention sets the chip 3 at the center of the heat sink 5, that is, on the axis of the circular through hole 23; finally, on the chip 3 Covered with a mixture of phosphor and silica gel to increase luminescence and astigmatism.
  • the utility model has the advantages that the production process is simple, the cost is low, and the thermal resistance of the heat dissipation system is also reduced, which not only achieves the purpose of heat dissipation but also saves cost, and is suitable for mass production.

Landscapes

  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une structure de dissipation thermique d'une DEL, comprenant un couvercle translucide (1), une puce (3), une base (2), des parties d'électrode (3) et un dissipateur thermique (5). La base (2) présente une forme de cuvette. Un trou traversant circulaire (23) est formé au centre de la base (2). Le dissipateur thermique (5) est placé dans le trou traversant (23). La puce (3) est montée sur le dissipateur thermique (5). Chaque électrode de puce (3) est reliée à au moins deux parties d'électrode (5). La chaleur est dissipée par le dissipateur thermique (5) et les parties d'électrode (4).
PCT/CN2007/003458 2007-03-08 2007-12-06 Structure de dissipation thermique de del Ceased WO2008106847A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200720049177.6 2007-03-08
CN200720049177.6U CN201038186Y (zh) 2007-03-08 2007-03-08 一种大功率led

Publications (1)

Publication Number Publication Date
WO2008106847A1 true WO2008106847A1 (fr) 2008-09-12

Family

ID=39210706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2007/003458 Ceased WO2008106847A1 (fr) 2007-03-08 2007-12-06 Structure de dissipation thermique de del

Country Status (3)

Country Link
JP (1) JP3141198U (fr)
CN (1) CN201038186Y (fr)
WO (1) WO2008106847A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8283361B2 (en) 2008-06-04 2012-10-09 Astrazeneca Ab Heterocyclic urea derivatives and methods of use thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102044537B (zh) * 2009-10-22 2012-11-28 亿光电子工业股份有限公司 发光二极管封装结构
CN102330898A (zh) * 2011-07-21 2012-01-25 苏州晶雷光电照明科技有限公司 防眩光led日光灯
JP6110528B2 (ja) * 2016-02-03 2017-04-05 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050269589A1 (en) * 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
US7119422B2 (en) * 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
CN2842747Y (zh) * 2005-11-07 2006-11-29 大铎精密工业股份有限公司 发光二极管引线架
TWI268631B (en) * 2005-08-26 2006-12-11 Headlite Tech Corporation Manufacturing method and structure of LED device which combines a base with a module filled of lens colloid, wherein the base is completed with diode chip setting, wire connection, and light-collecting layer cover

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050269589A1 (en) * 2004-06-04 2005-12-08 Lite-On It Technology Corporation Power LED package module
US7119422B2 (en) * 2004-11-15 2006-10-10 Unity Opto Technology Co., Ltd. Solid-state semiconductor light emitting device
TWI268631B (en) * 2005-08-26 2006-12-11 Headlite Tech Corporation Manufacturing method and structure of LED device which combines a base with a module filled of lens colloid, wherein the base is completed with diode chip setting, wire connection, and light-collecting layer cover
CN2842747Y (zh) * 2005-11-07 2006-11-29 大铎精密工业股份有限公司 发光二极管引线架

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8283361B2 (en) 2008-06-04 2012-10-09 Astrazeneca Ab Heterocyclic urea derivatives and methods of use thereof

Also Published As

Publication number Publication date
JP3141198U (ja) 2008-04-24
CN201038186Y (zh) 2008-03-19

Similar Documents

Publication Publication Date Title
CN201237096Y (zh) 一种改进的led灯具
WO2010043115A1 (fr) Lampe d'éclairage à diodes électroluminescentes
CN201764311U (zh) 具有散热通道的led节能灯
CN201237199Y (zh) 一种led灯
CN201237095Y (zh) 一种led灯具
CN201462472U (zh) 室内led照明灯泡
WO2008106847A1 (fr) Structure de dissipation thermique de del
WO2011035645A1 (fr) Ampoule à led à multiples couches de structures rayonnantes
KR100897919B1 (ko) 고휘도 ｌｅｄ 등명기
CN201078686Y (zh) 一种多向光源发光组件
CN201096292Y (zh) Led崁灯结构
WO2013086795A1 (fr) Nouvelle lampe à diodes électroluminescentes d'éclairage commune
CN202140879U (zh) 一种led 灯
CN201237198Y (zh) 一种led灯具散热装置
CN201050705Y (zh) 高亮度led照明装置
CN201232979Y (zh) 一种led射灯
CN202209530U (zh) 大功率led筒灯
WO2012149820A1 (fr) Ampoule à diode électroluminescente
CN209054359U (zh) 快速散热的led灯泡
CN222186869U (zh) 一种高散热防水的led工矿灯
CN201322284Y (zh) 一种led射灯的散热装置
CN207179231U (zh) 一种led球泡灯散热结构
CN202791435U (zh) 一种大功率led灯
CN201983240U (zh) 一种散热装置及使用该散热装置的led灯
WO2011003319A1 (fr) Lampe à del combinée

Legal Events

Date Code Title Description
DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07845819

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07845819

Country of ref document: EP

Kind code of ref document: A1