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WO2008105481A1 - 回路基板の製造方法 - Google Patents

回路基板の製造方法 Download PDF

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Publication number
WO2008105481A1
WO2008105481A1 PCT/JP2008/053462 JP2008053462W WO2008105481A1 WO 2008105481 A1 WO2008105481 A1 WO 2008105481A1 JP 2008053462 W JP2008053462 W JP 2008053462W WO 2008105481 A1 WO2008105481 A1 WO 2008105481A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
metal film
resin composition
circuit board
hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053462
Other languages
English (en)
French (fr)
Inventor
Hirohisa Narahashi
Shigeo Nakamura
Tadahiko Yokota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2009501289A priority Critical patent/JP4978691B2/ja
Priority to KR1020097020622A priority patent/KR101464141B1/ko
Priority to CN2008800067377A priority patent/CN101627667B/zh
Publication of WO2008105481A1 publication Critical patent/WO2008105481A1/ja
Priority to US12/551,802 priority patent/US8357443B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1438—Metal containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1438—Metal containing
    • Y10T428/1443—Aluminum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1476—Release layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

　絶縁層と、該絶縁層に対する密着性及び均一性に優れる金属膜層とを効率的に形成することができる、回路基板の製造方法を提供する。 　支持体層上に、水溶性高分子離型層、金属膜層及び硬化性樹脂組成物層がこの順に形成されてなり、前記水溶性高分子離型層が、後記の硬化性樹脂組成物層の硬化工程後に支持体層－離型層間で剥離可能となる剥離性を有する金属膜付き接着フィルムを、硬化性樹脂組成物層が基板と接するよう基板に重ねて積層する工程、硬化性樹脂組成物層を硬化する工程、支持体層を剥離する工程、及び金属膜層上に存在する水溶性高分子離型層を水溶液で溶解除去する工程を含む、回路基板の製造方法。該構成により、絶縁層表面をアルカリ性過マンガン酸カリウム溶液等の酸化剤で粗化することなく、該表面に密着性及び均一性の高い金属膜層を形成することができるので、回路形成におけるエッチングをより温和な条件で実施することが可能となり、多層プリント配線板、フレキシブルプリント配線板等の回路基板の微細配線化に優れた効果を発揮する。
PCT/JP2008/053462 2007-03-01 2008-02-28 回路基板の製造方法 Ceased WO2008105481A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009501289A JP4978691B2 (ja) 2007-03-01 2008-02-28 回路基板の製造方法
KR1020097020622A KR101464141B1 (ko) 2007-03-01 2008-02-28 회로 기판 제조 방법
CN2008800067377A CN101627667B (zh) 2007-03-01 2008-02-28 电路板的制造方法
US12/551,802 US8357443B2 (en) 2007-03-01 2009-09-01 Laminate including water soluble release layer for producing circuit board and method of producing circuit board

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007052055 2007-03-01
JP2007052060 2007-03-01
JP2007-052055 2007-03-01
JP2007-052060 2007-03-01
JP2007-216342 2007-08-22
JP2007216342 2007-08-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/551,802 Continuation US8357443B2 (en) 2007-03-01 2009-09-01 Laminate including water soluble release layer for producing circuit board and method of producing circuit board

Publications (1)

Publication Number Publication Date
WO2008105481A1 true WO2008105481A1 (ja) 2008-09-04

Family

ID=39721305

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053462 Ceased WO2008105481A1 (ja) 2007-03-01 2008-02-28 回路基板の製造方法

Country Status (6)

Country Link
US (1) US8357443B2 (ja)
JP (1) JP4978691B2 (ja)
KR (1) KR101464141B1 (ja)
CN (1) CN101627667B (ja)
TW (1) TWI437938B (ja)
WO (1) WO2008105481A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101841979A (zh) * 2009-03-13 2010-09-22 味之素株式会社 包覆有金属的叠层板
JPWO2010061980A1 (ja) * 2008-11-28 2012-04-26 味の素株式会社 樹脂組成物
JP2012119461A (ja) * 2010-11-30 2012-06-21 Ajinomoto Co Inc 金属張積層板の製造方法
KR20140112405A (ko) 2013-03-13 2014-09-23 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법 및 그것에 사용하는 캐리어 금속박 부착 프리프레그 함유 복합재
WO2019013039A1 (ja) * 2017-07-10 2019-01-17 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
WO2019013038A1 (ja) * 2017-07-10 2019-01-17 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
WO2019013040A1 (ja) * 2017-07-10 2019-01-17 Dic株式会社 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品
WO2019053947A1 (ja) * 2017-09-13 2019-03-21 日東電工株式会社 配線構造体、および、配線層の転写方法

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Publication number Priority date Publication date Assignee Title
WO2008105480A1 (ja) * 2007-03-01 2008-09-04 Ajinomoto Co., Inc. 金属膜転写用フィルム、金属膜の転写方法及び回路基板の製造方法
JP2009231790A (ja) * 2008-02-27 2009-10-08 Ajinomoto Co Inc 多層プリント配線板の製造方法
US9005391B2 (en) * 2009-06-12 2015-04-14 Hazen Paper Company Method and apparatus for transfer lamination
WO2012164612A1 (ja) * 2011-05-31 2012-12-06 パナソニック株式会社 接合体の製造方法及び接合体
JP6300321B2 (ja) * 2012-08-07 2018-03-28 株式会社Ｊｏｌｅｄ 接合体の製造方法及び接合体
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
US10099462B2 (en) 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
US9630385B2 (en) 2012-11-08 2017-04-25 Toray Plastics (America), Inc. Releasable polyester metal transfer film
KR101676119B1 (ko) * 2014-12-01 2016-11-14 주식회사 두산 연성 인쇄회로기판 형성용 절연 수지 시트 및 이의 제조방법, 이를 포함하는 인쇄회로기판
JP6592246B2 (ja) * 2015-01-27 2019-10-16 株式会社コムラテック 電子回路基板およびその製造方法
JP6642194B2 (ja) * 2016-03-29 2020-02-05 味の素株式会社 プリント配線板の製造方法
CN106053505A (zh) * 2016-05-17 2016-10-26 深圳市宁深检验检测技术有限公司 一种表面覆膜金片金含量及金质量的快速测定方法
JP6793517B2 (ja) * 2016-10-17 2020-12-02 株式会社ダイセル シート状プリプレグ
JP6738718B2 (ja) * 2016-11-30 2020-08-12 新光電気工業株式会社 配線基板の製造方法
DE102016123795A1 (de) * 2016-12-08 2018-06-14 Gottfried Wilhelm Leibniz Universität Hannover Verfahren zur Anbringung einer elektrischen Mikrostruktur sowie Elastomerstruktur, Faserverbundbauteil und Reifen
DE102020111105A1 (de) * 2020-04-23 2021-10-28 Leonhard Kurz Stiftung & Co. Kg Transferprodukt und Verfahren zum Recyclen eines Transferprodukts
US12185477B2 (en) * 2021-03-19 2024-12-31 Ajinomoto Co., Inc. Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring board
JP7663395B2 (ja) * 2021-03-31 2025-04-16 株式会社フジミインコーポレーテッド 基板の製造方法および表面処理方法

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JPS63228798A (ja) * 1987-03-18 1988-09-22 ソニー株式会社 両面回路基板の製法
JP2002324969A (ja) * 2001-02-21 2002-11-08 Panac Co Ltd 金属層転写フィルム及び金属層の転写方法
JP2003095947A (ja) * 2001-09-25 2003-04-03 Kyukyu Yakuhin Kogyo Kk ニコチン含有フィルム製剤
JP2004230729A (ja) * 2003-01-30 2004-08-19 Mitsubishi Plastics Ind Ltd 金属薄膜転写用フィルム
JP2005056269A (ja) * 2003-08-06 2005-03-03 Konica Minolta Photo Imaging Inc Ｉｃモジュール、ｉｃモジュールの製造方法、ｉｃカード及びｉｃカードの製造方法
JP2005311202A (ja) * 2004-04-23 2005-11-04 Matsushita Electric Works Ltd 配線基板及びその製造方法
JP2006228919A (ja) * 2005-02-17 2006-08-31 Nec Corp 配線基板及び半導体装置並びにそれらの製造方法

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JPH09296156A (ja) 1996-05-01 1997-11-18 Ajinomoto Co Inc 金属薄層付き多層プリント配線板用層間接着フィルム、及びこれを用いた多層プリント配線板とその製造法
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