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WO2009002083A3 - Manufacturing method of fpcb - Google Patents

Manufacturing method of fpcb Download PDF

Info

Publication number
WO2009002083A3
WO2009002083A3 PCT/KR2008/003622 KR2008003622W WO2009002083A3 WO 2009002083 A3 WO2009002083 A3 WO 2009002083A3 KR 2008003622 W KR2008003622 W KR 2008003622W WO 2009002083 A3 WO2009002083 A3 WO 2009002083A3
Authority
WO
WIPO (PCT)
Prior art keywords
foam sheet
adhesive layer
fpcb
high temperature
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2008/003622
Other languages
French (fr)
Other versions
WO2009002083A2 (en
Inventor
Kwang Choon Chung
Myoung Seon Gong
Jin O Lee
Myoung Hee Joo
Hee Yong Ahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haeun Chemtec Co Ltd
Original Assignee
Haeun Chemtec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haeun Chemtec Co Ltd filed Critical Haeun Chemtec Co Ltd
Priority to CN2008800095358A priority Critical patent/CN101682994B/en
Priority to JP2010500847A priority patent/JP5021806B2/en
Publication of WO2009002083A2 publication Critical patent/WO2009002083A2/en
Publication of WO2009002083A3 publication Critical patent/WO2009002083A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The present invention relates to a flexible printed circuit board (FPCB) using a foam sheet that is foamed at a high temperature. The foam sheet is formed by stacking, sequentially, a substrate, a surface treating layer, an adhesive layer and a release film, and the adhesive layer contains thermally expandable microspheres and an interactive copolymer. By employing the interactive copolymer resin of the foam sheet as an adhesive layer, the foam sheet has an excellent adhesive strength and can be simply separated from an adherend by high temperature heating.
PCT/KR2008/003622 2007-06-25 2008-06-25 Manufacturing method of fpcb Ceased WO2009002083A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800095358A CN101682994B (en) 2007-06-25 2008-06-25 Manufacturing method of fpcb
JP2010500847A JP5021806B2 (en) 2007-06-25 2008-06-25 Method for producing flexible circuit board using high-temperature foam sheet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070062512A KR100945039B1 (en) 2007-06-25 2007-06-25 Manufacturing Method of Flexible Circuit Board Using High Temperature Foam Sheet
KR10-2007-0062512 2007-06-25

Publications (2)

Publication Number Publication Date
WO2009002083A2 WO2009002083A2 (en) 2008-12-31
WO2009002083A3 true WO2009002083A3 (en) 2009-02-26

Family

ID=40186166

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/003622 Ceased WO2009002083A2 (en) 2007-06-25 2008-06-25 Manufacturing method of fpcb

Country Status (5)

Country Link
JP (1) JP5021806B2 (en)
KR (1) KR100945039B1 (en)
CN (1) CN101682994B (en)
TW (1) TWI406608B (en)
WO (1) WO2009002083A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101055495B1 (en) * 2009-04-14 2011-08-08 삼성전기주식회사 Carrier member for substrate manufacturing and substrate manufacturing method using same
KR101122146B1 (en) * 2009-11-25 2012-03-16 엘지이노텍 주식회사 Half Buried PCB, Multi-Layer PCB and Fabricating Method of the same
WO2011078152A1 (en) * 2009-12-25 2011-06-30 日東電工株式会社 Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
US8961678B2 (en) * 2012-12-20 2015-02-24 Rohm And Haas Electronic Materials Llc Organic solderability preservative and method
CN104646861A (en) * 2013-11-25 2015-05-27 刘现梅 Soldering flux containing thiadiazole derivative
CN111993731B (en) * 2019-05-27 2023-11-14 宁波长阳科技股份有限公司 Foaming release film and preparation method thereof
CN115260877A (en) * 2022-08-02 2022-11-01 广东希贵光固化材料有限公司 UV temporary protective coating for heating film fading and application thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07188502A (en) * 1993-11-16 1995-07-25 Sumitomo Chem Co Ltd Aqueous emulsion composition for flame-retardant foam sheet
KR20020060660A (en) * 2002-06-24 2002-07-18 민병성 Manufacturing method of double access typed flexible printed circuit board
KR20020060659A (en) * 2002-06-24 2002-07-18 민병성 Manufacturing method of single side typed flexible printed circuit board
KR20030023416A (en) * 2001-09-13 2003-03-19 (주)해은켐텍 Heat-exfoliation type foam sheet comprising emulsion type adhesive

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109294A (en) * 1983-11-18 1985-06-14 ソニー株式会社 Method of producing flexible circuit board
JPH0768499B2 (en) * 1988-12-02 1995-07-26 株式会社日本触媒 Aqueous dispersion type pressure sensitive adhesive composition
JPH0768501B2 (en) * 1988-12-08 1995-07-26 株式会社日本触媒 Contact adhesive composition for composites
JP4115711B2 (en) * 2002-02-14 2008-07-09 日東電工株式会社 Adhesive sheet for fixing flexible printed wiring board and method for mounting electronic component on flexible printed wiring board
KR20020060657A (en) * 2002-06-24 2002-07-18 민병성 Manufacturing method of thin film flexible printed circuit board
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
JP4475934B2 (en) * 2003-12-17 2010-06-09 日本カーバイド工業株式会社 Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same
JP2005200505A (en) * 2004-01-14 2005-07-28 Nitto Denko Corp Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend
JP4906035B2 (en) * 2005-05-19 2012-03-28 日本カーバイド工業株式会社 Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same
TWI321241B (en) * 2005-09-14 2010-03-01 Ind Tech Res Inst Flexible pixel array substrate and method of fabricating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07188502A (en) * 1993-11-16 1995-07-25 Sumitomo Chem Co Ltd Aqueous emulsion composition for flame-retardant foam sheet
KR20030023416A (en) * 2001-09-13 2003-03-19 (주)해은켐텍 Heat-exfoliation type foam sheet comprising emulsion type adhesive
KR20020060660A (en) * 2002-06-24 2002-07-18 민병성 Manufacturing method of double access typed flexible printed circuit board
KR20020060659A (en) * 2002-06-24 2002-07-18 민병성 Manufacturing method of single side typed flexible printed circuit board

Also Published As

Publication number Publication date
WO2009002083A2 (en) 2008-12-31
KR20080113709A (en) 2008-12-31
CN101682994B (en) 2011-06-15
TW200922407A (en) 2009-05-16
TWI406608B (en) 2013-08-21
JP2010522442A (en) 2010-07-01
CN101682994A (en) 2010-03-24
JP5021806B2 (en) 2012-09-12
KR100945039B1 (en) 2010-03-05

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