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WO2008105200A1 - 難燃性接着剤組成物、フレキシブル銅張積層板及びカバーレイフィルム - Google Patents

難燃性接着剤組成物、フレキシブル銅張積層板及びカバーレイフィルム Download PDF

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Publication number
WO2008105200A1
WO2008105200A1 PCT/JP2008/050877 JP2008050877W WO2008105200A1 WO 2008105200 A1 WO2008105200 A1 WO 2008105200A1 JP 2008050877 W JP2008050877 W JP 2008050877W WO 2008105200 A1 WO2008105200 A1 WO 2008105200A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
flame retardant
flexible copper
clad laminates
cover lay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/050877
Other languages
English (en)
French (fr)
Inventor
Hirotoshi Kamata
Hirotaka Kofune
Ki Ri
Kentarou Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Highpolymer Co Ltd filed Critical Showa Highpolymer Co Ltd
Priority to JP2009501152A priority Critical patent/JPWO2008105200A1/ja
Publication of WO2008105200A1 publication Critical patent/WO2008105200A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/06—Phosphorus compounds without P—C bonds
    • C07F9/08—Esters of oxyacids of phosphorus
    • C07F9/09—Esters of phosphoric acids
    • C07F9/12—Esters of phosphoric acids with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Fireproofing Substances (AREA)
  • Adhesive Tapes (AREA)

Abstract

　本発明は、次の一般式（１）： （式中、Ｘ1、Ｘ2、Ｘ3、Ｘ4及びＸ5は、同一でも異なっていてもよく、水素原子又は炭素数１～３のアルキル基である）で表わされるアミノ基含有リン酸エステル化合物と、非ハロゲン系エポキシ樹脂とを含むことを特徴とする難燃性接着剤組成物である。この難燃性接着剤組成物は、耐熱性、難燃性及び長期信頼性等に優れたフレキシブル銅張積層板やカバーレイフィルムを与え、且つハロゲンを含まない。
PCT/JP2008/050877 2007-02-26 2008-01-23 難燃性接着剤組成物、フレキシブル銅張積層板及びカバーレイフィルム Ceased WO2008105200A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009501152A JPWO2008105200A1 (ja) 2007-02-26 2008-01-23 難燃性接着剤組成物、フレキシブル銅張積層板及びカバーレイフィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-045855 2007-02-26
JP2007045855 2007-02-26

Publications (1)

Publication Number Publication Date
WO2008105200A1 true WO2008105200A1 (ja) 2008-09-04

Family

ID=39721040

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050877 Ceased WO2008105200A1 (ja) 2007-02-26 2008-01-23 難燃性接着剤組成物、フレキシブル銅張積層板及びカバーレイフィルム

Country Status (4)

Country Link
JP (1) JPWO2008105200A1 (ja)
CN (1) CN101617014A (ja)
TW (1) TW200838960A (ja)
WO (1) WO2008105200A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9623726B2 (en) 2011-01-14 2017-04-18 Asahi Glass Company, Limited Windowpane for vehicles and method for producing same
JP2019104910A (ja) * 2017-12-11 2019-06-27 ▲広▼▲東▼▲広▼山新材料股▲ふん▼有限公司 反応性難燃剤及びその調製方法並びに使用

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782477B2 (ja) * 2018-08-28 2020-11-11 株式会社Ｊｃｕ 電気銅めっき浴
CN112898930A (zh) * 2021-03-03 2021-06-04 浙江神州科技化工有限公司 一种阻燃型管片胶粘剂的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1027059A (en) * 1963-11-25 1966-04-20 Ciba Ltd Process for the manufacture of aminoaryl phosphates and phosphonates
JPS5734126A (en) * 1980-07-24 1982-02-24 Ee Tei Ramotsuto Purasuteitsuk Aromatic or araliphatic polymer
JP2002249540A (ja) * 2001-02-23 2002-09-06 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物
JP2005272567A (ja) * 2004-03-24 2005-10-06 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
WO2007141877A1 (ja) * 2006-06-09 2007-12-13 Showa Highpolymer Co., Ltd. アミノ基含有リン酸エステル化合物の製造方法、難燃性樹脂及び難燃性樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1027059A (en) * 1963-11-25 1966-04-20 Ciba Ltd Process for the manufacture of aminoaryl phosphates and phosphonates
JPS5734126A (en) * 1980-07-24 1982-02-24 Ee Tei Ramotsuto Purasuteitsuk Aromatic or araliphatic polymer
JP2002249540A (ja) * 2001-02-23 2002-09-06 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物
JP2005272567A (ja) * 2004-03-24 2005-10-06 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム、接着剤シート、銅張りポリイミドフィルム
WO2007141877A1 (ja) * 2006-06-09 2007-12-13 Showa Highpolymer Co., Ltd. アミノ基含有リン酸エステル化合物の製造方法、難燃性樹脂及び難燃性樹脂組成物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LIU Y.-L. ET AL.: "Synthesis, Characterization, Thermal, and Flame Ratardant Properties of Phosphate-Based Epoxy Resins", JOURNAL OF POLYMER SCIENCE, PART A: POLYMER CHEMISTRY, vol. 35, no. 3, February 1997 (1997-02-01), pages 565 - 574, XP008092334 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9623726B2 (en) 2011-01-14 2017-04-18 Asahi Glass Company, Limited Windowpane for vehicles and method for producing same
JP2019104910A (ja) * 2017-12-11 2019-06-27 ▲広▼▲東▼▲広▼山新材料股▲ふん▼有限公司 反応性難燃剤及びその調製方法並びに使用

Also Published As

Publication number Publication date
JPWO2008105200A1 (ja) 2010-06-03
CN101617014A (zh) 2009-12-30
TW200838960A (en) 2008-10-01

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