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TW200602405A - Thermosetting resin composition and its cured film - Google Patents

Thermosetting resin composition and its cured film

Info

Publication number
TW200602405A
TW200602405A TW094106317A TW94106317A TW200602405A TW 200602405 A TW200602405 A TW 200602405A TW 094106317 A TW094106317 A TW 094106317A TW 94106317 A TW94106317 A TW 94106317A TW 200602405 A TW200602405 A TW 200602405A
Authority
TW
Taiwan
Prior art keywords
resistance
cured film
resin composition
thermosetting resin
halogen
Prior art date
Application number
TW094106317A
Other languages
Chinese (zh)
Inventor
Hiromitu Morino
Tadahiro Miyoshi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200602405A publication Critical patent/TW200602405A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

This invention provides a thermosetting composition useful for a solder resist for flexible print circuit boards and a protective coat for electroluminescent panels, having low hydrolyzability, excellent in solder heat-resistance, chemical resistance, adhesiveness, electric insulation and the like, having halogen-free stable flame-resistance, excellent in flexing resistance and causing little warp after curing, and to provide a halogen-free cured film having stable flame resistance. Said composition is characterized in having a phosphamide compound represented by general formula (1).
TW094106317A 2004-04-09 2005-03-02 Thermosetting resin composition and its cured film TW200602405A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004114849A JP2005298613A (en) 2004-04-09 2004-04-09 Thermosetting resin composition and its cured film

Publications (1)

Publication Number Publication Date
TW200602405A true TW200602405A (en) 2006-01-16

Family

ID=35330552

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106317A TW200602405A (en) 2004-04-09 2005-03-02 Thermosetting resin composition and its cured film

Country Status (2)

Country Link
JP (1) JP2005298613A (en)
TW (1) TW200602405A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391784B (en) * 2006-03-27 2013-04-01 Taiyo Holdings Co Ltd Hardened resin composition and hardened product thereof
TWI415896B (en) * 2009-03-23 2013-11-21 Taiyo Holdings Co Ltd A hardened resin composition, a dry film and a printed circuit board using the same

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007061037A1 (en) * 2005-11-25 2007-05-31 Hitachi Chemical Co., Ltd. Liquid resin composition for electronic component and electronic component device
CN101687980B (en) 2007-07-18 2013-03-27 昭和电工株式会社 thermosetting resin composition
JP5564327B2 (en) * 2010-05-10 2014-07-30 株式会社カネカ Novel thermosetting resin composition and use thereof
JP5670533B1 (en) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 Thermosetting resin composition, cured product thereof, and display member using the same
JP6999459B2 (en) * 2018-03-22 2022-01-18 太陽インキ製造株式会社 Dry films, cured products, and electronic components
JP7496731B2 (en) * 2020-08-05 2024-06-07 株式会社日本触媒 Curable resin composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4009371B2 (en) * 1997-09-08 2007-11-14 太陽インキ製造株式会社 Thermosetting resin composition, protective film comprising the cured product, and method for forming the same
JP2000345005A (en) * 1999-06-03 2000-12-12 Shikoku Chem Corp Method of curing flame retarded epoxy resin composition
TWI258634B (en) * 1999-10-22 2006-07-21 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element using the same, a process for producing resist pattern and resist pattern laminate
JP4180844B2 (en) * 2002-06-06 2008-11-12 昭和電工株式会社 Curable flame retardant composition, cured product thereof and production method thereof
JP2005015595A (en) * 2003-06-25 2005-01-20 Nitsukan Kogyo Kk Material for halogen-free flexible printed wiring board
JP2005232195A (en) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd Thermosetting resin composition and its cured coating film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI391784B (en) * 2006-03-27 2013-04-01 Taiyo Holdings Co Ltd Hardened resin composition and hardened product thereof
TWI415896B (en) * 2009-03-23 2013-11-21 Taiyo Holdings Co Ltd A hardened resin composition, a dry film and a printed circuit board using the same

Also Published As

Publication number Publication date
JP2005298613A (en) 2005-10-27

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