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WO2008153142A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2008153142A1
WO2008153142A1 PCT/JP2008/060881 JP2008060881W WO2008153142A1 WO 2008153142 A1 WO2008153142 A1 WO 2008153142A1 JP 2008060881 W JP2008060881 W JP 2008060881W WO 2008153142 A1 WO2008153142 A1 WO 2008153142A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
region
layer
trench
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060881
Other languages
English (en)
French (fr)
Inventor
Masaru Takaishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007158185A external-priority patent/JP2008311453A/ja
Priority claimed from JP2007160891A external-priority patent/JP2009004399A/ja
Priority claimed from JP2007162885A external-priority patent/JP2009004501A/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to US12/664,841 priority Critical patent/US8217419B2/en
Publication of WO2008153142A1 publication Critical patent/WO2008153142A1/ja
Anticipated expiration legal-status Critical
Priority to US13/493,103 priority patent/US8729605B2/en
Priority to US14/246,675 priority patent/US9419127B2/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/141—VDMOS having built-in components
    • H10D84/148—VDMOS having built-in components the built-in components being breakdown diodes, e.g. Zener diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/63—Vertical IGFETs
    • H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/20—Breakdown diodes, e.g. avalanche diodes
    • H10D8/25—Zener diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393—Body regions of DMOS transistors or IGBTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
    • H10D64/647—Schottky drain or source electrodes for IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/611—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using diodes as protective elements

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

　オン抵抗を大幅に低減することが可能な半導体装置を提供する。この半導体装置（２０）は、ｎ型エピタキシャル層（２）の領域（２ａ）において、トレンチ（３）の周辺に形成される空乏層（１４）で隣接するトレンチ（３）間の各領域が塞がれることにより電流通路（１２）が遮断される一方、トレンチ（３）の周辺に形成された空乏層（１４）の一部が消滅することにより電流通路（１２）が開くように構成されており、領域（２ｂ）において、ｎ型エピタキシャル層（２）とｐ＋型拡散領域（７）との接合部分（８）がツェナーダイオード（８）となるように構成されている。
PCT/JP2008/060881 2007-06-15 2008-06-13 半導体装置 Ceased WO2008153142A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/664,841 US8217419B2 (en) 2007-06-15 2008-06-13 Semiconductor device
US13/493,103 US8729605B2 (en) 2007-06-15 2012-06-11 Semiconductor switch device
US14/246,675 US9419127B2 (en) 2007-06-15 2014-04-07 Semiconductor device including switching devices in an epitaxial layer

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-158185 2007-06-15
JP2007158185A JP2008311453A (ja) 2007-06-15 2007-06-15 半導体装置
JP2007160891A JP2009004399A (ja) 2007-06-19 2007-06-19 半導体装置
JP2007-160891 2007-06-19
JP2007162885A JP2009004501A (ja) 2007-06-20 2007-06-20 半導体装置
JP2007-162885 2007-06-20

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/664,841 A-371-Of-International US8217419B2 (en) 2007-06-15 2008-06-13 Semiconductor device
US13/493,103 Continuation US8729605B2 (en) 2007-06-15 2012-06-11 Semiconductor switch device

Publications (1)

Publication Number Publication Date
WO2008153142A1 true WO2008153142A1 (ja) 2008-12-18

Family

ID=40129745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060881 Ceased WO2008153142A1 (ja) 2007-06-15 2008-06-13 半導体装置

Country Status (2)

Country Link
US (3) US8217419B2 (ja)
WO (1) WO2008153142A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154596A (ja) * 2013-02-05 2014-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
WO2016052261A1 (ja) * 2014-10-01 2016-04-07 三菱電機株式会社 半導体装置
JP5992094B2 (ja) * 2013-04-03 2016-09-14 三菱電機株式会社 半導体装置
JP2019129656A (ja) * 2018-01-26 2019-08-01 株式会社デンソー 整流装置及び回転電機

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8766317B2 (en) * 2007-06-18 2014-07-01 Rohm Co., Ltd. Semiconductor device
WO2008156071A1 (ja) * 2007-06-19 2008-12-24 Rohm Co., Ltd. 半導体装置
JP5531620B2 (ja) 2010-01-05 2014-06-25 富士電機株式会社 半導体装置
JP5616720B2 (ja) * 2010-08-30 2014-10-29 セイコーインスツル株式会社 半導体装置およびその製造方法
US20120126317A1 (en) * 2010-11-18 2012-05-24 Alpha And Omega Semiconductor Incorporated Accufet with integrated clamping circuit
US9331197B2 (en) 2013-08-08 2016-05-03 Cree, Inc. Vertical power transistor device
US10868169B2 (en) * 2013-09-20 2020-12-15 Cree, Inc. Monolithically integrated vertical power transistor and bypass diode
US10600903B2 (en) 2013-09-20 2020-03-24 Cree, Inc. Semiconductor device including a power transistor device and bypass diode
JP6221648B2 (ja) 2013-11-06 2017-11-01 セイコーエプソン株式会社 半導体装置
KR101807122B1 (ko) * 2015-09-02 2018-01-10 현대자동차 주식회사 반도체 소자의 제조 방법
US9735291B1 (en) * 2016-03-10 2017-08-15 Macronix International Co., Ltd. Semiconductor device and Zener diode
KR101836258B1 (ko) * 2016-07-05 2018-03-08 현대자동차 주식회사 반도체 소자 및 그 제조 방법
JP6666224B2 (ja) 2016-09-21 2020-03-13 株式会社東芝 半導体装置
CN111295763B (zh) * 2017-11-13 2023-12-29 新电元工业株式会社 宽带隙半导体装置

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JPS6461956A (en) * 1987-08-26 1989-03-08 Siliconix Inc Semiconductor device
JPH0338881A (ja) * 1989-07-05 1991-02-19 Nec Corp 縦型絶縁ゲート電界効果トランジスタ
JPH03250670A (ja) * 1990-02-28 1991-11-08 Hitachi Ltd 半導体装置及びその製造方法
JPH08316470A (ja) * 1995-05-23 1996-11-29 Fuji Electric Co Ltd 電力用半導体素子
WO2001006569A1 (fr) * 1999-07-15 2001-01-25 Rohm Co., Ltd. Dispositif a semiconducteur comprenant un transistor a effet de champ mos
JP2002373989A (ja) * 2001-06-13 2002-12-26 Toshiba Corp 半導体装置
JP2003229570A (ja) * 2001-11-27 2003-08-15 Nissan Motor Co Ltd 炭化珪素半導体を用いた電界効果トランジスタ
JP2003224277A (ja) * 2002-01-31 2003-08-08 Denso Corp 炭化珪素半導体装置とその製造方法
JP2006524432A (ja) * 2003-04-24 2006-10-26 クリー　インコーポレイテッド 一体化逆並列接合障壁ショットキーフリーホイーリングダイオードを備えた炭化珪素ｍｏｓｆｅｔおよびその製造方法
JP2005175301A (ja) * 2003-12-12 2005-06-30 Rohm Co Ltd 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154596A (ja) * 2013-02-05 2014-08-25 Renesas Electronics Corp 半導体装置およびその製造方法
JP5992094B2 (ja) * 2013-04-03 2016-09-14 三菱電機株式会社 半導体装置
US9577086B2 (en) 2013-04-03 2017-02-21 Mitsubishi Electric Corporation Semiconductor device
WO2016052261A1 (ja) * 2014-10-01 2016-04-07 三菱電機株式会社 半導体装置
JP5940235B1 (ja) * 2014-10-01 2016-06-29 三菱電機株式会社 半導体装置
US10128370B2 (en) 2014-10-01 2018-11-13 Mitsubishi Electric Corporation Semiconductor device
JP2019129656A (ja) * 2018-01-26 2019-08-01 株式会社デンソー 整流装置及び回転電機

Also Published As

Publication number Publication date
US9419127B2 (en) 2016-08-16
US20100176443A1 (en) 2010-07-15
US20140231906A1 (en) 2014-08-21
US8217419B2 (en) 2012-07-10
US20120267710A1 (en) 2012-10-25
US8729605B2 (en) 2014-05-20

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