[go: up one dir, main page]

WO2008149572A1 - プリント配線板 - Google Patents

プリント配線板 Download PDF

Info

Publication number
WO2008149572A1
WO2008149572A1 PCT/JP2008/051491 JP2008051491W WO2008149572A1 WO 2008149572 A1 WO2008149572 A1 WO 2008149572A1 JP 2008051491 W JP2008051491 W JP 2008051491W WO 2008149572 A1 WO2008149572 A1 WO 2008149572A1
Authority
WO
WIPO (PCT)
Prior art keywords
interconnections
wiring board
printed wiring
ground
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/051491
Other languages
English (en)
French (fr)
Inventor
Ryoichi Toyoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to US12/223,467 priority Critical patent/US8040198B2/en
Priority to AT08704242T priority patent/ATE531239T1/de
Priority to CN2008800000625A priority patent/CN101543142B/zh
Priority to EP08704242A priority patent/EP2031944B1/en
Publication of WO2008149572A1 publication Critical patent/WO2008149572A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09272—Layout details of angles or corners

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)

Abstract

　べたグランドが適用できないフレキシブルプリント配線板のような薄い絶縁層を介するプリント配線板において、曲線形状がある場合においても信号配線に対するグランド配線の形状を一定とし、しかも露光ずれや積層ずれによって信号配線と対向するグランド配線の面積が変化しないマイクロストリップラインを提供すること。 　信号配線が曲線形状であるマイクロストリップライン構造を有するプリント配線板において、絶縁層３,１０,１３を介して前記信号配線４,６,８,１１,１４,１８,２５に対向配置された線状のグランド配線５,９,１２,１５,１９,２６をそなえ、前記グランド配線の配線ピッチが前記信号配線の線幅の1／ｎ（ｎは、１または２の自然数）であることを特徴とするプリント配線板。
PCT/JP2008/051491 2007-06-06 2008-01-31 プリント配線板 Ceased WO2008149572A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/223,467 US8040198B2 (en) 2007-06-06 2008-01-31 Printed wiring board having wire grounding conductors with distances that are 1/n the width of the signal lines
AT08704242T ATE531239T1 (de) 2007-06-06 2008-01-31 Leiterplatte
CN2008800000625A CN101543142B (zh) 2007-06-06 2008-01-31 印刷布线板
EP08704242A EP2031944B1 (en) 2007-06-06 2008-01-31 Printed wiring board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007150036A JP4912960B2 (ja) 2007-06-06 2007-06-06 プリント配線板
JP2007-150036 2007-06-06

Publications (1)

Publication Number Publication Date
WO2008149572A1 true WO2008149572A1 (ja) 2008-12-11

Family

ID=40093401

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051491 Ceased WO2008149572A1 (ja) 2007-06-06 2008-01-31 プリント配線板

Country Status (8)

Country Link
US (1) US8040198B2 (ja)
EP (1) EP2031944B1 (ja)
JP (1) JP4912960B2 (ja)
KR (1) KR20100017038A (ja)
CN (1) CN101543142B (ja)
AT (1) ATE531239T1 (ja)
TW (1) TWI403226B (ja)
WO (1) WO2008149572A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5436361B2 (ja) * 2010-07-30 2014-03-05 日東電工株式会社 配線回路基板およびその製造方法
CN101925252A (zh) * 2010-08-05 2010-12-22 浪潮电子信息产业股份有限公司 一种提高信号质量的布线方法
CN103338586A (zh) * 2013-07-09 2013-10-02 深圳市华星光电技术有限公司 印刷电路板
US20150016069A1 (en) * 2013-07-09 2015-01-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Printed circuit board
US10136512B2 (en) * 2014-12-09 2018-11-20 Microsoft Technology Licensing, Llc Avoiding reflections in PCB signal trace
US9747934B1 (en) * 2016-09-13 2017-08-29 Seagate Technology Llc Flexible dynamic loop with back-side impedance control structures
CN110798977B (zh) * 2018-08-01 2021-03-23 鹏鼎控股(深圳)股份有限公司 薄型天线电路板及其制作方法
JP2021145061A (ja) * 2020-03-12 2021-09-24 京セラ株式会社 フレキシブル配線板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629697A (ja) * 1985-07-08 1987-01-17 株式会社日立製作所 配線板
JP2000077802A (ja) 1998-08-24 2000-03-14 Itei Kofun Yugenkoshi 伝送時間とインピ―ダンス制御のための各種開口パタ―ンのあるシ―ルド平面を具えた基板
JP2000114722A (ja) 1998-09-30 2000-04-21 Adtec:Kk 印刷配線装置
JP2001085805A (ja) 1999-09-17 2001-03-30 Kyoden:Kk プリント基板
JP2004140308A (ja) * 2002-10-16 2004-05-13 Adorinkusu:Kk スリット法を用いた高速信号用プリント配線基板
JP2006147837A (ja) 2004-11-19 2006-06-08 Sony Chem Corp 配線基板、配線パターンの配置方法
JP2006173310A (ja) 2004-12-15 2006-06-29 Sumitomo Bakelite Co Ltd 回路基板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680557A (en) * 1985-04-22 1987-07-14 Tektronix, Inc. Staggered ground-plane microstrip transmission line
JPH08506696A (ja) * 1993-02-02 1996-07-16 エイ・エス・ティー・リサーチ・インコーポレイテッド 遮蔽グリッドを含む回路基板配列およびその構成
JPH07235741A (ja) * 1993-12-27 1995-09-05 Ngk Spark Plug Co Ltd 多層配線基板
US5764489A (en) * 1996-07-18 1998-06-09 Compaq Computer Corporation Apparatus for controlling the impedance of high speed signals on a printed circuit board
JPH10145112A (ja) * 1996-11-14 1998-05-29 Toshiba Corp 配線基板
US5818315A (en) * 1996-12-31 1998-10-06 Lucent Technologies Inc. Signal trace impedance control using a grid-like ground plane
JP4680410B2 (ja) * 2001-04-24 2011-05-11 日本特殊陶業株式会社 配線基板
JP4063533B2 (ja) * 2001-12-10 2008-03-19 日本碍子株式会社 フレキシブル配線板
US6885549B2 (en) * 2002-04-11 2005-04-26 Dell Products L.P. System and method for flexible circuits
JP4148069B2 (ja) * 2003-08-28 2008-09-10 ソニー株式会社 マイクロストリップライン構造を有する基板、マイクロストリップライン構造を有する半導体装置、及びマイクロストリップライン構造を有する基板の製造方法
JP2005317631A (ja) * 2004-04-27 2005-11-10 Alps Electric Co Ltd 電子回路基板
JP2007141990A (ja) * 2005-11-16 2007-06-07 Sumitomo Bakelite Co Ltd 回路基板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS629697A (ja) * 1985-07-08 1987-01-17 株式会社日立製作所 配線板
JP2000077802A (ja) 1998-08-24 2000-03-14 Itei Kofun Yugenkoshi 伝送時間とインピ―ダンス制御のための各種開口パタ―ンのあるシ―ルド平面を具えた基板
JP2000114722A (ja) 1998-09-30 2000-04-21 Adtec:Kk 印刷配線装置
JP2001085805A (ja) 1999-09-17 2001-03-30 Kyoden:Kk プリント基板
JP2004140308A (ja) * 2002-10-16 2004-05-13 Adorinkusu:Kk スリット法を用いた高速信号用プリント配線基板
JP2006147837A (ja) 2004-11-19 2006-06-08 Sony Chem Corp 配線基板、配線パターンの配置方法
JP2006173310A (ja) 2004-12-15 2006-06-29 Sumitomo Bakelite Co Ltd 回路基板

Also Published As

Publication number Publication date
CN101543142B (zh) 2011-07-06
CN101543142A (zh) 2009-09-23
US8040198B2 (en) 2011-10-18
TWI403226B (zh) 2013-07-21
EP2031944A1 (en) 2009-03-04
KR20100017038A (ko) 2010-02-16
EP2031944B1 (en) 2011-10-26
JP4912960B2 (ja) 2012-04-11
US20100231331A1 (en) 2010-09-16
ATE531239T1 (de) 2011-11-15
EP2031944A4 (en) 2009-12-09
JP2008305884A (ja) 2008-12-18
TW200850086A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
WO2008149572A1 (ja) プリント配線板
EP2034810A4 (en) FLEXIBLE-ROLLED PCB AND METHOD FOR THE PRODUCTION THEREOF
USD605613S1 (en) Printed circuit board for electrical connector
EP1909543A3 (en) Wired circuit board and electronic device
WO2009072531A1 (ja) キャビティー部を有する多層配線基板
TW200727744A (en) Multilayer wiring board
WO2008157143A3 (en) Edge connection structure for printed circuit boards
TW200718323A (en) Multilayered printed wiring board
EP1909544A3 (en) Wired circuit board
WO2007050114A3 (en) A substantially continuous layer of embedded transient protection for printed circuit boards
WO2005081595A3 (en) Preferential assymmetrical via positioning for printed circuit boards
WO2007078893A3 (en) Embedded waveguide printed circuit board structure
WO2008024411A3 (en) Impedance matched circuit board
DE602007005183D1 (de) Prepreg sowie mit einer leitenden Schicht laminiertes Substrat für eine Leiterplatte
AU2002229042A1 (en) Lightweight circuit board with conductive constraining cores
EP2222144A3 (en) Noise suppressing structure and printed wiring board
WO2006134216A3 (en) Circuit board structure and method for manufacturing a circuit board structure
WO2008105478A1 (ja) 配線基板、電気信号伝送システムおよび電子機器
EP2059102A3 (en) Wired circuit board
FI20060447A7 (fi) Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi
WO2009019968A1 (ja) 多層ポリイミドフィルム、積層板および金属張積層板
EP1928220A3 (en) Wiring board and method of manufacturing the same
TW200833213A (en) Multilayer wiring board
WO2009054201A1 (ja) 高周波基板および、これを用いた高周波モジュール
WO2008102709A1 (ja) フレキシブルプリント配線板

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880000062.5

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020087018224

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 2008704242

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12223467

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08704242

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE