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WO2008149445A1 - Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée - Google Patents

Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée Download PDF

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Publication number
WO2008149445A1
WO2008149445A1 PCT/JP2007/061567 JP2007061567W WO2008149445A1 WO 2008149445 A1 WO2008149445 A1 WO 2008149445A1 JP 2007061567 W JP2007061567 W JP 2007061567W WO 2008149445 A1 WO2008149445 A1 WO 2008149445A1
Authority
WO
WIPO (PCT)
Prior art keywords
diagnosing
solder
jointed portion
electronic device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/061567
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/061567 priority Critical patent/WO2008149445A1/fr
Publication of WO2008149445A1 publication Critical patent/WO2008149445A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Cette invention se rapporte à une partie soudée dans une carte de circuit imprimé d'une structure BGA qui est si fragile qu'une contrainte ou une tension peut facilement la fissurer. L'invention prévoit un dispositif de diagnostic pour la partie soudée de la carte de circuit imprimé de la structure BGA, lequel est intégré dans un dispositif électronique. Le dispositif de diagnostic divise une pastille située sur la carte de circuit imprimé dans une partie se fissurant facilement au niveau de la partie soudée, en plusieurs morceaux dans une direction perpendiculaire à la direction de fissuration facile, pour préparer des pastilles tests, et diagnostique périodiquement la conduction entre les pastilles tests divisées, de sorte qu'il diagnostique l'apparition de fissures si la conduction se détériore.
PCT/JP2007/061567 2007-06-07 2007-06-07 Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée Ceased WO2008149445A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061567 WO2008149445A1 (fr) 2007-06-07 2007-06-07 Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061567 WO2008149445A1 (fr) 2007-06-07 2007-06-07 Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée

Publications (1)

Publication Number Publication Date
WO2008149445A1 true WO2008149445A1 (fr) 2008-12-11

Family

ID=40093280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/061567 Ceased WO2008149445A1 (fr) 2007-06-07 2007-06-07 Dispositif, procédé et programme de diagnostic pour dispositif électronique comportant une partie soudée

Country Status (1)

Country Link
WO (1) WO2008149445A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011036776A1 (fr) * 2009-09-25 2011-03-31 株式会社 東芝 Carte de montage et procédé de prédiction de défaillance
WO2011036751A1 (fr) * 2009-09-24 2011-03-31 株式会社 東芝 Appareil électronique et procédé de détection de dommages
JP2013104843A (ja) * 2011-11-16 2013-05-30 Toshiba Corp 電子部品、測定方法および監視装置
JP2015232578A (ja) * 2015-09-09 2015-12-24 株式会社東芝 電子部品および測定方法
FR3051912A1 (fr) * 2016-05-31 2017-12-01 Commissariat Energie Atomique Systeme et procede de caracterisation d'une fissure generee dans un substrat soumis a une sollicitation mecanique
WO2021188708A1 (fr) * 2020-03-17 2021-09-23 Arris Enterprises Llc Détecteur de contrainte en céramique
WO2022069204A1 (fr) * 2020-10-01 2022-04-07 Endress+Hauser SE+Co. KG Unité électronique et procédé de vérification d'au moins un état d'une unité électronique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244359A (ja) * 2000-02-25 2001-09-07 Sharp Corp 電子部品実装体
JP2003273506A (ja) * 2002-03-14 2003-09-26 Canon Inc 回路基板、電子機器及び回路基板と電子部品のはんだ接合部の検査方法
JP2005251815A (ja) * 2004-03-02 2005-09-15 Toyo Commun Equip Co Ltd 表面実装部品の電極構造とその実装基板
JP2007035889A (ja) * 2005-07-26 2007-02-08 Lenovo Singapore Pte Ltd 半田ボールを有するパッケージを用いた電子機器、および半田ボールを有するパッケージの異常状態検知方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244359A (ja) * 2000-02-25 2001-09-07 Sharp Corp 電子部品実装体
JP2003273506A (ja) * 2002-03-14 2003-09-26 Canon Inc 回路基板、電子機器及び回路基板と電子部品のはんだ接合部の検査方法
JP2005251815A (ja) * 2004-03-02 2005-09-15 Toyo Commun Equip Co Ltd 表面実装部品の電極構造とその実装基板
JP2007035889A (ja) * 2005-07-26 2007-02-08 Lenovo Singapore Pte Ltd 半田ボールを有するパッケージを用いた電子機器、および半田ボールを有するパッケージの異常状態検知方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011036751A1 (fr) * 2009-09-24 2011-03-31 株式会社 東芝 Appareil électronique et procédé de détection de dommages
JP5615282B2 (ja) * 2009-09-24 2014-10-29 株式会社東芝 電子機器および損傷検出方法
WO2011036776A1 (fr) * 2009-09-25 2011-03-31 株式会社 東芝 Carte de montage et procédé de prédiction de défaillance
JP5092054B2 (ja) * 2009-09-25 2012-12-05 株式会社東芝 実装基板及び故障予測方法
US9699891B2 (en) 2009-09-25 2017-07-04 Kabushiki Kaisha Toshiba Substrate and method for mounting semiconductor package
US9500693B2 (en) 2011-11-16 2016-11-22 Kabushiki Kaisha Toshiba Electronic apparatus, measuring method, and monitoring apparatus
JP2013104843A (ja) * 2011-11-16 2013-05-30 Toshiba Corp 電子部品、測定方法および監視装置
JP2015232578A (ja) * 2015-09-09 2015-12-24 株式会社東芝 電子部品および測定方法
FR3051912A1 (fr) * 2016-05-31 2017-12-01 Commissariat Energie Atomique Systeme et procede de caracterisation d'une fissure generee dans un substrat soumis a une sollicitation mecanique
EP3252459A1 (fr) * 2016-05-31 2017-12-06 Commissariat à l'Energie Atomique et aux Energies Alternatives Système et procédé de caractérisation d'une fissure générée dans un substrat soumis à une sollicitation mécanique
WO2021188708A1 (fr) * 2020-03-17 2021-09-23 Arris Enterprises Llc Détecteur de contrainte en céramique
WO2022069204A1 (fr) * 2020-10-01 2022-04-07 Endress+Hauser SE+Co. KG Unité électronique et procédé de vérification d'au moins un état d'une unité électronique
CN116326221A (zh) * 2020-10-01 2023-06-23 恩德莱斯和豪瑟尔欧洲两合公司 电子单元和用于检查电子单元的至少一种状态的方法

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