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WO2008149445A1 - Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion - Google Patents

Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion Download PDF

Info

Publication number
WO2008149445A1
WO2008149445A1 PCT/JP2007/061567 JP2007061567W WO2008149445A1 WO 2008149445 A1 WO2008149445 A1 WO 2008149445A1 JP 2007061567 W JP2007061567 W JP 2007061567W WO 2008149445 A1 WO2008149445 A1 WO 2008149445A1
Authority
WO
WIPO (PCT)
Prior art keywords
diagnosing
solder
jointed portion
electronic device
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/061567
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to PCT/JP2007/061567 priority Critical patent/WO2008149445A1/en
Publication of WO2008149445A1 publication Critical patent/WO2008149445A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • G01R31/70—Testing of connections between components and printed circuit boards
    • G01R31/71—Testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder-jointed portion in a printed circuit board of a BGA structure is so weak against a strain or a stress that it is easily cracked by the strain or the stress. Provided is a diagnosing device for the solder-jointed portion of the printed circuit board of the BGA structure, which is built in an electronic device. The diagnosing device divides a pad on the printed circuit board at a portion to be easily cracked at the solder-jointed portion, into a plurality in a direction perpendicular to the easily cracking direction, to prepare test pads, and diagnoses the conduction between the divided test pads periodically, so that it diagnoses the occurrence of cracks if the conduction is deteriorated.
PCT/JP2007/061567 2007-06-07 2007-06-07 Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion Ceased WO2008149445A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061567 WO2008149445A1 (en) 2007-06-07 2007-06-07 Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/061567 WO2008149445A1 (en) 2007-06-07 2007-06-07 Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion

Publications (1)

Publication Number Publication Date
WO2008149445A1 true WO2008149445A1 (en) 2008-12-11

Family

ID=40093280

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/061567 Ceased WO2008149445A1 (en) 2007-06-07 2007-06-07 Diagnosing device, diagnosing method and diagnosing program for electronic device having solder-jointed portion

Country Status (1)

Country Link
WO (1) WO2008149445A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011036776A1 (en) * 2009-09-25 2011-03-31 株式会社 東芝 Mounting board and failure predicting method
WO2011036751A1 (en) * 2009-09-24 2011-03-31 株式会社 東芝 Electronic device and damage detecting method
JP2013104843A (en) * 2011-11-16 2013-05-30 Toshiba Corp Electronic component, measuring method, and monitoring device
JP2015232578A (en) * 2015-09-09 2015-12-24 株式会社東芝 Electronic component and measuring method
FR3051912A1 (en) * 2016-05-31 2017-12-01 Commissariat Energie Atomique SYSTEM AND METHOD FOR CHARACTERIZING FISSURE GENERATED IN SUBSTRATE SUBJECT TO MECHANICAL SOLICITATION
WO2021188708A1 (en) * 2020-03-17 2021-09-23 Arris Enterprises Llc Ceramic based strain detector
WO2022069204A1 (en) * 2020-10-01 2022-04-07 Endress+Hauser SE+Co. KG Electronic unit and method for checking at least one state of an electronic unit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244359A (en) * 2000-02-25 2001-09-07 Sharp Corp Electronic component mount
JP2003273506A (en) * 2002-03-14 2003-09-26 Canon Inc Circuit board, electronic device, and method for inspecting solder joint between circuit board and electronic component
JP2005251815A (en) * 2004-03-02 2005-09-15 Toyo Commun Equip Co Ltd Electrode structure of surface mounting component and its surface mounting board
JP2007035889A (en) * 2005-07-26 2007-02-08 Lenovo Singapore Pte Ltd Package with solder ball and detection method of abnormality of electronic equipment using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001244359A (en) * 2000-02-25 2001-09-07 Sharp Corp Electronic component mount
JP2003273506A (en) * 2002-03-14 2003-09-26 Canon Inc Circuit board, electronic device, and method for inspecting solder joint between circuit board and electronic component
JP2005251815A (en) * 2004-03-02 2005-09-15 Toyo Commun Equip Co Ltd Electrode structure of surface mounting component and its surface mounting board
JP2007035889A (en) * 2005-07-26 2007-02-08 Lenovo Singapore Pte Ltd Package with solder ball and detection method of abnormality of electronic equipment using the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011036751A1 (en) * 2009-09-24 2011-03-31 株式会社 東芝 Electronic device and damage detecting method
JP5615282B2 (en) * 2009-09-24 2014-10-29 株式会社東芝 Electronic device and damage detection method
WO2011036776A1 (en) * 2009-09-25 2011-03-31 株式会社 東芝 Mounting board and failure predicting method
JP5092054B2 (en) * 2009-09-25 2012-12-05 株式会社東芝 Mounting board and failure prediction method
US9699891B2 (en) 2009-09-25 2017-07-04 Kabushiki Kaisha Toshiba Substrate and method for mounting semiconductor package
US9500693B2 (en) 2011-11-16 2016-11-22 Kabushiki Kaisha Toshiba Electronic apparatus, measuring method, and monitoring apparatus
JP2013104843A (en) * 2011-11-16 2013-05-30 Toshiba Corp Electronic component, measuring method, and monitoring device
JP2015232578A (en) * 2015-09-09 2015-12-24 株式会社東芝 Electronic component and measuring method
FR3051912A1 (en) * 2016-05-31 2017-12-01 Commissariat Energie Atomique SYSTEM AND METHOD FOR CHARACTERIZING FISSURE GENERATED IN SUBSTRATE SUBJECT TO MECHANICAL SOLICITATION
EP3252459A1 (en) * 2016-05-31 2017-12-06 Commissariat à l'Energie Atomique et aux Energies Alternatives System and method for characterising a crack generated in a substrate subjected to mechanical stress
WO2021188708A1 (en) * 2020-03-17 2021-09-23 Arris Enterprises Llc Ceramic based strain detector
WO2022069204A1 (en) * 2020-10-01 2022-04-07 Endress+Hauser SE+Co. KG Electronic unit and method for checking at least one state of an electronic unit
CN116326221A (en) * 2020-10-01 2023-06-23 恩德莱斯和豪瑟尔欧洲两合公司 Electronic unit and method for checking at least one state of an electronic unit

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