WO2008146759A1 - 硬化性組成物及びその硬化物 - Google Patents
硬化性組成物及びその硬化物 Download PDFInfo
- Publication number
- WO2008146759A1 WO2008146759A1 PCT/JP2008/059591 JP2008059591W WO2008146759A1 WO 2008146759 A1 WO2008146759 A1 WO 2008146759A1 JP 2008059591 W JP2008059591 W JP 2008059591W WO 2008146759 A1 WO2008146759 A1 WO 2008146759A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- curable composition
- cured product
- heat resistance
- vinyl polymer
- disclosed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Lubricants (AREA)
Abstract
一般的に良好な機械特性、耐油性、耐熱性等を示す硬化物を与えるビニル系重合体を含有し、ヒドロシリル化反応により硬化し得る硬化性組成物であり、潤滑油浸漬後の耐熱性が優れる硬化物およびその硬化物を与えうる硬化性組成物を提供することを課題とし、本願発明の第1の硬化性組成物は、(A)ヒドロシリル化反応可能なアルケニル基を分子中に少なくとも1個含有するビニル系重合体(I)、(B)ヒドロシリル基含有化合物(II)、(C)ヒドロシリル化触媒、および、(D)p-フェニレンジアミン系酸化防止剤を含有し、本願発明の第2の硬化性組成物は、(A)ヒドロシリル化反応可能なアルケニル基を分子中に少なくとも1個含有するビニル系重合体(I)、(B)ヒドロシリル基含有化合物(II)、(C)ヒドロシリル化触媒、(E)アミン系酸化防止剤、および、(F)アナターゼ型酸化チタンを含有する。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009516308A JP5368302B2 (ja) | 2007-05-25 | 2008-05-23 | 硬化性組成物及びその硬化物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-139091 | 2007-05-25 | ||
| JP2007139091 | 2007-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008146759A1 true WO2008146759A1 (ja) | 2008-12-04 |
Family
ID=40075005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/059591 Ceased WO2008146759A1 (ja) | 2007-05-25 | 2008-05-23 | 硬化性組成物及びその硬化物 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5368302B2 (ja) |
| WO (1) | WO2008146759A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011105869A (ja) * | 2009-11-18 | 2011-06-02 | Kaneka Corp | 白色硬化性組成物および反射コーティング材 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649370A (ja) * | 1992-07-29 | 1994-02-22 | Kanegafuchi Chem Ind Co Ltd | プリント基板耐熱マスキングテープ用硬化性組成物 |
| WO1999024509A1 (en) * | 1997-11-06 | 1999-05-20 | Kaneka Corporation | Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same |
| JP2000154255A (ja) * | 1998-09-18 | 2000-06-06 | Kanegafuchi Chem Ind Co Ltd | 成形用硬化性組成物およびこれを硬化させてなる成形体 |
| JP2001131414A (ja) * | 1999-11-02 | 2001-05-15 | Kanegafuchi Chem Ind Co Ltd | ヒドロシリル化反応方法 |
| JP2003261770A (ja) * | 2002-03-08 | 2003-09-19 | Kanegafuchi Chem Ind Co Ltd | 封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置 |
| WO2004076585A1 (ja) * | 2003-02-25 | 2004-09-10 | Kaneka Corporation | 硬化性組成物とその調製方法、遮光ペースト、遮光用樹脂とその形成方法、発光ダイオード用パッケージ及び半導体装置 |
| JP2005307064A (ja) * | 2004-04-23 | 2005-11-04 | Kaneka Corp | 硬化性組成物の製造方法 |
| WO2005116134A1 (ja) * | 2004-05-28 | 2005-12-08 | Kaneka Corporation | 硬化性組成物およびその硬化物 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4190653B2 (ja) * | 1998-09-17 | 2008-12-03 | 住友ベークライト株式会社 | 高耐熱低誘電率熱硬化性樹脂 |
-
2008
- 2008-05-23 JP JP2009516308A patent/JP5368302B2/ja not_active Expired - Fee Related
- 2008-05-23 WO PCT/JP2008/059591 patent/WO2008146759A1/ja not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0649370A (ja) * | 1992-07-29 | 1994-02-22 | Kanegafuchi Chem Ind Co Ltd | プリント基板耐熱マスキングテープ用硬化性組成物 |
| WO1999024509A1 (en) * | 1997-11-06 | 1999-05-20 | Kaneka Corporation | Hardener, curable composition and foamable resin composition both containing the hardener, and foam made from the foamable resin composition and process for producing the same |
| JP2000154255A (ja) * | 1998-09-18 | 2000-06-06 | Kanegafuchi Chem Ind Co Ltd | 成形用硬化性組成物およびこれを硬化させてなる成形体 |
| JP2001131414A (ja) * | 1999-11-02 | 2001-05-15 | Kanegafuchi Chem Ind Co Ltd | ヒドロシリル化反応方法 |
| JP2003261770A (ja) * | 2002-03-08 | 2003-09-19 | Kanegafuchi Chem Ind Co Ltd | 封止剤、半導体等の封止方法、半導体装置の製造方法、および半導体装置 |
| WO2004076585A1 (ja) * | 2003-02-25 | 2004-09-10 | Kaneka Corporation | 硬化性組成物とその調製方法、遮光ペースト、遮光用樹脂とその形成方法、発光ダイオード用パッケージ及び半導体装置 |
| JP2005307064A (ja) * | 2004-04-23 | 2005-11-04 | Kaneka Corp | 硬化性組成物の製造方法 |
| WO2005116134A1 (ja) * | 2004-05-28 | 2005-12-08 | Kaneka Corporation | 硬化性組成物およびその硬化物 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011105869A (ja) * | 2009-11-18 | 2011-06-02 | Kaneka Corp | 白色硬化性組成物および反射コーティング材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008146759A1 (ja) | 2010-08-19 |
| JP5368302B2 (ja) | 2013-12-18 |
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