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WO2008144856A3 - Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances - Google Patents

Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances Download PDF

Info

Publication number
WO2008144856A3
WO2008144856A3 PCT/BR2007/000129 BR2007000129W WO2008144856A3 WO 2008144856 A3 WO2008144856 A3 WO 2008144856A3 BR 2007000129 W BR2007000129 W BR 2007000129W WO 2008144856 A3 WO2008144856 A3 WO 2008144856A3
Authority
WO
WIPO (PCT)
Prior art keywords
housing
electric
electronic appliances
heat dissipation
dissipation system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/BR2007/000129
Other languages
French (fr)
Other versions
WO2008144856A2 (en
Inventor
Milton Flavio De Macedo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Techinvest Ltda
Original Assignee
Techinvest Ltda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techinvest Ltda filed Critical Techinvest Ltda
Priority to PCT/BR2007/000129 priority Critical patent/WO2008144856A2/en
Publication of WO2008144856A2 publication Critical patent/WO2008144856A2/en
Publication of WO2008144856A3 publication Critical patent/WO2008144856A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances, formed from a housing (7), specially developed along one of the faces (6) of the cabinet (4) for electric-electronic appliances to receive the introduction of a dissipating board (1) serving as interface between the cabinet internal and external part (4), forming a passage of thermal energy which shall conduct the heat inside out, so as to create an environment favorable to the working of the already housed electronic components, avoiding also the entrance of water, dust and other waste; and that, through a wedge boss (5) of one support incorporated vertically in the cabinet internal part (4), in a studied distance of the dissipating board (1), the semi- conductors (2) upon its introduction, shall be positioned on the printed circuit board (3) pressed, duly locked.
PCT/BR2007/000129 2007-05-30 2007-05-30 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances Ceased WO2008144856A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/BR2007/000129 WO2008144856A2 (en) 2007-05-30 2007-05-30 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/BR2007/000129 WO2008144856A2 (en) 2007-05-30 2007-05-30 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances

Publications (2)

Publication Number Publication Date
WO2008144856A2 WO2008144856A2 (en) 2008-12-04
WO2008144856A3 true WO2008144856A3 (en) 2009-04-02

Family

ID=40075562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/BR2007/000129 Ceased WO2008144856A2 (en) 2007-05-30 2007-05-30 Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances

Country Status (1)

Country Link
WO (1) WO2008144856A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104104223B (en) * 2014-07-22 2015-04-08 杨燕平 DC-DC module power supply machine frame structure

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6418021B1 (en) * 1997-12-24 2002-07-09 Denso Corporation Electronic circuit apparatus and method for assembling the same
US6753603B2 (en) * 2000-09-19 2004-06-22 Matsushita Electric Industrial Co., Ltd. Electronic equipment having insulating heat dissipation plate
US20070053164A1 (en) * 2005-09-06 2007-03-08 Lear Corporation Heat sink
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US5327324A (en) * 1993-11-05 1994-07-05 Ford Motor Company Spring clip for a heat sink apparatus
US5592021A (en) * 1995-04-26 1997-01-07 Martin Marietta Corporation Clamp for securing a power device to a heatsink
US6418021B1 (en) * 1997-12-24 2002-07-09 Denso Corporation Electronic circuit apparatus and method for assembling the same
US6753603B2 (en) * 2000-09-19 2004-06-22 Matsushita Electric Industrial Co., Ltd. Electronic equipment having insulating heat dissipation plate
US7190589B2 (en) * 2004-10-19 2007-03-13 Cinch Connectors, Inc. Electronic control enclosure
US20070053164A1 (en) * 2005-09-06 2007-03-08 Lear Corporation Heat sink

Also Published As

Publication number Publication date
WO2008144856A2 (en) 2008-12-04

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