WO2008144856A2 - Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances - Google Patents
Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances Download PDFInfo
- Publication number
- WO2008144856A2 WO2008144856A2 PCT/BR2007/000129 BR2007000129W WO2008144856A2 WO 2008144856 A2 WO2008144856 A2 WO 2008144856A2 BR 2007000129 W BR2007000129 W BR 2007000129W WO 2008144856 A2 WO2008144856 A2 WO 2008144856A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cabinet
- electric
- housing
- electronic appliances
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention now described has as main purposes to facilitate the heat dissipating board fixation to the cabinet, as well as to facilitate the fixation between the semi-conductors and said dissipating board, turning needless, therefore, the use of screws and similar items.
- the dissipated device here described shall further be integral part of the cabinet, saving this way raw material for its manufacture and causing the transfer of internal heat outside the cabinet so as to maintain an environment which impedes the deterioration of the electronic components.
- the dissipator consists of an aluminum board or another metal of big thermal conductivity, smooth, not perforated and not prepared or worked, which shall be one of the cabinet faces.
- the dissipator shall serve as interface between the cabinet internal and external part upon being pressed and introduced by fit, conducting heat inside out, forming a passage of thermal energy so as to create an internal environment which will favor the already housed electronic component performance.
- a vertical support incorporated in a studied distance from the dissipating board fixation point, through its wedge boss, shall press the semiconductors against said dissipating board upon its introduction into the the cabinet, firmly fixing such electric-electronic elements on the printed circuit board, avoiding, therefore, the use of screws or other means of fixation conventionally used in such assembly stage.
- Figure 1 Upper back view in perspective of a closed cabinet of an electric-electronic appliance
- Figure 2 Upper front view in perspective of a closed cabinet of an electric-electronic appliance control, outlining the dissipator position;
- Figure 3 Upper back view in perspective of a cabinet without cover, showing the main components' position;
- Figure 6 Section view of Figure 5; Figure 7 - Detail view of section of Figure 6.
- the "CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES”, object of the present invention patent request, is made up of a design for a plastic cabinet which, from housings duly prepared, may receive a dissipating metallic board, as well electronic semi-conductive devices, whose thermal energy must be dissipated, avoiding also the use of screws or other fixation means, through simple fits and special conformations, both to the board and to said electronic components, upon the assembly stage.
- the cabinet (4) is equipped with fits (7), along the whose length of one of its side faces, said fits (7) with the proper format and with the function of housing the metallic dissipating board (1), which possesses big thermal conductivity, being smooth, not perforated and not prepared or worked, and, once introduced, locked along the fits, the cabinet (4) is closed.
- the board (1) operates, thus, as interface between the cabinet internal and external part
- the cabinet (4) starts to incorporate a vertical support equipped with upper wedge boss (5), arranged in parallel and in a studied distance in relation to the fixation point of the dissipating board (1).
- a vertical support equipped with upper wedge boss (5) arranged in parallel and in a studied distance in relation to the fixation point of the dissipating board (1).
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances, formed from a housing (7), specially developed along one of the faces (6) of the cabinet (4) for electric-electronic appliances to receive the introduction of a dissipating board (1) serving as interface between the cabinet internal and external part (4), forming a passage of thermal energy which shall conduct the heat inside out, so as to create an environment favorable to the working of the already housed electronic components, avoiding also the entrance of water, dust and other waste; and that, through a wedge boss (5) of one support incorporated vertically in the cabinet internal part (4), in a studied distance of the dissipating board (1), the semi- conductors (2) upon its introduction, shall be positioned on the printed circuit board (3) pressed, duly locked.
Description
"CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES"
The present descriptive reported refers to an invention patent request for a constructive disposition designed to cause the heat dissipation in housings, for example the cabinet kind, for electric-electronic appliances. TECHNIQUE STATUS
The heat generation problems due to the working of electric-electronic devices are known to the industry technicians, specially the devices which control high powers. Such devices are normally housed in plastic cabinets which, due to its own physical nature, are bad heat conductors, and accumulate internally the thermal energy produced by its components, such as, transistors, triacs, etc.
Such energy, accumulated internally in the cabinet, may prejudice the system working and even cause eventual semi-conductors' burn, which are specially sensitive to high temperatures.
In order to dissipate such internal energy, heat dissipating boards are usually utilized, made of aluminum, which are screwed to the semi-conductors' devices. Therefore, such conventional dissipators usually portray big physical dimensions, and are screwed or welded to the printed circuit boards so as to secure the semi-conductors in their position. INVENTION OBJECT
The invention now described has as main purposes to facilitate the heat dissipating board fixation to the cabinet, as well as to facilitate the fixation between the semi-conductors and said dissipating board, turning needless, therefore, the use of screws and similar items. The dissipated device here described shall further be integral part of the cabinet, saving
this way raw material for its manufacture and causing the transfer of internal heat outside the cabinet so as to maintain an environment which impedes the deterioration of the electronic components.
For such, the dissipator consists of an aluminum board or another metal of big thermal conductivity, smooth, not perforated and not prepared or worked, which shall be one of the cabinet faces.
Through a housing specially developed in the cabinet, the dissipator shall serve as interface between the cabinet internal and external part upon being pressed and introduced by fit, conducting heat inside out, forming a passage of thermal energy so as to create an internal environment which will favor the already housed electronic component performance.
Thanks to its smooth design, not perforated, and to its fixation and locking system, in addition to the already mentioned heat passage, such dissipated device shall avoid water and dust penetration to the cabinet interior.
Finally as another constructive novelty, a vertical support, incorporated in a studied distance from the dissipating board fixation point, through its wedge boss, shall press the semiconductors against said dissipating board upon its introduction into the the cabinet, firmly fixing such electric-electronic elements on the printed circuit board, avoiding, therefore, the use of screws or other means of fixation conventionally used in such assembly stage.
Described superficially the dissipator now is better detailed through the attached drawings where you can see:
Figure 1 - Upper back view in perspective of a closed cabinet of an electric-electronic appliance;
Figure 2 - Upper front view in perspective of a closed cabinet of an electric-electronic appliance control, outlining the dissipator position; Figure 3 - Upper back view in perspective of a cabinet without cover, showing the main
components' position;
Figure 4 - View in detail of the cabinet dissipator fit;
Figure 5 - View in detail of the semi-conductors' support to the dissipator;
Figure 6 - Section view of Figure 5; Figure 7 - Detail view of section of Figure 6.
According to the attached drawings , the "CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC-ELECTRONIC APPLIANCES", object of the present invention patent request, is made up of a design for a plastic cabinet which, from housings duly prepared, may receive a dissipating metallic board, as well electronic semi-conductive devices, whose thermal energy must be dissipated, avoiding also the use of screws or other fixation means, through simple fits and special conformations, both to the board and to said electronic components, upon the assembly stage.
For such, the cabinet (4) is equipped with fits (7), along the whose length of one of its side faces, said fits (7) with the proper format and with the function of housing the metallic dissipating board (1), which possesses big thermal conductivity, being smooth, not perforated and not prepared or worked, and, once introduced, locked along the fits, the cabinet (4) is closed.
The board (1) operates, thus, as interface between the cabinet internal and external part
(4), conducting heat inside out, forming a passage of thermal energy so as to create an internal environment which will favor the performance of the already housed electronic components, in addition to preventing the water, dust and other waste from passing to the cabinet internal part
(4).
Internally, the cabinet (4) starts to incorporate a vertical support equipped with upper wedge boss (5), arranged in parallel and in a studied distance in relation to the fixation point of the dissipating board (1). Such conformation allows that the semi-conductors (2), upon being
introduced into the cabinet (4), on the printed circuit board (3), thanks to the wedge boss (5) are firmly pressed, avoiding the use of screws or other means conventionally used for the fixation of such components (2).
Claims
1) "CONSTRUCTIVE DISPOSITION IN HOUSING FOR THE HEAT DISSIPATION SYSTEM AND COMPONENT INSTALLATION IN ELECTRIC- ELECTRONIC APPLIANCES", made up from a plastic cabinet (4) for housing electric- electronic components of several appliances, obtained from the mold design, characterized in that by forming along the whole length of one of its faces (6), side fits (7), and, in its internal part, is aligned in a studied distance in relation to said fits (7), the cabinet (4) incorporates a vertically designed support, with upper wedge boss (5).
2) "HEAT DISSIPATION SYSTEM IN ELECTRIC-ELECTRONIC APPLIANCES" according to claim 1, characterized by the introduction, by pressure, in the side fits (7) of the dissipating metallic board (1), forming interface between the cabinet internal and external part (4), forming a passage of thermal energy which conducts the heat inside out, so as to create an environment favorable to the working of the electronic components internally housed in the cabinet (4), in addition to preventing the water, dust and other waste from passing. 3) "COMPONENT INSTALLATION SYSTEM IN ELECTRIC-ELECTRONIC
APPLIANCES", according to claims 1 and 2, characterized by the studied distance between the wedge boss (5) of the support and the dissipating board (1), which causes proper pressure in the semi-conductors (2) during its introduction into the cabinet (4), pressing them from the boss (5) against the dissipating board (1), so as to position them (2) firmly on the printed circuit board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/BR2007/000129 WO2008144856A2 (en) | 2007-05-30 | 2007-05-30 | Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/BR2007/000129 WO2008144856A2 (en) | 2007-05-30 | 2007-05-30 | Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008144856A2 true WO2008144856A2 (en) | 2008-12-04 |
| WO2008144856A3 WO2008144856A3 (en) | 2009-04-02 |
Family
ID=40075562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/BR2007/000129 Ceased WO2008144856A2 (en) | 2007-05-30 | 2007-05-30 | Constructive disposition in housing for the heat dissipation system and component installation in electric-electronic appliances |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008144856A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104104223A (en) * | 2014-07-22 | 2014-10-15 | 四川升华电源科技有限公司 | DC-DC module power supply machine frame structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4707726A (en) * | 1985-04-29 | 1987-11-17 | United Technologies Automotive, Inc. | Heat sink mounting arrangement for a semiconductor |
| US5327324A (en) * | 1993-11-05 | 1994-07-05 | Ford Motor Company | Spring clip for a heat sink apparatus |
| US5592021A (en) * | 1995-04-26 | 1997-01-07 | Martin Marietta Corporation | Clamp for securing a power device to a heatsink |
| DE69812570T2 (en) * | 1997-12-24 | 2004-01-29 | Denso Corp | Device with circuit board and its assembly process |
| JP4165045B2 (en) * | 2000-09-19 | 2008-10-15 | 松下電器産業株式会社 | Electronics |
| US7190589B2 (en) * | 2004-10-19 | 2007-03-13 | Cinch Connectors, Inc. | Electronic control enclosure |
| US7336491B2 (en) * | 2005-09-06 | 2008-02-26 | Lear Corporation | Heat sink |
-
2007
- 2007-05-30 WO PCT/BR2007/000129 patent/WO2008144856A2/en not_active Ceased
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104104223A (en) * | 2014-07-22 | 2014-10-15 | 四川升华电源科技有限公司 | DC-DC module power supply machine frame structure |
| CN104104223B (en) * | 2014-07-22 | 2015-04-08 | 杨燕平 | DC-DC module power supply machine frame structure |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008144856A3 (en) | 2009-04-02 |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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