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WO2008142934A1 - Apparatus and method for attaching sheet - Google Patents

Apparatus and method for attaching sheet Download PDF

Info

Publication number
WO2008142934A1
WO2008142934A1 PCT/JP2008/057666 JP2008057666W WO2008142934A1 WO 2008142934 A1 WO2008142934 A1 WO 2008142934A1 JP 2008057666 W JP2008057666 W JP 2008057666W WO 2008142934 A1 WO2008142934 A1 WO 2008142934A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
sealing resin
resin sheet
original
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057666
Other languages
French (fr)
Japanese (ja)
Inventor
Kan Nakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of WO2008142934A1 publication Critical patent/WO2008142934A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

A material (W) to which a sealing resin sheet (S) is to be attached has a semiconductor chip (W2) on a lead frame (W1). A strip-like original sheet (R) has the sealing resin sheet (S) temporarily attached on a base material sheet (BS). A sheet attaching apparatus (10) attaches the sealing resin sheet (S) to the material (W) by feeding the original sheet (R) onto the material (W). The apparatus (10) is provided with an original sheet supplying means (11) for supplying the original sheet (R); an attaching means (12) which includes depressurization chambers (C1, C2) for forming depressurized atmosphere; a peeling means (14) for peeling the base material sheet (BS) from the sealing resin sheet (S) attached to the material (W); a cutting means (15) for cutting the sealing resin sheet (S) in accordance with the dimensions of the lead frame (W1); and a take-up means (16) for taking up the sealing resin sheet (S) protruding from the outer circumference of the material as an unnecessary sealing resin sheet (S1).
PCT/JP2008/057666 2007-05-15 2008-04-21 Apparatus and method for attaching sheet Ceased WO2008142934A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-128840 2007-05-15
JP2007128840A JP5242947B2 (en) 2007-05-15 2007-05-15 Sheet sticking device and sticking method

Publications (1)

Publication Number Publication Date
WO2008142934A1 true WO2008142934A1 (en) 2008-11-27

Family

ID=40031650

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057666 Ceased WO2008142934A1 (en) 2007-05-15 2008-04-21 Apparatus and method for attaching sheet

Country Status (2)

Country Link
JP (1) JP5242947B2 (en)
WO (1) WO2008142934A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012076262A1 (en) * 2010-12-10 2012-06-14 Tesa Se Adhesive compound and method for encapsulating an electronic arrangement
WO2014148119A1 (en) * 2013-03-18 2014-09-25 日東電工株式会社 Adhering apparatus and method for manufacturing electronic apparatus
WO2015087763A1 (en) * 2013-12-09 2015-06-18 日東電工株式会社 Sealing sheet adhesion method
WO2015087762A1 (en) * 2013-12-09 2015-06-18 日東電工株式会社 Sealing sheet adhesion method
CN113471085A (en) * 2020-03-30 2021-10-01 日东电工株式会社 Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product
JP2021163960A (en) * 2020-03-30 2021-10-11 日東電工株式会社 Device sealing method, device sealing device, and manufacturing method of semiconductor products
JP2021163959A (en) * 2020-03-30 2021-10-11 日東電工株式会社 Device sealing method, device sealing device, and manufacturing method of semiconductor products

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014168027A (en) * 2013-01-29 2014-09-11 Nitto Denko Corp Manufacturing method and manufacturing apparatus of semiconductor device
JP2014168028A (en) * 2013-01-29 2014-09-11 Nitto Denko Corp Manufacturing method and manufacturing apparatus of semiconductor device
JP2014215278A (en) * 2013-04-30 2014-11-17 日東電工株式会社 Sealing sheet application method
JP7451028B2 (en) * 2019-12-27 2024-03-18 株式会社ディスコ How to place the protective sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093963A (en) * 2003-09-22 2005-04-07 Casio Comput Co Ltd Sealing film forming method and apparatus
WO2005117093A1 (en) * 2004-05-27 2005-12-08 Lintec Corporation Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
WO2007018041A1 (en) * 2005-08-11 2007-02-15 Lintec Corporation Sheet application device and application method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005093963A (en) * 2003-09-22 2005-04-07 Casio Comput Co Ltd Sealing film forming method and apparatus
WO2005117093A1 (en) * 2004-05-27 2005-12-08 Lintec Corporation Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same
WO2007018041A1 (en) * 2005-08-11 2007-02-15 Lintec Corporation Sheet application device and application method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012076262A1 (en) * 2010-12-10 2012-06-14 Tesa Se Adhesive compound and method for encapsulating an electronic arrangement
US9230829B2 (en) 2010-12-10 2016-01-05 Tesa Se Adhesive compound and method for encapsulating an electronic arrangement
WO2014148119A1 (en) * 2013-03-18 2014-09-25 日東電工株式会社 Adhering apparatus and method for manufacturing electronic apparatus
WO2015087763A1 (en) * 2013-12-09 2015-06-18 日東電工株式会社 Sealing sheet adhesion method
WO2015087762A1 (en) * 2013-12-09 2015-06-18 日東電工株式会社 Sealing sheet adhesion method
CN113471085A (en) * 2020-03-30 2021-10-01 日东电工株式会社 Device sealing method, device sealing apparatus, and method of manufacturing semiconductor product
JP2021163960A (en) * 2020-03-30 2021-10-11 日東電工株式会社 Device sealing method, device sealing device, and manufacturing method of semiconductor products
JP2021163959A (en) * 2020-03-30 2021-10-11 日東電工株式会社 Device sealing method, device sealing device, and manufacturing method of semiconductor products
CN113517206A (en) * 2020-03-30 2021-10-19 日东电工株式会社 Device sealing method, device sealing apparatus, and manufacturing method of semiconductor product
JP7658748B2 (en) 2020-03-30 2025-04-08 日東電工株式会社 Device sealing method, device sealing apparatus, and manufacturing method of semiconductor product
JP7658747B2 (en) 2020-03-30 2025-04-08 日東電工株式会社 Device sealing method, device sealing apparatus, and manufacturing method of semiconductor product

Also Published As

Publication number Publication date
JP2008288238A (en) 2008-11-27
JP5242947B2 (en) 2013-07-24

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